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Extract from the Register of European Patents

EP About this file: EP2332171

EP2332171 - PROCESS FOR FABRICATING A SEMICONDUCTOR STRUCTURE WITH A BURIED GROUND PLANE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  07.05.2021
Database last updated on 26.06.2024
FormerThe patent has been granted
Status updated on  29.05.2020
FormerGrant of patent is intended
Status updated on  27.05.2020
FormerExamination is in progress
Status updated on  09.05.2020
FormerGrant of patent is intended
Status updated on  02.01.2020
FormerExamination is in progress
Status updated on  29.04.2019
Most recent event   Tooltip08.07.2022Lapse of the patent in a contracting state
New state(s): MK		published on 10.08.2022  [2022/32]
Applicant(s)For all designated states
Commissariat à l'Énergie Atomique et aux Énergies Alternatives
Bâtiment "Le Ponant D" 25, rue Leblanc
75015 Paris / FR
[2011/24]
Former [2011/24]For all designated states
Commissariat à l'énergie atomique et aux énergies alternatives
Bâtiment "Le Ponant D" 25, rue Leblanc
75015 Paris / FR
Inventor(s)01 / LE TIEC, Yannick
70 chemin des trois Marie
F-38920 Crolles / FR
02 / ANDRIEU, François
4 rue Jean Macé
F-38000 Grenoble / FR
 [2011/24]
Representative(s)Ilgart, Jean-Christophe, et al
BREVALEX
95, Rue d'Amsterdam
75378 Paris Cedex 8 / FR
[N/P]
Former [2020/27]Ilgart, Jean-Christophe, et al
BREVALEX
95, rue d'Amsterdam
75378 Paris Cedex 8 / FR
Former [2011/24]Ilgart, Jean-Christophe, et al
BREVALEX 95 rue d'Amsterdam
75378 Paris Cedex 8 / FR
Application number, filing date09806435.513.08.2009
[2011/24]
WO2009EP60474
Priority number, dateFR2008005558714.08.2008         Original published format: FR 0855587
[2011/24]
Filing languageFR
Procedural languageFR
PublicationType: A1 Application with search report
No.:WO2010018204
Date:18.02.2010
Language:FR
[2010/07]
Type: A1 Application with search report 
No.:EP2332171
Date:15.06.2011
Language:FR
The application published by WIPO in one of the EPO official languages on 18.02.2010 takes the place of the publication of the European patent application.
[2011/24]
Type: B1 Patent specification 
No.:EP2332171
Date:01.07.2020
Language:FR
[2020/27]
Search report(s)International search report - published on:EP18.02.2010
ClassificationIPC:H01L21/762
[2011/24]
CPC:
H01L21/76254 (EP,US); H01L29/1608 (US)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   SM,   TR [2020/27]
Former [2011/24]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  SE,  SI,  SK,  SM,  TR 
TitleGerman:VERFAHREN ZUR HERSTELLUNG EINER HALBLEITERSTRUKTUR MIT VERGRABENER BODENEBENE[2011/24]
English:PROCESS FOR FABRICATING A SEMICONDUCTOR STRUCTURE WITH A BURIED GROUND PLANE[2011/24]
French:PROCEDE DE FABRICATION D'UNE STRUCTURE SEMI-CONDUCTRICE PLAN DE MASSE ENTERRE[2011/24]
Entry into regional phase11.02.2011National basic fee paid 
11.02.2011Designation fee(s) paid 
11.02.2011Examination fee paid 
Examination procedure14.12.2009Request for preliminary examination filed
International Preliminary Examining Authority: EP
11.02.2011Amendment by applicant (claims and/or description)
11.02.2011Examination requested  [2011/24]
13.09.2011Despatch of a communication from the examining division (Time limit: M06)
16.02.2012Reply to a communication from the examining division
03.05.2019Despatch of a communication from the examining division (Time limit: M06)
21.10.2019Reply to a communication from the examining division
03.01.2020Communication of intention to grant the patent
05.05.2020Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
05.05.2020Fee for grant paid
05.05.2020Fee for publishing/printing paid
27.05.2020Information about intention to grant a patent
27.05.2020Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  13.09.2011
Opposition(s)06.04.2021No opposition filed within time limit [2021/23]
Fees paidRenewal fee
24.08.2011Renewal fee patent year 03
19.07.2012Renewal fee patent year 04
22.07.2013Renewal fee patent year 05
25.07.2014Renewal fee patent year 06
24.07.2015Renewal fee patent year 07
25.07.2016Renewal fee patent year 08
29.07.2017Renewal fee patent year 09
30.07.2018Renewal fee patent year 10
26.07.2019Renewal fee patent year 11
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU13.08.2009
AT01.07.2020
CY01.07.2020
CZ01.07.2020
DK01.07.2020
EE01.07.2020
ES01.07.2020
FI01.07.2020
HR01.07.2020
IT01.07.2020
LT01.07.2020
LV01.07.2020
MC01.07.2020
MK01.07.2020
MT01.07.2020
NL01.07.2020
PL01.07.2020
RO01.07.2020
SE01.07.2020
SI01.07.2020
SK01.07.2020
SM01.07.2020
TR01.07.2020
IE13.08.2020
LU13.08.2020
BE31.08.2020
CH31.08.2020
LI31.08.2020
BG01.10.2020
NO01.10.2020
GR02.10.2020
IS01.11.2020
PT02.11.2020
[2022/32]
Former [2022/27]HU13.08.2009
AT01.07.2020
CY01.07.2020
CZ01.07.2020
DK01.07.2020
EE01.07.2020
ES01.07.2020
FI01.07.2020
HR01.07.2020
IT01.07.2020
LT01.07.2020
LV01.07.2020
MC01.07.2020
MT01.07.2020
NL01.07.2020
PL01.07.2020
RO01.07.2020
SE01.07.2020
SI01.07.2020
SK01.07.2020
SM01.07.2020
TR01.07.2020
IE13.08.2020
LU13.08.2020
BE31.08.2020
CH31.08.2020
LI31.08.2020
BG01.10.2020
NO01.10.2020
GR02.10.2020
IS01.11.2020
PT02.11.2020
Former [2022/26]AT01.07.2020
CZ01.07.2020
DK01.07.2020
EE01.07.2020
ES01.07.2020
FI01.07.2020
HR01.07.2020
IT01.07.2020
LT01.07.2020
LV01.07.2020
MC01.07.2020
NL01.07.2020
PL01.07.2020
RO01.07.2020
SE01.07.2020
SI01.07.2020
SK01.07.2020
SM01.07.2020
TR01.07.2020
IE13.08.2020
LU13.08.2020
BE31.08.2020
CH31.08.2020
LI31.08.2020
BG01.10.2020
NO01.10.2020
GR02.10.2020
IS01.11.2020
PT02.11.2020
Former [2021/37]AT01.07.2020
CZ01.07.2020
DK01.07.2020
EE01.07.2020
ES01.07.2020
FI01.07.2020
HR01.07.2020
IT01.07.2020
LT01.07.2020
LV01.07.2020
MC01.07.2020
NL01.07.2020
PL01.07.2020
RO01.07.2020
SE01.07.2020
SI01.07.2020
SK01.07.2020
SM01.07.2020
IE13.08.2020
LU13.08.2020
BE31.08.2020
CH31.08.2020
LI31.08.2020
BG01.10.2020
NO01.10.2020
GR02.10.2020
IS01.11.2020
PT02.11.2020
Former [2021/36]AT01.07.2020
CZ01.07.2020
DK01.07.2020
EE01.07.2020
ES01.07.2020
FI01.07.2020
HR01.07.2020
IT01.07.2020
LT01.07.2020
LV01.07.2020
MC01.07.2020
NL01.07.2020
PL01.07.2020
RO01.07.2020
SE01.07.2020
SI01.07.2020
SK01.07.2020
SM01.07.2020
LU13.08.2020
BE31.08.2020
CH31.08.2020
LI31.08.2020
BG01.10.2020
NO01.10.2020
GR02.10.2020
IS01.11.2020
PT02.11.2020
Former [2021/28]AT01.07.2020
CZ01.07.2020
DK01.07.2020
EE01.07.2020
ES01.07.2020
FI01.07.2020
HR01.07.2020
IT01.07.2020
LT01.07.2020
LV01.07.2020
MC01.07.2020
NL01.07.2020
PL01.07.2020
RO01.07.2020
SE01.07.2020
SK01.07.2020
SM01.07.2020
LU13.08.2020
CH31.08.2020
LI31.08.2020
BG01.10.2020
NO01.10.2020
GR02.10.2020
IS01.11.2020
PT02.11.2020
Former [2021/23]AT01.07.2020
CZ01.07.2020
DK01.07.2020
EE01.07.2020
ES01.07.2020
FI01.07.2020
HR01.07.2020
IT01.07.2020
LT01.07.2020
LV01.07.2020
MC01.07.2020
NL01.07.2020
PL01.07.2020
RO01.07.2020
SE01.07.2020
SM01.07.2020
LU13.08.2020
CH31.08.2020
LI31.08.2020
BG01.10.2020
NO01.10.2020
GR02.10.2020
IS01.11.2020
PT02.11.2020
Former [2021/22]AT01.07.2020
CZ01.07.2020
DK01.07.2020
EE01.07.2020
ES01.07.2020
FI01.07.2020
HR01.07.2020
IT01.07.2020
LT01.07.2020
LV01.07.2020
MC01.07.2020
NL01.07.2020
PL01.07.2020
RO01.07.2020
SE01.07.2020
LU13.08.2020
CH31.08.2020
LI31.08.2020
BG01.10.2020
NO01.10.2020
GR02.10.2020
IS01.11.2020
PT02.11.2020
Former [2021/20]AT01.07.2020
CZ01.07.2020
DK01.07.2020
ES01.07.2020
FI01.07.2020
HR01.07.2020
IT01.07.2020
LT01.07.2020
LV01.07.2020
MC01.07.2020
NL01.07.2020
PL01.07.2020
SE01.07.2020
LU13.08.2020
CH31.08.2020
LI31.08.2020
BG01.10.2020
NO01.10.2020
GR02.10.2020
IS01.11.2020
PT02.11.2020
Former [2021/18]AT01.07.2020
CZ01.07.2020
ES01.07.2020
FI01.07.2020
HR01.07.2020
LT01.07.2020
LV01.07.2020
MC01.07.2020
NL01.07.2020
PL01.07.2020
SE01.07.2020
BG01.10.2020
NO01.10.2020
GR02.10.2020
IS01.11.2020
PT02.11.2020
Former [2021/17]AT01.07.2020
CZ01.07.2020
ES01.07.2020
FI01.07.2020
HR01.07.2020
LT01.07.2020
LV01.07.2020
NL01.07.2020
PL01.07.2020
SE01.07.2020
BG01.10.2020
NO01.10.2020
GR02.10.2020
IS01.11.2020
PT02.11.2020
Former [2021/11]AT01.07.2020
CZ01.07.2020
ES01.07.2020
FI01.07.2020
HR01.07.2020
LT01.07.2020
LV01.07.2020
PL01.07.2020
SE01.07.2020
BG01.10.2020
NO01.10.2020
GR02.10.2020
IS01.11.2020
PT02.11.2020
Former [2021/09]AT01.07.2020
CZ01.07.2020
ES01.07.2020
FI01.07.2020
LT01.07.2020
SE01.07.2020
BG01.10.2020
NO01.10.2020
GR02.10.2020
PT02.11.2020
Former [2021/08]ES01.07.2020
FI01.07.2020
LT01.07.2020
SE01.07.2020
BG01.10.2020
NO01.10.2020
PT02.11.2020
Former [2021/07]FI01.07.2020
LT01.07.2020
BG01.10.2020
NO01.10.2020
Former [2021/01]BG01.10.2020
Cited inInternational search[X]US6323108  (KUB FRANCIS J [US], et al) [X] 1,17 * column 5, line 11 - column 7, line 10; figures 1a-1c *;
 [A]WO03103026  (LEE TIEN-HSI [US]) [A] 1-19 * page 8, line 5 - page 11, line 29; figures 3,5-9 *;
 [A]US2006019465  (GUIDRY CLEAVELIN CLOVES R [US]) [A] 2,3* page 1, paragraph 12; figure 3 *;
 [X]FR2898430  (SOITEC SILICON ON INSULATOR [FR]) [X] 1,4,6-10,13-19 * page 10, line 4 - page 12, line 22; figures 4a-4i *;
 [A]US2008153313  (KONONCHUK OLEG [FR]) [A] 2,3 * page 3, paragraph 38 - paragraph 40 *
ExaminationJPH11111839
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.