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EP About this file: EP2357661

EP2357661 - EPITAXIAL SUBSTRATE FOR ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF [Right-click to bookmark this link]
Status	The application has been refused Status updated on 06.03.2015 Database last updated on 12.07.2024
Most recent event Tooltip	06.03.2015	Refusal of application	published on 08.04.2015 [2015/15]
Applicant(s)	For all designated states DOWA Electronics Materials Co., Ltd. 4-14-1, Soto-Kanda Chiyoda-ku Tokyo 101-0021 / JP
	[2011/33]
Inventor(s)	01 / IKUTA, Tetsuya c/o DOWA Electronics Materials Co. Ltd. 4-14-1 Sotokanda Chiyoda-ku Tokyo 101-0021 / JP
	02 / SHIMIZU, Jo c/o DOWA Electronics Materials Co. Ltd. 4-14-1 Sotokanda Chiyoda-ku Tokyo 101-0021 / JP
	03 / SHIBATA, Tomohiko c/o DOWA Electronics Materials Co. Ltd. 4-14-1 Sotokanda Chiyoda-ku Tokyo 101-0021 / JP
	[2011/33]
Representative(s)	Müller-Boré & Partner Patentanwälte PartG mbB Friedenheimer Brücke 21 80639 München / DE
	[N/P]
Former [2014/11]	Müller-Boré & Partner Patentanwälte PartG mbB Friedenheimer Brücke 21 80639 München / DE
Former [2011/33]	Perrey, Ralf Müller-Boré & Partner Grafinger Strasse 2 D-81671 München / DE
Application number, filing date	09829111.5	18.11.2009
	[2011/33]
	WO2009JP69896
Priority number, date	JP20080302620	27.11.2008 Original published format: JP 2008302620
	JP20090260014	13.11.2009 Original published format: JP 2009260014
	[2011/33]
Filing language	JA
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	WO2010061865
	Date:	03.06.2010
	Language:	JA
	[2010/22]
	Type:	A1 Application with search report
	No.:	EP2357661
	Date:	17.08.2011
	Language:	EN
	[2011/33]
Search report(s)	International search report - published on:	JP	03.06.2010
	(Supplementary) European search report - dispatched on:	EP	19.09.2012
Classification	IPC:	H01L21/20, H01L21/205, H01L21/338, H01L29/778, H01L29/812, H01L29/737, H01L21/02, H01L29/66	[2012/42]
	CPC:	H01L21/0254 (EP,KR,US); H01L21/02381 (EP,KR,US); H01L21/02458 (EP,US); H01L21/02505 (EP,US); H01L21/02507 (EP,KR,US); H01L29/66462 (EP,KR,US); (+) H01L29/7378 (EP,US); H01L29/2003 (EP,US) (-)
	Former IPC [2011/33]	H01L21/20, H01L21/205, H01L21/338, H01L29/778, H01L29/812
Designated contracting states	AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR [2011/33]
Title	German:	EPITAKTISCHES SUBSTRAT FÜR EINE ELEKTRONISCHE VORRICHTUNG UND HERSTELLUNGSVERFAHREN DAFÜR	[2011/33]
	English:	EPITAXIAL SUBSTRATE FOR ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF	[2011/33]
	French:	SUBSTRAT ÉPITAXIAL POUR DISPOSITIF ÉLECTRONIQUE ET SON PROCÉDÉ DE FABRICATION	[2011/33]
Entry into regional phase	27.05.2011	Translation filed
	01.06.2011	National basic fee paid
	01.06.2011	Search fee paid
	01.06.2011	Designation fee(s) paid
	01.06.2011	Examination fee paid
Examination procedure	01.06.2011	Examination requested [2011/33]
	19.03.2013	Amendment by applicant (claims and/or description)
	23.04.2013	Despatch of a communication from the examining division (Time limit: M04)
	20.08.2013	Reply to a communication from the examining division
	10.10.2013	Despatch of a communication from the examining division (Time limit: M02)
	10.12.2013	Reply to a communication from the examining division
	27.06.2014	Cancellation of oral proceeding that was planned for 01.07.2014
	01.07.2014	Date of oral proceedings (cancelled)
	19.09.2014	Application refused, date of legal effect [2015/15]
	19.09.2014	Date of oral proceedings
	07.11.2014	Minutes of oral proceedings despatched
	13.11.2014	Despatch of communication that the application is refused, reason: substantive examination [2015/15]
Divisional application(s)	EP13001425.1 / EP2613341
	The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 23.04.2013
Fees paid	Renewal fee
	29.11.2011	Renewal fee patent year 03
	28.11.2012	Renewal fee patent year 04
	28.11.2013	Renewal fee patent year 05
	Penalty fee
	Additional fee for renewal fee
	30.11.2014	06 M06 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[XA]US2005118752 (OTSUKA KOJI [JP], et al) [X] 1,4-9 * paragraph [0026] - paragraph [0053] * * paragraph [0111] - paragraph [0113] * * figures 1, 11 * [A] 2,3;
		[XA]US2007210329 (GOTO HIROKAZU [JP]) [X] 1,4-9 * paragraph [0025] - paragraph [0059] * * figures 1, 3 * [A] 2,3;
		[A]US2008203382 (YANAGIHARA MASATAKA [JP]) [A] 1-9 * paragraph [0034] - paragraph [0122] * * figures 4, 6 *;
		[A] - TOMOYA SUGAHARA ET AL, "Role of AlN/GaN Multilayer in Crack-Free GaN Layer Growth on 5"[phi] Si (111) Substrate", JAPANESE JOURNAL OF APPLIED PHYSICS, (20041201), vol. 43, No. 12B, doi:10.1143/JJAP.43.L1595, ISSN 0021-4922, pages 1595 - 1597, XP055037579 [A] 1-9 * the whole document * DOI: http://dx.doi.org/10.1143/JJAP.43.L1595
	International search	[A]JP2005159207 (SANKEN ELECTRIC CO LTD);
		[A]JP2005158846 (SANKEN ELECTRIC CO LTD);
		[A]JP2007273814 (FURUKAWA ELECTRIC CO LTD);
		[A]JP2008251704 (FURUKAWA ELECTRIC CO LTD)
	Examination	- SEMI MF1451-92, 3081 ZANKER ROAD, SAN JOSE, CA 95134, USA, (2003), pages 1 - 15, XP040450901
		- SEMI MF534-0707, 3081 ZANKER ROAD, SAN JOSE, CA 95134, USA, (2007), pages 1 - 5, XP040459992
		- NATSU W ET AL, "Effects of support method and mechanical property of 300mm silicon wafer on sori measurement", PRECISION ENGINEERING, ELSEVIER, AMSTERDAM, NL, vol. 29, no. 1, ISSN 0141-6359, (20050101), pages 19 - 26, (20050101), XP027766645
		- SEMI M1-0302, 3081 ZANKER ROAD, SAN JOSE, CA 95134, USA, (2002), pages 1 - 27, XP040448387
	by applicant	JPH06112120
		JP2003059948
		JP2008522447

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