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Extract from the Register of European Patents

EP About this file: EP2359173

EP2359173 - WAFER LEVEL OPTOELECTRONIC PACKAGE WITH FIBER SIDE INSERTION [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  06.09.2013
Database last updated on 03.10.2024
Most recent event   Tooltip06.09.2013Application deemed to be withdrawnpublished on 09.10.2013  [2013/41]
Applicant(s)For all designated states
National Semiconductor Corporation
2900 Semiconductor Drive
Santa Clara, California 95051 / US
[2011/34]
Inventor(s)01 / DARBINYAN, Artur
3604 Flora Vista Avenue 317
Santa Clara, CA 95051 / US
02 / NGUYEN, Luu
3425 Pin Oak Court
San Jose, CA 95148 / US
03 / PODDAR, Anindya
1011 Havre Court
Sunnyvale, CA 94087 / US
 [2011/34]
Representative(s)Liesegang, Eva
Boehmert & Boehmert
Anwaltspartnerschaft mbB
Pettenkoferstrasse 22
80336 München / DE
[N/P]
Former [2011/34]Liesegang, Eva
Forrester & Boehmert Pettenkoferstrasse 20-22
80336 München / DE
Application number, filing date09836560.411.09.2009
[2011/34]
WO2009US56693
Priority number, dateUS2008033753317.12.2008         Original published format: US 337533
[2011/34]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2010077394
Date:08.07.2010
Language:EN
[2010/27]
Type: A1 Application with search report 
No.:EP2359173
Date:24.08.2011
Language:EN
The application published by WIPO in one of the EPO official languages on 08.07.2010 takes the place of the publication of the European patent application.
[2011/34]
Search report(s)International search report - published on:KR08.07.2010
(Supplementary) European search report - dispatched on:EP05.09.2012
ClassificationIPC:G02B6/12, G02B6/42
[2011/34]
CPC:
G02B6/4214 (EP,US); G02B6/4232 (EP,US)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   SM,   TR [2011/34]
TitleGerman:OPTOELEKTRONISCHES WAFER-PAKET MIT FASERSEITENEINSATZ[2011/34]
English:WAFER LEVEL OPTOELECTRONIC PACKAGE WITH FIBER SIDE INSERTION[2011/34]
French:BOÎTIER OPTOÉLECTRONIQUE NIVEAU TRANCHE À INSERTION LATÉRALE DE FIBRES[2011/34]
Entry into regional phase09.05.2011National basic fee paid 
09.05.2011Search fee paid 
09.05.2011Designation fee(s) paid 
09.05.2011Examination fee paid 
Examination procedure09.05.2011Amendment by applicant (claims and/or description)
09.05.2011Examination requested  [2011/34]
05.04.2013Application deemed to be withdrawn, date of legal effect  [2013/41]
22.05.2013Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2013/41]
Fees paidRenewal fee
26.09.2011Renewal fee patent year 03
22.11.2012Renewal fee patent year 04
Penalty fee
Additional fee for renewal fee
30.09.201204   M06   Fee paid on   22.11.2012
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[Y]JP2004037703  (JAPAN AVIATION ELECTRON) [Y] 1-19 * abstract * * paragraph [0009]; figure - *;
 [Y]US2006104576  (NAGASAKA KIMIO [JP]) [Y] 1-19 * paragraphs [0007] - [0059]; figures 3,4 *;
 [A]US2004251524  (SNYDER TANYA JEGERIS [US], et al) [A] 11,17,18 * abstract * * paragraphs [0003] , [0017] , [0019] *
International search[X]US4945400  (BLONDER GREG E [US], et al);
 [X]US7306378  (ALDUINO ANDREW C [US], et al);
 [A]US5369529  (KUO SHUN-MEEN [US], et al)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.