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Extract from the Register of European Patents

EP About this file: EP2363373

EP2363373 - Bonding process for sensitive micro-and nano-systems [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  03.08.2012
Database last updated on 19.10.2024
Most recent event   Tooltip03.08.2012Application deemed to be withdrawnpublished on 05.09.2012  [2012/36]
Applicant(s)For all designated states
SensoNor Technologies AS
Knudssrodveien 7 PO Box 196
3192 Horten / NO
[2011/36]
Inventor(s)01 / Elfving, Anders
/ Knudssrodveien 7 PO Box 196
N-3192, Horten / NO
02 / Hoivik, Nils
Knudssrodveien 7
PO Box 196
N-3192, Horten / NO
03 / Stark, Birger
/ Knudssrodveien 7 PO Box 196
N-3192, Horten / NO
04 / Wang, Kaiying
Knudssrodveien 7
PO Box 196
N-3192, Horten / NO
 [2011/36]
Representative(s)Haley, Stephen
Gill Jennings & Every LLP The Broadgate Tower
20 Primrose Street
London EC2A 2ES / GB
[N/P]
Former [2011/36]Haley, Stephen
Gill Jennings & Every LLP The Broadgate Tower 20 Primrose Street
London EC2A 2ES / GB
Application number, filing date10155251.102.03.2010
[2011/36]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP2363373
Date:07.09.2011
Language:EN
[2011/36]
Search report(s)(Supplementary) European search report - dispatched on:EP05.08.2010
ClassificationIPC:B81C1/00
[2011/36]
CPC:
B81C1/00269 (EP,US); H01L21/50 (EP,US); H01L23/10 (EP,US);
H01L24/83 (EP,US); H01L25/0657 (EP,US); H01L25/50 (EP,US);
B81C2203/0118 (EP,US); B81C2203/035 (EP,US); H01L2224/27462 (EP,US);
H01L2224/27464 (EP,US); H01L2224/276 (EP,US); H01L2224/29011 (EP,US);
H01L2224/29082 (EP,US); H01L2224/29111 (EP,US); H01L2224/29139 (EP,US);
H01L2224/29147 (EP,US); H01L2224/29155 (EP,US); H01L2224/32145 (EP,US);
H01L2224/83007 (EP,US); H01L2224/83193 (EP,US); H01L2224/83204 (EP,US);
H01L2224/83207 (EP,US); H01L2224/8381 (EP,US); H01L2224/83825 (EP,US);
H01L2224/8383 (EP,US); H01L2224/94 (EP,US); H01L2225/06513 (EP,US);
H01L24/94 (EP,US); H01L2924/00013 (EP,US); H01L2924/01006 (EP,US);
H01L2924/01023 (EP,US); H01L2924/01029 (EP,US); H01L2924/01032 (EP,US);
H01L2924/01033 (EP,US); H01L2924/01047 (EP,US); H01L2924/0105 (EP,US);
H01L2924/01075 (EP,US); H01L2924/01082 (EP,US); H01L2924/0132 (EP,US);
H01L2924/01327 (EP,US); H01L2924/014 (EP,US); H01L2924/1461 (EP,US);
H01L2924/16235 (EP,US); H01L2924/164 (EP,US); Y10T428/12493 (EP,US) (-)
C-Set:
H01L2224/29111, H01L2924/00014 (US,EP);
H01L2224/29111, H01L2924/01029 (EP,US);
H01L2224/29139, H01L2924/00014 (US,EP);
H01L2224/29147, H01L2924/00014 (US,EP);
H01L2224/29155, H01L2924/00014 (US,EP);
H01L2224/94, H01L2224/81, H01L2924/0105 (US,EP);
H01L2224/94, H01L2224/83 (US,EP);
H01L2924/00013, H01L2224/05099, H01L2924/0105 (US,EP);
H01L2924/00013, H01L2224/05599 (EP,US);
H01L2924/00013, H01L2224/13099, H01L2924/0105 (US,EP);
H01L2924/00013, H01L2224/13599 (EP,US);
H01L2924/00013, H01L2224/29099 (US,EP);
H01L2924/00013, H01L2224/29599 (US,EP);
H01L2924/0132, H01L2924/01029, H01L2924/0105 (US,EP);
H01L2924/1461, H01L2924/00 (US,EP)
(-)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   SM,   TR [2011/36]
Extension statesALNot yet paid
BANot yet paid
MENot yet paid
RSNot yet paid
TitleGerman:Procédé de collage pour systèmes micro et nano sensibles[2011/36]
English:Bonding process for sensitive micro-and nano-systems[2011/36]
French:Bindungsverfahren für empfindliche Mikro- und Nanosysteme[2011/36]
Examination procedure08.03.2012Application deemed to be withdrawn, date of legal effect  [2012/36]
23.04.2012Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time  [2012/36]
Fees paidPenalty fee
Additional fee for renewal fee
31.03.201203   M06   Not yet paid
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XA]EP0365807  (IBM [US]) [X] 1,2,6,7 * abstract * * column 3, line 48 - column 4, line 45 * * figure 1b * [A] 3-5;
 [XA]DE19531158  (DAIMLER BENZ AG [DE]) [X] 7 * page 9, line 48 - page 10, line 9 * * figure 5 * [A] 1-6,8;
 [A]WO2004016384  (NEW TRANSDUCERS LTD [GB], et al) [A] 1-8 * abstract * * page 12, lines 13-27 * * page 14, line 27 - page 15, line 3 * * page 16, line 9 - page 17, line 8 ** figure 1 *;
 [XI]US2006292824  (BEYNE ERIC [BE], et al) [X] 1-3,6-8 * abstract * * page 3, paragraphs 48,54 * * page 4, paragraphs 60,61,65 * * page 5, paragraphs 75,80 * * page 5, paragraph 77 - page 6, paragraph 86 * * figures 3,5 * [I] 4,5;
 [XA]  - YIBO RONG ET AL, "Low temperature Cu-Sn bonding by isothermal solidification technology", ELECTRONIC PACKAGING TECHNOLOGY&HIGH DENSITY PACKAGING, 2009. ICEPT-HDP '09. INTERNATIONAL CONFERENCE ON, IEEE, PISCATAWAY, NJ, USA, (20090810), ISBN 978-1-4244-4658-2, pages 96 - 98, XP031533513 [X] 1-3,6-8 * abstract * * page 96, column r, paragraph 1 * * page 97, column r, paragraphs 2-4 * * figure 2 * [A] 4,5
 [XA]  - DAOQIANG DANIEL LU ET AL, "Forming High Temperature Solder Interfaces by Low Temperature Fluxless Processing", HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION, 2007 INTERNATIONAL SYMPOSIUM ON, IEEE, PI, (20070601), ISBN 978-1-4244-1252-5, pages 1 - 5, XP031122931 [X] 7,8 * page 2, column l, paragraph 1 - page 2, column r, paragraph 2 * [A] 1-6
 [A]  - LI LI ET AL, "Cu/Sn Isothermal Solidification Technology for Hermetic Packaging of MEMS", NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS, 2006. NEMS '06. 1ST IEEE INTERNATIONAL CONFERENCE ON, IEEE, PI LNKD- DOI:10.1109/NEMS.2006.334665, (20060101), ISBN 978-1-4244-0139-0, pages 1133 - 1137, XP031064042 [A] 1-8 * page 1133, column r, paragraph 4 - page 1134, column r, paragraph 2 * * figure 2 *

DOI:   http://dx.doi.org/10.1109/NEMS.2006.334665
 [A]  - KNUT E AASMUNDTVEIT ET AL, "Au-Sn SLID bonding: Fluxless bonding with high temperature stability to above 350 Â DEG c", MICROELECTRONICS AND PACKAGING CONFERENCE, 2009. EMPC 2009. EUROPEAN, IEEE, PISCATAWAY, NJ, USA, (20090615), ISBN 978-1-4244-4722-0, pages 1 - 6, XP031534308 [A] 1-8 * page 2, column r, paragraph 4 - page 3, column r, paragraph 2 * * figure 4 *
by applicantUS6872464
 US7132721
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.