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EP2242091
European procedure
Extract from the Register of European Patents
EP About this file: EP2242091
| EP2242091 - Polishing solution for metal and polishing method [Right-click to bookmark this link] | |||
| Former [2010/42] | Polishing solution for metal and polishing method | ||
| [2013/03] | Status | No opposition filed within time limit Status updated on 06.06.2014 Database last updated on 06.07.2024 | Most recent event Tooltip | 18.07.2014 | Lapse of the patent in a contracting state New state(s): GB | published on 20.08.2014 [2014/34] | Applicant(s) | For all designated states Hitachi Chemical Company, Ltd. 9-2, Marunouchi 1-chome Chiyoda-ku Tokyo 100-6606 / JP | For all designated states Renesas Electronics Corporation 1753, Shimonumabe, Nakahara-ku Kawasaki-shi Kanagawa 211-8668 / JP | [N/P] |
| Former [2013/31] | For all designated states Hitachi Chemical Company, Ltd. 9-2, Marunouchi 1-chome Chiyoda-ku Tokyo 100-6606 / JP | ||
| For all designated states Renesas Electronics Corporation 1753, Shimonumabe, Nakahara-ku Kawasaki-shi Kanagawa 211-8668 / JP | |||
| Former [2010/43] | For all designated states Hitachi Chemical Company, Ltd. Shinjuku-Mitsui Building 1-1, Nishishinjuku 2-chome Shinjuku-ku Tokyo 163-0449 / JP | ||
| For all designated states Hitachi, Ltd. 6-6, Marunouchi 1-chome Chiyoda-ku Tokyo 100-8280 / JP | |||
| Former [2010/42] | For all designated states Hitachi Chemical Company, Ltd. Shinjuku-Mitsui Building 1-1, Nishishinjuku 2-chome Shinjuku-ku Tokyo 163-0449 / JP | ||
| For all designated states Hitachi, Ltd. 6, Kanda Surugadai 4-chome Chiyoda-ku Tokyo 100-8220 / JP | Inventor(s) | 01 /
Uchida, Takeshi Hitachi Chemical Company, Ltd. c/o Research & Development Center 48, Wadai, Tsukuba-shi Ibaraki-ken 305-4247 / JP | 02 /
Matsuzawa, Jun Hitachi Chemical Company, Ltd. c/o Yamazaki Works 13-1, Higashicho 4-chome, Hitachi-shi Ibaraki-ken 317-8555 / JP | 03 /
Hoshino, Tetsuya Hitachi Chemical Company, Ltd. c/o Research & Development Center 48, Wadai, Tsukuba-shi Ibaraki-ken 305-4247 / JP | 04 /
Kamigata, Yasuo Hitachi Chemical Company, Ltd. c/o Research & Development Center 48, Wadai, Tsukuba-shi Ibaraki-ken 305-4247 / JP | 05 /
Terazaki, Hiroki c/o Research & Development Center Hitachi Chemical Company, Ltd. 48, Wadai, Tsukuba-shi Ibaraki-ken 305-4247 / JP | 06 /
Honma, Yoshio c/o Central Research Laboratory, Hitachi, Ltd. 280 Higashi Koigakubo 1-chome, Kokubunji-shi Tokyo 185-0014 / JP | 07 /
Kondoh, Seiichi c/o Central Research Laboratory, Hitachi, Ltd. 280 Higashi Koigakubo 1-chome, Kokubunji-shi Tokyo 185-0014 / JP | [2013/31] |
| Former [2010/42] | 01 /
Uchida, Takeshi Hitachi Chemical Company, Ltd. c/o Research & Development Center 48, Wadai, Tsukuba-shi Ibaraki-ken 305-4247 / JP | ||
| 02 /
Matsuzawa, Jun Hitachi Chemical Company, Ltd. c/o Yamazaki Works 13-1, Higashicho 4-chome, Hitachi-shi Ibaraki-ken 317-8555 / JP | |||
| 03 /
Hoshino, Tetsuya Hitachi Chemical Company, Ltd. c/o Research & Development Center 48, Wadai, Tsukuba-shi Ibaraki-ken 305-4247 / JP | |||
| 04 /
Kamigata, Yasuo Hitachi Chemical Company, Ltd. c/o Research & Development Center 48, Wadai, Tsukuba-shi Ibaraki-ken 305-4247 / JP | |||
| 05 /
Terazaki, Hiroki c/o Research & Development Center Hitachi Chemical Company, Ltd. 48, Wadai, Tsukuba-shi Ibaraki-ken 305-4247 / JP | |||
| 06 /
Honma, Yoshio c/o Central Research Laboratory, Hitachi, Ltd. 280 Higashi Koigakubo 1-chome, Kokubunji-shi Tokyo 185-0014 / JP | |||
| 07 /
Kondoh, Seiichi c/o Central Research Laboratory, Hitachi, Ltd. 280 Higashi Koigakubo 1-chome, Kokubunji-shi Tokyo 185-0014 / JP | Representative(s) | dompatent von Kreisler Selting Werner - Partnerschaft von Patent- und Rechtsanwälten mbB Deichmannhaus am Dom Bahnhofsvorplatz 1 50667 Köln / DE | [N/P] |
| Former [2013/31] | von Kreisler Selting Werner Deichmannhaus am Dom Bahnhofsvorplatz 1 50667 Köln / DE | ||
| Former [2010/42] | von Kreisler Selting Werner Patentanwälte Deichmannhaus am Dom Bahnhofsvorplatz 1 50667 Köln / DE | Application number, filing date | 10168136.9 | 31.08.1999 | [2010/42] | Priority number, date | JP19980245616 | 31.08.1998 Original published format: JP 24561698 | JP19980351188 | 10.12.1998 Original published format: JP 35118898 | [2010/42] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2242091 | Date: | 20.10.2010 | Language: | EN | [2010/42] | Type: | B1 Patent specification | No.: | EP2242091 | Date: | 31.07.2013 | Language: | EN | [2013/31] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 21.09.2010 | Classification | IPC: | H01L21/304, H01L21/308, C23F1/16, C09G1/02, C09G1/04, H01L21/321, H01L21/768, C23G1/10 | [2010/42] | CPC: |
C09G1/02 (EP,US);
H01L21/304 (KR);
C23F3/00 (EP,US);
C23F3/06 (EP,US);
H01L21/3212 (EP,US)
| Designated contracting states | DE, FR, GB, IT, NL [2010/42] | Title | German: | Flüssiges schleifmedium für metall und polierverfahren | [2013/31] | English: | Polishing solution for metal and polishing method | [2013/31] | French: | Liquide abrasif pour le polissage de metaux et procede correspondant | [2013/13] |
| Former [2010/42] | Flüssiges schleifmedium für metall und polierverfahren | ||
| Former [2010/42] | Polishing solution for metal and polishing method | ||
| Former [2010/42] | Liquide abrasif pour le polissage de métaux et procédé correspondant | Examination procedure | 01.04.2011 | Amendment by applicant (claims and/or description) | 01.04.2011 | Examination requested [2011/20] | 25.02.2013 | Communication of intention to grant the patent | 19.06.2013 | Fee for grant paid | 19.06.2013 | Fee for publishing/printing paid | Parent application(s) Tooltip | EP99940570.7 / EP1137056 | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued (EP19990940570) is 21.01.2005 | Opposition(s) | 02.05.2014 | No opposition filed within time limit [2014/28] | Fees paid | Renewal fee | 01.07.2010 | Renewal fee patent year 03 | 01.07.2010 | Renewal fee patent year 04 | 01.07.2010 | Renewal fee patent year 05 | 01.07.2010 | Renewal fee patent year 06 | 01.07.2010 | Renewal fee patent year 07 | 01.07.2010 | Renewal fee patent year 08 | 01.07.2010 | Renewal fee patent year 09 | 01.07.2010 | Renewal fee patent year 10 | 01.07.2010 | Renewal fee patent year 11 | 01.07.2010 | Renewal fee patent year 12 | 27.08.2011 | Renewal fee patent year 13 | 29.08.2012 | Renewal fee patent year 14 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | NL | 31.07.2013 | GB | 31.10.2013 | [2014/34] |
| Former [2014/14] | NL | 31.07.2013 | Documents cited: | Search | [A]JPH09184081 ; | [A]US4051057 (ERICSON HARRY, et al) [A] 1-15 * column 3, line 25 - line 30 * * claim 1 *; | [A]EP0846742 (CABOT CORP [US]) [A] 1-15 * page 3, line 55 - page 4, line 10 ** page 4, line 56 - page 5, line 36 *; | [AD]US5770095 (SASAKI YASUTAKA [JP], et al) [AD] 1-15 * column 3, line 38 - column 4, line 12 * * column 4, line 50 - line 53 *; | [A] - DATABASE WPI, 0, Derwent World Patents Index, vol. 1997, no. 38, Database accession no. 1997-410997, XP002598615 & JPH09184081 A 19970715 (NE CHEMCAT CORP) [A] 1-15 * abstract * | by applicant | US4944836 | JPH02278822 | JPH0883780 | - JOURNAL OF ELECTROCHEMICAL SOCIETY, (1991), vol. 138, no. 11, pages 3460 - 3464 |