blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability

2022.02.11

More...
blank News flashes

Italy joins the Federated Register

Click here for more information on the Federated Register.

2025-06-12

More...
blank Related links

Release notes
European Patent Register Assistant
European Patent Register User Manual
European Patent Register – pocket guide
FAQ - European Patent Register
Federated Register (Flyer)
Global Dossier (Flyer)
Register events
Deep link coverage
Federated Register content
The Patent Information Tour
Fair use charter

Extract from the Register of European Patents

EP About this file: EP2256793

EP2256793 - Ball-arranging substrate for placement of bumps, ball-arranging head, ball-arranging apparatus and method for arranging balls [Right-click to bookmark this link]
Former [2010/48]Ball-arranging substrate for forming bumps, ball-arranging head, ball-arranging apparatus and method for arranging balls
[2012/30]
StatusNo opposition filed within time limit
Status updated on  01.11.2013
Database last updated on 18.03.2026
Most recent event   Tooltip08.08.2014Lapse of the patent in a contracting state
New state(s): FR		published on 10.09.2014  [2014/37]
Applicant(s)For all designated states
Nippon Steel & Sumikin Materials Co., Ltd.
4-14-1, Sotokanda
Chiyoda-ku
Tokyo / JP
[2012/51]
Former [2012/47]For all designated states
Nippon Steel Materials Co., Ltd.
4-14-1, Sotokanda Chiyoda-ku
Tokyo 101-0021 / JP
Former [2010/48]For all designated states
Nippon Steel Corporation
6-1 Marunouchi 2-chome Chiyoda-ku Tokyo
100-8071 / JP
Inventor(s)01 / Shimokawa, Kenji
Nippon Micrometal Corporation
158-1 Oaza Sayamagahara
Iruma-shi Saitama 358-0032 / JP
02 / Hashino, Eiji
Nippon Steel Corporation
6-1, Marunouchi 2-chome
Chiyoda-ku
Tokyo 1008071 / JP
03 / Tatsumi, Kohei
Waseda University
2-7, Hibikino
Wakamatsu-ku
Kitakyushu-shi, Fukuoka 8080135 / JP
 [2012/52]
Former [2011/20]01 / Shimokawa, Kenji
Nippon Micrometal Corporation 158-1 Oaza Sayamagahara
Iruma-shi Saitama 358-0032 / JP
02 / Hashino, Eiji
Nippon Steel Corporation 6-1, Marunouchi 2-chome Chiyoda-ku
Tokyo 1008071 / JP
03 / Tatsumi, Kohei
Waseda University 2-7, Hibikino Wakamatsu-ku
Kitakyushu-shi, Fukuoka 8080135 / JP
Former [2011/03]01 / Shimokawa, Kenji
c/o NIPPON STEEL CORPORATION Technical Development Bureau 35-1, Ida 3-chome, Nakahara-ku
Kawasaki City, Kanagawa 211 / JP
02 / Hashino, Eiji
c/o NIPPON STEEL CORPORATION Technical Development Bureau 35-1, Ida 3-chome, Nakahara-ku
Kawasaki City, Kanagawa 211 / JP
03 / Tatsumi, Kohei
c/o NIPPON STEEL CORPORATION Technical Development Bureau 35-1, Ida 3-chome, Nakahara-ku
Kawasaki City, Kanagawa 211 / JP
Representative(s)Vossius & Partner Patentanwälte Rechtsanwälte mbB
Siebertstrasse 3
81675 München / DE
[N/P]
Former [2012/52]Vossius & Partner
Siebertstrasse 4
81675 München / DE
Former [2010/48]Vossius & Partner
Siebertstrasse 4
81675 München / DE
Application number, filing date10174137.928.08.1997
[2010/48]
Priority number, dateJP1997003127430.01.1997         Original published format: JP 3127497
JP1997010530908.04.1997         Original published format: JP 10530997
[2010/48]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP2256793
Date:01.12.2010
Language:EN
[2010/48]
Type: B1 Patent specification 
No.:EP2256793
Date:26.12.2012
Language:EN
[2012/52]
Search report(s)(Supplementary) European search report - dispatched on:EP28.10.2010
ClassificationIPC:H01L21/321, H01L21/60, H01L23/12, H01L21/48, H05K3/34
[2012/30]
CPC:
H05K3/3478 (EP,US); H10W70/093 (EP,US); H05K1/0269 (EP,US);
H05K2201/0108 (EP,US); H05K2203/0338 (EP,US); H05K2203/041 (EP,US);
H05K2203/082 (EP,US); H10W72/01204 (EP,US); H10W72/01225 (EP,US);
H10W72/251 (EP,US); H10W72/9445 (EP); H10W72/952 (EP) (-)
Former IPC [2010/48]H01L21/321, H01L21/60, H01L23/12
Designated contracting statesDE,   FR,   GB,   NL [2010/48]
TitleGerman:Kugelanordnungssubstrat zur Anordnung von Verbindungskugeln, Kugelanordnungskopf, Kugelanordnungsvorrichtung und Kugelanordnungsverfahren[2012/30]
English:Ball-arranging substrate for placement of bumps, ball-arranging head, ball-arranging apparatus and method for arranging balls[2012/30]
French:Substrat d'agencement de billes pour placer des bosses, tete d'agencement de billes, dispositif d'agencement de billes et procede d'agencement de billes[2012/30]
Former [2010/48]Kugelanordnungssubstrat zur herstellung von Höckern, Kugelanordnungskopf, Kugelanordnungsvorrichtung und Kugelanordnungsverfahren
Former [2010/48]Ball-arranging substrate for forming bumps, ball-arranging head, ball-arranging apparatus and method for arranging balls
Former [2010/48]Substrat d'agencement de billes pour former des bosses, tete d'agencement de billes, dispositif d'agencement de billes et procede d'agencement de billes
Examination procedure22.09.2010Examination requested  [2010/48]
30.05.2011Amendment by applicant (claims and/or description)
21.11.2011Despatch of a communication from the examining division (Time limit: M04)
02.04.2012Reply to a communication from the examining division
04.07.2012Communication of intention to grant the patent
09.11.2012Fee for grant paid
09.11.2012Fee for publishing/printing paid
Parent application(s)   TooltipEP97937832.0  / EP0964442
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued (EP19970937832) is  22.02.2007
Opposition(s)27.09.2013No opposition filed within time limit [2013/49]
Fees paidRenewal fee
22.09.2010Renewal fee patent year 03
22.09.2010Renewal fee patent year 04
22.09.2010Renewal fee patent year 05
22.09.2010Renewal fee patent year 06
22.09.2010Renewal fee patent year 07
22.09.2010Renewal fee patent year 08
22.09.2010Renewal fee patent year 09
22.09.2010Renewal fee patent year 10
22.09.2010Renewal fee patent year 11
22.09.2010Renewal fee patent year 12
22.09.2010Renewal fee patent year 13
22.09.2010Renewal fee patent year 14
25.08.2011Renewal fee patent year 15
24.08.2012Renewal fee patent year 16
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipGB28.08.2013
FR02.09.2013
[2014/37]
Former [2014/34]GB28.08.2013
Documents cited:Search[XDY] JPH07153766  (NIPPON STEEL CORP et al.)
 [XY] JPH08112671  (MATSUSHITA ELECTRIC INDUSTRIAL CO LTD et al.)
 [XY] JPH0897218  (MATSUSHITA ELECTRIC INDUSTRIAL CO LTD et al.)
 [XDY] EP0307591  (HITACHI LTD et al.) [XD] 3,8 * abstract * * figure - *[Y] 4,6,9,10
 [XY] JPH08285530  (SONY CORP et al.) [X] 3,8 * abstract * * figure - *[Y] 4,6,9,10
 [XY] JPH08162455  (TOSHIBA CORP et al.) [X] 3,8 * column 1, line 20 - line 31 * * column 2, line 34 - line 43 *[Y] 4,6
 [Y] JPH06331328  (FUJITSU LTD et al.)
 [XY]   KIRBY T: "ZERO ANGLE PERIMETER LIGHTING FOR INSPECTING BALL GRID ARRAY SOLDERSPHERES", MOTOROLA TECHNICAL DEVELOPMENTS, MOTOROLA INC. SCHAUMBURG, ILLINOIS, US, vol. 24, 1 March 1995 (1995-03-01), pages 148, XP000500382, ISSN: 0887-5286 [Y] 4,6,9,10
by applicantJPH04250643
 JPH0795554
 JPH07153765
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.