Extract from the Register of European Patents

EP About this file: EP2399703

EP2399703 - LASER CUTTING METHOD AND LASER CUTTING EQUIPMENT [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  23.11.2018
Database last updated on 19.03.2026
FormerExamination is in progress
Status updated on  09.03.2018
Most recent event   Tooltip23.11.2018Application deemed to be withdrawnpublished on 26.12.2018  [2018/52]
Applicant(s)For all designated states
Koike Sanso Kogyo Co., Ltd.
3-35-16, Nishikoiwa Edogawa-ku
Tokyo 133-0057 / JP
[2011/52]
Inventor(s)01 / KIMURA, Seiichiro
c/o Koike Sanso Kogyo Co. Ltd.
3-35-16 Nishikoiwa
Edogawa-ku
Tokyo 133-0057 / JP
02 / TANAKA, Akito
c/o Koike Sanso Kogyo Co. Ltd.
3-35-16 Nishikoiwa
Edogawa-ku
Tokyo 133-0057 / JP
03 / KOIKE, Tetsuo
c/o Koike Sanso Kogyo Co. Ltd.
3-35-16 Nishikoiwa
Edogawa-ku
Tokyo 133-0057 / JP
 [2011/52]
Representative(s)Westphal, Mussgnug & Partner Patentanwälte mbB
Am Riettor 5
78048 Villingen-Schwenningen / DE
[N/P]
Former [2011/52]Patentanwälte Westphal, Mussgnug & Partner
Am Riettor 5
78048 Villingen-Schwenningen / DE
Application number, filing date10743867.323.02.2010
WO2010JP52673
Priority number, dateJP2009003928323.02.2009         Original published format: JP 2009039283
[2011/52]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2010095744
Date:26.08.2010
Language:JA
[2010/34]
Type: A1 Application with search report 
No.:EP2399703
Date:28.12.2011
Language:EN
[2011/52]
Search report(s)International search report - published on:JP26.08.2010
(Supplementary) European search report - dispatched on:EP20.01.2014
ClassificationIPC:B23K26/38, B23K26/06, B23K26/073, B23K26/14, B23K103/04
[2011/52]
CPC:
B23K26/38 (EP,KR); B23K26/03 (EP,KR); B23K26/0648 (EP,KR);
B23K26/0652 (EP,KR); B23K26/0734 (EP,KR); B23K26/14 (KR);
B23K26/1476 (EP,KR); B23K2101/18 (EP,KR); B23K2103/04 (EP,KR) (-)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   SM,   TR [2011/52]
TitleGerman:LASERSCHNEIDVERFAHREN UND LASERSCHNEIDEINRICHTUNG[2011/52]
English:LASER CUTTING METHOD AND LASER CUTTING EQUIPMENT[2011/52]
French:PROCÉDÉ DE DÉCOUPE AU LASER ET DISPOSITIF DE DÉCOUPE AU LASER[2011/52]
Entry into regional phase30.08.2011Translation filed 
30.08.2011National basic fee paid 
30.08.2011Search fee paid 
30.08.2011Designation fee(s) paid 
30.08.2011Examination fee paid 
Examination procedure30.08.2011Examination requested  [2011/52]
04.08.2014Amendment by applicant (claims and/or description)
12.03.2018Despatch of a communication from the examining division (Time limit: M04)
24.07.2018Application deemed to be withdrawn, date of legal effect  [2018/52]
21.08.2018Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2018/52]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  12.03.2018
Fees paidRenewal fee
24.02.2012Renewal fee patent year 03
22.02.2013Renewal fee patent year 04
24.02.2014Renewal fee patent year 05
19.02.2015Renewal fee patent year 06
23.02.2016Renewal fee patent year 07
27.02.2017Renewal fee patent year 08
Penalty fee
Additional fee for renewal fee
28.02.201809   M06   Not yet paid
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Documents cited:Search[XI] JP2004291031  (NIPPON STEEL CORP et al.) [X] 1,2 * abstract * * paragraphs [0007] , [0012] *[I] 3
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