EP2622630 - METHODS FOR PROCESSING A SEMICONDUCTOR WAFER, A SEMICONDUCTOR WAFER AND A SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 19.08.2016 Database last updated on 24.08.2024 | Most recent event Tooltip | 19.08.2016 | Application deemed to be withdrawn | published on 21.09.2016 [2016/38] | Applicant(s) | For all designated states Freescale Semiconductor, Inc. 6501 Willam Cannon Drive West Austin, Texas 78735 / US | [2013/32] | Inventor(s) | 01 /
RENAUD, Philippe 93 chemin de Cassagnère F-31270 Cugnaux / FR | 02 /
SERRANO, Roland 3 impasse de Ia Touraine F-31100 Toulouse / FR | [2013/32] | Representative(s) | Ferro, Frodo Nunes Freescale Semiconducteurs France SAS C/o Optimus Patents Limited Grove House, Lutyens Close Chineham Court Basingstoke, Hampshire RG24 8AG / GB | [N/P] |
Former [2013/32] | Ferro, Frodo Nunes Freescale Semiconducteurs France SAS c/o Impetus IP LTD Grove House, Lutyens Close Chineham Court Basingstoke, Hampshire RG24 8AG / GB | Application number, filing date | 10798596.2 | 30.09.2010 | WO2010IB03017 | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2012042292 | Date: | 05.04.2012 | Language: | EN | [2012/14] | Type: | A1 Application with search report | No.: | EP2622630 | Date: | 07.08.2013 | Language: | EN | The application published by WIPO in one of the EPO official languages on 05.04.2012 takes the place of the publication of the European patent application. | [2013/32] | Search report(s) | International search report - published on: | EP | 05.04.2012 | Classification | IPC: | H01L21/02, H01L21/302, H01L21/78 | [2013/32] | CPC: |
H01L21/0254 (EP,US);
H01L21/02005 (EP,US);
H01L21/302 (EP,US);
H01L21/78 (EP,US);
H01L29/2003 (US);
H01L21/02389 (EP,US);
H01L21/02658 (EP,US)
(-)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR [2013/32] | Title | German: | VERFAHREN ZUR VERARBEITUNG EINES HALBLEITERWAFERS, HALBLEITERWAFER UND HALBLEITERBAUELEMENT | [2013/32] | English: | METHODS FOR PROCESSING A SEMICONDUCTOR WAFER, A SEMICONDUCTOR WAFER AND A SEMICONDUCTOR DEVICE | [2013/32] | French: | PROCÉDÉS DE TRAITEMENT DE TRANCHE DE SEMI-CONDUCTEUR, TRANCHE DE SEMI-CONDUCTEUR ET DISPOSITIF À SEMI-CONDUCTEUR | [2013/32] | Entry into regional phase | 02.05.2013 | National basic fee paid | 02.05.2013 | Designation fee(s) paid | 02.05.2013 | Examination fee paid | Examination procedure | deleted | Communication of intention to grant the patent | 02.05.2013 | Examination requested [2013/32] | 23.10.2013 | Amendment by applicant (claims and/or description) | 01.04.2016 | Application deemed to be withdrawn, date of legal effect [2016/38] | 02.05.2016 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2016/38] | Fees paid | Renewal fee | 02.05.2013 | Renewal fee patent year 03 | 27.09.2013 | Renewal fee patent year 04 | 29.09.2014 | Renewal fee patent year 05 | Penalty fee | Additional fee for renewal fee | 30.09.2015 | 06   M06   Not yet paid |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [XI]JPH10150218 (HITACHI CABLE) [X] 1-3,5,11 * paragraphs [0007] - [0026] * [I] 4,6-10,12,13; | [XI]US6037634 (AKIYAMA HAJIME [JP]) [X] 1-3,5,8,11,12 * column 15, line 30 - column 16, line 45; figures 21-24 * * column 18, lines 37-52 * [I] 4,6,7,9,10,13; | [XI]US6403449 (BALL MICHAEL B [US]) [X] 1-3,5,9,11-13 * column 2, lines 25-47 * * column 3, line 21 - column 4, line 42; figures 3-7 * [I] 4,6-8,10; | [XI]US2006024921 (HUANG JUI-TSEN [TW]) [X] 1-3,5,11,12 * paragraphs [0002] - [0005] - [0011] , [0029] - [0033]; figures 3A-3D * [I] 4,6-10,13; | [I]US2008210949 (MAKABE ISAO [JP], et al) [I] 1-13 * paragraphs [0006] , [0007] , [0015] - [0024] *; | [XI]US2008233716 (ABE KAZUHIDE [JP]) [X] 1-3,5,7,8,11,12 * the whole document * [I] 4,6,9,10,13; | [XI]US2009175305 (KOHDA SHINICHI [JP]) [X] 1-3,5,6,8,9,11-13 * the whole document * [I] 4,7,10; | [E]WO2010129908 (QUALCOMM INC [US], et al) [E] 1,2,7-13* paragraphs [0037] - [0055]; figures 5-8 * | by applicant | US6254718 | US6280645 | US6303511 | US6770504 |