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EP2571050
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EP About this file: EP2571050
| EP2571050 - SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 13.11.2020 Database last updated on 20.05.2024 | |
| Former | Examination is in progress Status updated on 16.11.2018 | Most recent event Tooltip | 13.11.2020 | Withdrawal of application | published on 16.12.2020 [2020/51] | Applicant(s) | For all designated states DENSO CORPORATION 1-1, Showa-cho Kariya-city Aichi-pref 448-8661 / JP | [2020/20] |
| Former [2013/12] | For all designated states TOYOTA JIDOSHA KABUSHIKI KAISHA 1, Toyota-cho Toyota-shi Aichi-ken, 471-8571 / JP | Inventor(s) | 01 /
OHNO Hirotaka c/o TOYOTA JIDOSHA KABUSHIKI KAISHA 1 Toyota-cho Toyota-shi, Aichi 471-8571 / JP | [2013/12] | Representative(s) | D Young & Co LLP 3 Noble Street London EC2V 7BQ / GB | [N/P] |
| Former [2013/12] | Albutt, Anthony John D Young & Co LLP 120 Holborn GB-London EC1N 2DY / GB | Application number, filing date | 10851396.1 | 12.05.2010 | WO2010JP58056 | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2011142013 | Date: | 17.11.2011 | Language: | JA | [2011/46] | Type: | A1 Application with search report | No.: | EP2571050 | Date: | 20.03.2013 | Language: | EN | [2013/12] | Search report(s) | International search report - published on: | JP | 17.11.2011 | (Supplementary) European search report - dispatched on: | EP | 05.09.2017 | Classification | IPC: | H01L23/36, C23C24/04, H01L23/373 | [2013/12] | CPC: |
C23C24/04 (EP,US);
H01L23/373 (KR);
H01L24/04 (US);
H01L23/047 (US);
H01L23/36 (EP,KR,US);
H01L23/4334 (EP,US);
H01L23/492 (EP,US);
H01L23/49517 (US);
H01L24/32 (EP,US);
H01L24/33 (EP,US);
H01L24/743 (EP,US);
H01L2224/2612 (EP);
H01L2224/32245 (EP,US);
H01L2224/33181 (EP);
H01L2224/45124 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48247 (EP,US);
H01L2224/73265 (EP,US);
H01L2224/83385 (EP,US);
H01L23/3142 (US);
H01L24/45 (EP,US);
H01L24/48 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01032 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/0104 (EP,US);
H01L2924/01042 (EP,US);
H01L2924/01045 (EP,US);
H01L2924/01047 (EP,US);
H01L2924/0105 (EP,US);
H01L2924/01074 (EP,US);
H01L2924/01077 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/014 (EP,US);
H01L2924/13055 (EP,US);
H01L2924/181 (EP,US);
H01L2924/351 (EP,US)
(-)
| C-Set: |
H01L2224/45124, H01L2924/00014 (EP,US);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00 (US);
H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00012 (EP,US);
H01L2924/00014, H01L2224/05599 (EP,US);
H01L2924/13055, H01L2924/00 (US,EP);
H01L2924/181, H01L2924/00012 (EP,US);
H01L2924/3512, H01L2924/00 (US,EP); | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR [2013/12] | Title | German: | HALBLEITERBAUELEMENT | [2013/12] | English: | SEMICONDUCTOR DEVICE | [2013/12] | French: | DISPOSITIF À SEMI-CONDUCTEUR | [2013/12] | Entry into regional phase | 29.03.2012 | Translation filed | 29.03.2012 | National basic fee paid | 29.03.2012 | Search fee paid | 29.03.2012 | Designation fee(s) paid | 29.03.2012 | Examination fee paid | Examination procedure | 01.10.2010 | Request for preliminary examination filed International Preliminary Examining Authority: JP | 29.03.2012 | Examination requested [2013/12] | 14.02.2018 | Amendment by applicant (claims and/or description) | 16.11.2018 | Despatch of a communication from the examining division (Time limit: M04) | 13.03.2019 | Reply to a communication from the examining division | 16.04.2020 | Cancellation of oral proceeding that was planned for 21.04.2020 | 21.04.2020 | Date of oral proceedings (cancelled) | 12.11.2020 | Application withdrawn by applicant [2020/51] | 13.11.2020 | Date of oral proceedings | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 16.11.2018 | Fees paid | Renewal fee | 29.03.2012 | Renewal fee patent year 03 | 10.05.2013 | Renewal fee patent year 04 | 27.03.2014 | Renewal fee patent year 05 | 12.05.2015 | Renewal fee patent year 06 | 10.05.2016 | Renewal fee patent year 07 | 10.05.2017 | Renewal fee patent year 08 | 11.05.2018 | Renewal fee patent year 09 | 15.05.2019 | Renewal fee patent year 10 | 14.05.2020 | Renewal fee patent year 11 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP2001308237 (DENSO CORP) [A] 1-17* abstract *; | [Y]US2004195649 (MIURA SHOJI [JP], et al) [Y] 1-17 * paragraph [0002] - paragraph [0007] * * paragraph [0046] - paragraph [0055] * * figure 6 *; | [Y]US2010073883 (MIYAMOTO NORITAKA [JP], et al) [Y] 1-17 * paragraph [0001] - paragraph [0004] * * paragraph [0011] - paragraph [0013] * * paragraph [0040] - paragraph [0054] * * paragraph [0056] - paragraph [0057] * * figures 1,2 * | International search | [Y]JP2004083964 (HITACHI LTD, et al); | [A]JP2004281977 (YAZAKI CORP); | [Y]JP2008300455 (SUMITOMO ELECTRIC INDUSTRIES); | [A]JP2010062490 (DENSO CORP) |