blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News flashes

New version of the European Patent Register - SPC information for Unitary Patents.

2024-03-06

More...
blank Related links

Release notes
European Patent Register Assistant
European Patent Register Resource Book
European Patent Register – pocket guide
FAQ - European Patent Register
FAQ - Register Alert
Federated Register (Flyer)
Global Dossier (Flyer)
Register events
Deep link coverage
Federated Register content
The Patent Information Tour
Fair use charter

Extract from the Register of European Patents

EP About this file: EP2581469

EP2581469 - Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  19.02.2016
Database last updated on 24.04.2024
Most recent event   Tooltip12.10.2018Lapse of the patent in a contracting state
New state(s): AL		published on 14.11.2018  [2018/46]
Applicant(s)For all designated states
Enthone, Inc.
350 Frontage Road
West Haven, CT 06516 / US
[2013/16]
Inventor(s)01 / Bastenbeck, Edwin W.
1260 Buckingham Street No. 304
Watertown, CT 06795 / US
02 / Orschel, Harald, Dr.
Alte Schulstrasse 135D
40764 Langenfeld / DE
03 / Prinz, Ulrich, Dr.
Lüderitzweg 18
42697 Solingen / DE
 [2013/16]
Representative(s)Michalski Hüttermann & Partner Patentanwälte mbB
Kaistraße 16A
40221 Düsseldorf / DE
[N/P]
Former [2015/16]Michalski Hüttermann & Partner Patentanwälte mbB
Speditionstraße 21
40221 Düsseldorf / DE
Former [2013/16]Michalski Hüttermann & Partner Patentanwälte
Hafenspitze
Speditionstrasse 21
40221 Düsseldorf / DE
Application number, filing date11184516.010.10.2011
[2013/16]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP2581469
Date:17.04.2013
Language:EN
[2013/16]
Type: B1 Patent specification 
No.:EP2581469
Date:15.04.2015
Language:EN
[2015/16]
Search report(s)(Supplementary) European search report - dispatched on:EP05.12.2011
ClassificationIPC:C23C18/16, C23C18/20, H05K3/18, C23C18/30, C23C18/22, C23C18/38, C23C18/42
[2014/45]
CPC:
C23C18/1607 (EP,US); H05K3/182 (US); C23C18/1641 (EP,US);
C23C18/166 (EP,US); C23C18/204 (EP,US); C23C18/2086 (EP,US);
C23C18/22 (EP,US); C23C18/30 (EP,US); C23C18/38 (EP,US);
C23C18/42 (EP,US); B05D3/005 (US); B05D5/12 (US);
H05K2201/0236 (EP,US); H05K3/185 (EP,US) (-)
Former IPC [2013/16]C23C18/16, C23C18/20, H05K3/18, C23C18/30, C23C18/22
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2013/16]
TitleGerman:Wässrige Aktivierungslösung und Verfahren zur stromlosen Kupferabscheidung auf direkt laserstrukturierten Substraten[2013/16]
English:Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates[2013/16]
French:Solution d'activation aqueuse et procédé pour le dépôt autocatalytique de cuivre sur des substrats structurés directement par laser[2013/16]
Examination procedure25.07.2012Amendment by applicant (claims and/or description)
25.07.2012Examination requested  [2013/16]
18.07.2013Despatch of a communication from the examining division (Time limit: M04)
14.11.2013Reply to a communication from the examining division
08.05.2014Despatch of a communication from the examining division (Time limit: M04)
02.09.2014Reply to a communication from the examining division
22.12.2014Communication of intention to grant the patent
04.03.2015Fee for grant paid
04.03.2015Fee for publishing/printing paid
04.03.2015Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  18.07.2013
Opposition(s)18.01.2016No opposition filed within time limit [2016/12]
Fees paidRenewal fee
29.10.2013Renewal fee patent year 03
29.08.2014Renewal fee patent year 04
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU10.10.2011
AL15.04.2015
AT15.04.2015
BE15.04.2015
BG15.04.2015
CY15.04.2015
CZ15.04.2015
DK15.04.2015
EE15.04.2015
ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
MC15.04.2015
MK15.04.2015
MT15.04.2015
NL15.04.2015
PL15.04.2015
RO15.04.2015
RS15.04.2015
SE15.04.2015
SI15.04.2015
SK15.04.2015
SM15.04.2015
TR15.04.2015
NO15.07.2015
GR16.07.2015
IS15.08.2015
PT17.08.2015
GB10.10.2015
IE10.10.2015
LU10.10.2015
[2018/46]
Former [2018/31]HU10.10.2011
AT15.04.2015
BE15.04.2015
BG15.04.2015
CY15.04.2015
CZ15.04.2015
DK15.04.2015
EE15.04.2015
ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
MC15.04.2015
MK15.04.2015
MT15.04.2015
NL15.04.2015
PL15.04.2015
RO15.04.2015
RS15.04.2015
SE15.04.2015
SI15.04.2015
SK15.04.2015
SM15.04.2015
TR15.04.2015
NO15.07.2015
GR16.07.2015
IS15.08.2015
PT17.08.2015
GB10.10.2015
IE10.10.2015
LU10.10.2015
Former [2017/38]HU10.10.2011
AT15.04.2015
BE15.04.2015
BG15.04.2015
CY15.04.2015
CZ15.04.2015
DK15.04.2015
EE15.04.2015
ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
MC15.04.2015
MT15.04.2015
NL15.04.2015
PL15.04.2015
RO15.04.2015
RS15.04.2015
SE15.04.2015
SI15.04.2015
SK15.04.2015
SM15.04.2015
NO15.07.2015
GR16.07.2015
IS15.08.2015
PT17.08.2015
GB10.10.2015
IE10.10.2015
LU10.10.2015
Former [2016/45]AT15.04.2015
BE15.04.2015
CZ15.04.2015
DK15.04.2015
EE15.04.2015
ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
MC15.04.2015
NL15.04.2015
PL15.04.2015
RO15.04.2015
RS15.04.2015
SI15.04.2015
SK15.04.2015
NO15.07.2015
GR16.07.2015
IS15.08.2015
PT17.08.2015
GB10.10.2015
IE10.10.2015
LU10.10.2015
Former [2016/37]AT15.04.2015
BE15.04.2015
CZ15.04.2015
DK15.04.2015
EE15.04.2015
ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
MC15.04.2015
NL15.04.2015
PL15.04.2015
RO15.04.2015
RS15.04.2015
SI15.04.2015
SK15.04.2015
NO15.07.2015
GR16.07.2015
IS15.08.2015
PT17.08.2015
GB10.10.2015
LU10.10.2015
Former [2016/34]AT15.04.2015
CZ15.04.2015
DK15.04.2015
EE15.04.2015
ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
MC15.04.2015
NL15.04.2015
PL15.04.2015
RO15.04.2015
RS15.04.2015
SI15.04.2015
SK15.04.2015
NO15.07.2015
GR16.07.2015
IS15.08.2015
PT17.08.2015
GB10.10.2015
LU10.10.2015
Former [2016/28]AT15.04.2015
CZ15.04.2015
DK15.04.2015
EE15.04.2015
ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
MC15.04.2015
NL15.04.2015
PL15.04.2015
RO15.04.2015
RS15.04.2015
SI15.04.2015
SK15.04.2015
NO15.07.2015
GR16.07.2015
IS15.08.2015
PT17.08.2015
LU10.10.2015
Former [2016/26]AT15.04.2015
CZ15.04.2015
DK15.04.2015
EE15.04.2015
ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
NL15.04.2015
PL15.04.2015
RO15.04.2015
RS15.04.2015
SI15.04.2015
SK15.04.2015
NO15.07.2015
GR16.07.2015
IS15.08.2015
PT17.08.2015
LU10.10.2015
Former [2016/24]AT15.04.2015
CZ15.04.2015
DK15.04.2015
EE15.04.2015
ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
NL15.04.2015
PL15.04.2015
RO15.04.2015
RS15.04.2015
SI15.04.2015
SK15.04.2015
NO15.07.2015
GR16.07.2015
IS15.08.2015
PT17.08.2015
Former [2016/10]AT15.04.2015
CZ15.04.2015
DK15.04.2015
EE15.04.2015
ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
NL15.04.2015
PL15.04.2015
RO15.04.2015
RS15.04.2015
SK15.04.2015
NO15.07.2015
GR16.07.2015
IS15.08.2015
PT17.08.2015
Former [2016/09]AT15.04.2015
DK15.04.2015
EE15.04.2015
ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
NL15.04.2015
RS15.04.2015
NO15.07.2015
GR16.07.2015
IS15.08.2015
PT17.08.2015
Former [2016/07]AT15.04.2015
DK15.04.2015
ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
NL15.04.2015
RS15.04.2015
NO15.07.2015
GR16.07.2015
IS15.08.2015
PT17.08.2015
Former [2015/51]AT15.04.2015
ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
NL15.04.2015
RS15.04.2015
NO15.07.2015
GR16.07.2015
IS15.08.2015
PT17.08.2015
Former [2015/50]ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
NL15.04.2015
RS15.04.2015
NO15.07.2015
GR16.07.2015
IS15.08.2015
PT17.08.2015
Former [2015/49]ES15.04.2015
FI15.04.2015
HR15.04.2015
LT15.04.2015
LV15.04.2015
NL15.04.2015
RS15.04.2015
NO15.07.2015
GR16.07.2015
PT17.08.2015
Former [2015/42]NL15.04.2015
Documents cited:Search[XI]EP0926262  (FRAUNHOFER GES FORSCHUNG [DE]) [X] 1,2,4,7 * paragraph [0008] - paragraph [0019] * * claims 1,3,4,10 * [I] 3,5,6;
 [X]US2010075496  (CHEN QINGYUN [US], et al) [X] 1-7 * paragraph [0028] - paragraph [0033] * * paragraph [0043] - paragraph [0044] * * example 1 * * claim 1 *;
 [XYI]JP2010080495  (HITACHI MAXELL) [X] 1-5,7 * abstract * * paragraphs [0015] , [0021] , [0027] , [0030] * * paragraph [0068] - paragraph [0071] * * figure 8 * [Y] 8-14 [I] 6;
 [XYI]US2010320635  (OTA HIRONORI [JP], et al) [X] 1-4,7 * paragraph [0022] - paragraph [0024] * * paragraph [0029] * * paragraph [0039] - paragraph [0044] * [Y] 8-14 [I] 5,6;
 [A]  - M. HÜKSE ET AL, "Laser supported activation and additive metallization of thermoplastics for 3D-MIDS", PROCEEDINGS OF THE 3RD LANE 2001, AUGUST 28-31, 2001, ERLANGEN, GERMANY, (20010101), XP055013109 [A] 1-14 * the whole document *
 [A]  - PIOTR RYTLEWSKI ET AL, "Surface morphology studies of laser irradiated and chemically metalized polyamide composites", SURFACE AND COATINGS TECHNOLOGY, (20110901), vol. 205, no. 23-24, doi:10.1016/j.surfcoat.2011.04.105, ISSN 0257-8972, pages 5248 - 5253, XP055013110 [A] 1-14 * the whole document *

DOI:   http://dx.doi.org/10.1016/j.surfcoat.2011.04.105
ExaminationWO2011072506
by applicantUS2004241422
 EP1584708
 US2007163887
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.