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Extract from the Register of European Patents

EP About this file: EP2450955

EP2450955 - Termination and contact structures for a high voltage GaN-based heterojunction transistor [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  08.02.2013
Database last updated on 14.09.2024
Most recent event   Tooltip08.02.2013Application deemed to be withdrawnpublished on 13.03.2013  [2013/11]
Applicant(s)For all designated states
Power Integrations, Inc.
5245 Hellyer Avenue
San Jose, California 95138 / US
[2012/19]
Inventor(s)01 / Murphy, Michael
237 Oak Drive
Middlesex, NJ 08446 / US
02 / Pophristic, Milan
62 Tee Ar Place
Princeton, NJ 08540 / US
 [2012/19]
Representative(s)Peterreins, Frank
Fish & Richardson P.C.
Highlight Business Towers
Mies-van-der-Rohe-Strasse 8
80807 München / DE
[2012/19]
Application number, filing date11192288.620.03.2008
[2012/19]
Priority number, dateUS2007072582320.03.2007         Original published format: US 725823
[2012/19]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP2450955
Date:09.05.2012
Language:EN
[2012/19]
Type: A3 Search report 
No.:EP2450955
Date:23.05.2012
[2012/21]
Search report(s)(Supplementary) European search report - dispatched on:EP24.04.2012
ClassificationIPC:H01L29/778, H01L29/20, H01L29/205, // H01L21/316, H01L23/31
[2012/21]
CPC:
H01L29/7786 (EP,KR,US); H01L21/02107 (KR); H01L21/02378 (EP,KR,US);
H01L21/0242 (EP,KR,US); H01L21/02458 (EP,KR,US); H01L21/0254 (EP,KR,US);
H01L23/3171 (EP,KR,US); H01L29/2003 (EP,KR,US); H01L29/205 (EP,KR,US);
H01L29/432 (EP,KR,US); H01L21/02244 (EP); H01L21/31683 (US);
H01L2924/0002 (EP,US); H01L2924/10346 (KR) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2012/19]
TitleGerman:Abschluss- und Kontaktstrukturen für einen Hochspannungs-Heteroübergangstransistor auf GaN-Basis[2012/19]
English:Termination and contact structures for a high voltage GaN-based heterojunction transistor[2012/19]
French:Structures de terminaison et de contact pour un transistor à hétérojonction à base de GaN à haute tension[2012/19]
Examination procedure07.12.2011Examination requested  [2012/19]
09.05.2012Despatch of a communication from the examining division (Time limit: M04)
20.09.2012Application deemed to be withdrawn, date of legal effect  [2013/11]
26.10.2012Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2013/11]
Parent application(s)   TooltipEP08732532.0  / EP2140493
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued (EP20080732532) is  17.02.2012
Fees paidRenewal fee
07.12.2011Renewal fee patent year 03
07.12.2011Renewal fee patent year 04
26.03.2012Renewal fee patent year 05
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Documents cited:Search[XI]WO03032397  (CREE LIGHTING CO [US]) [X] 1,2,4-7,9 * figure 1 * [I] 3,10-13;
 [XI]US2005087763  (KANDA ATSUHIKO [JP], et al) [X] 1,2,4-7 * figures 12B-C * * paragraphs [0011] , [0 82] , [ 154] , [ 167] * [I] 3,9-13;
 [XI]US2006108606  (SAXLER ADAM W [US], et al) [X] 1,2,4-7 * figure 2B * * paragraphs [0023] , [0 58] , [0 60] , [0 69] * [I] 3,9-13;
 [A]  - ARULKUMARAN S ET AL, "STUDIES ON THE INFLUENCES OF I-GAN, N-GAN, P-GAN AND INGAN CAP LAYERS IN ALGAN/GAN HIGH-ELECTRON-MOBILITY TRANSISTORS", JAPANESE JOURNAL OF APPLIED PHYSICS, JAPAN SOCIETY OF APPLIED PHYSICS, JP, (20050510), vol. 44, no. 5A, doi:10.1143/JJAP.44.2953, ISSN 0021-4922, pages 2953 - 2960, XP001502490 [A] 3,13 * figure 1 *

DOI:   http://dx.doi.org/10.1143/JJAP.44.2953
 [A]  - HASHIZUME TAMOTSU ET AL, "Chemistry and electrical properties of surfaces of GaN and GaN/AlGaN heterostructures", JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY: PART B, AVS / AIP, MELVILLE, NEW YORK, NY, US, (20010701), vol. 19, no. 4, doi:10.1116/1.1383078, ISSN 1071-1023, pages 1675 - 1681, XP012008931 [A] 11,12 * figure 7 * * paragraph III.B *

DOI:   http://dx.doi.org/10.1116/1.1383078
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