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Extract from the Register of European Patents

EP About this file: EP2647044

EP2647044 - ASSEMBLY OF STACKED MICROELECTRONIC COMPONENTS HAVING THROUGH-SILICON VIAS, AND CORRESPONDING METHOD OF MANUFACTURE [Right-click to bookmark this link]
Former [2013/41]MICROELECTRONIC ASSEMBLY WITH PLURAL STACKED ACTIVE CHIPS HAVING THROUGH - SILICON VIAS FORMED IN STAGES
[2020/09]
StatusNo opposition filed within time limit
Status updated on  11.06.2021
Database last updated on 03.09.2024
FormerThe patent has been granted
Status updated on  03.07.2020
FormerGrant of patent is intended
Status updated on  24.02.2020
FormerExamination is in progress
Status updated on  03.05.2019
Most recent event   Tooltip27.04.2024Lapse of the patent in a contracting state
New state(s): MK		published on 29.05.2024  [2024/22]
Applicant(s)For all designated states
Tessera, Inc.
3025 Orchard Parkway
San Jose, CA 95134 / US
[2013/41]
Inventor(s)01 / OGANESIAN, Vage
C/o Tessera Research LLC
3025 Orchard Parkway
San Jose, CA 95134 / US
02 / HABA, Belgacem
C/o Tessera Research Llc
3025 OrchardParkway
San Jose, CA 95134 / US
03 / MOHAMMED, Ilyas
C/o Tessera Research LLC
3025 Orchard Parkway
San Jose, CA 95134 / US
04 / MITCHELL, Craig
C/o Tessera Research LLC
3025 Orchard Parkway
San Jose, CA 95134 / US
05 / SAVALIA, Piyush
C/o Tessera Research LLC
3025 Orchard Parkway
San Jose, CA 95134 / US
 [2013/41]
Representative(s)Clark, Jane Anne, et al
Mathys & Squire The Shard
32 London Bridge Street
London SE1 9SG / GB
[N/P]
Former [2020/32]Clark, Jane Anne, et al
Mathys & Squire LLP The Shard
32 London Bridge Street
London SE1 9SG / GB
Former [2013/41]Clark, Jane Anne, et al
Mathys & Squire LLP 120 Holborn
London EC1N 2SQ / GB
Application number, filing date11711724.223.03.2011
[2020/32]
WO2011US29568
Priority number, dateUS20111305141418.03.2011         Original published format: US201113051414
US20100419037P02.12.2010         Original published format: US 419037 P
[2013/41]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2012074571
Date:07.06.2012
Language:EN
[2012/23]
Type: A1 Application with search report 
No.:EP2647044
Date:09.10.2013
Language:EN
The application published by WIPO in one of the EPO official languages on 07.06.2012 takes the place of the publication of the European patent application.
[2013/41]
Type: B1 Patent specification 
No.:EP2647044
Date:05.08.2020
Language:EN
[2020/32]
Search report(s)International search report - published on:EP07.06.2012
ClassificationIPC:H01L21/768, H01L23/31, H01L23/48, H01L25/065
[2020/09]
CPC:
H01L21/76898 (EP,US); H01L23/48 (KR); H01L25/00 (US);
H01L23/12 (KR); H01L23/3178 (EP,US); H01L23/481 (EP,US);
H01L24/81 (US); H01L24/92 (EP,US); H01L24/94 (EP,US);
H01L25/0657 (EP,US); H01L25/50 (EP,US); H01L2224/0401 (EP,US);
H01L2224/05009 (EP,US); H01L2224/13025 (EP,US); H01L2224/16225 (EP,US);
H01L2224/29109 (EP,US); H01L2224/29111 (EP,US); H01L2224/29144 (EP,US);
H01L2224/29188 (EP,US); H01L2224/2919 (EP,US); H01L2224/32145 (EP,US);
H01L2224/32245 (EP,US); H01L2224/73253 (EP,US); H01L2224/83005 (EP,US);
H01L2224/9202 (EP,US); H01L2224/94 (EP,US); H01L2225/06513 (EP,US);
H01L2225/06527 (EP,US); H01L2225/06541 (EP,US); H01L2924/10253 (EP,US);
H01L2924/1032 (EP,US); H01L2924/1037 (EP,US); H01L2924/12042 (EP,US);
H01L2924/14 (EP,US); H01L2924/1433 (EP,US); H01L2924/1436 (EP,US);
H01L2924/1437 (EP,US); H01L2924/15311 (EP,US) (-)
C-Set:
H01L2224/94, H01L2224/83 (EP,US);
H01L2924/12042, H01L2924/00 (US,EP)
Former IPC [2013/41]H01L23/48, H01L25/065
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2013/41]
Extension statesBANot yet paid
MENot yet paid
TitleGerman:ANORDNUNG VON GESTAPELTEN MIKROELEKTRONISCHEN KOMPONENTEN MIT DURCHKONTAKTIERUNGEN, SOWIE ZUGEHÖRIGES HERSTELLUNGSVERFAHREN[2020/13]
English:ASSEMBLY OF STACKED MICROELECTRONIC COMPONENTS HAVING THROUGH-SILICON VIAS, AND CORRESPONDING METHOD OF MANUFACTURE[2020/13]
French:ENSEMBLE DE COMPOSANTS MICROÉLECTRONIQUES EMPILÉS AYANT DES INTERCONNEXIONS VERTICALES ET PROCÉDÉ DE FABRICATION CORRESPONDANT[2020/13]
Former [2013/41]MIKROELEKTRONISCHE ANORDNUNG MIT MEHREREN GESTAPELTEN AKTIVEN CHIPS MIT SILIZIUMDURCHKONTAKTIERUNGEN IN STUFEN
Former [2013/41]MICROELECTRONIC ASSEMBLY WITH PLURAL STACKED ACTIVE CHIPS HAVING THROUGH - SILICON VIAS FORMED IN STAGES
Former [2013/41]ENSEMBLE MICROÉLECTRONIQUE AYANT PLUSIEURS PUCES ACTIVES EMPILÉES AYANT DES INTERCONNEXIONS VERTICALES FORMÉES EN ÉTAGES
Entry into regional phase20.06.2013National basic fee paid 
20.06.2013Designation fee(s) paid 
20.06.2013Examination fee paid 
Examination procedure20.06.2013Examination requested  [2013/41]
22.01.2014Amendment by applicant (claims and/or description)
07.05.2019Despatch of a communication from the examining division (Time limit: M04)
17.09.2019Reply to a communication from the examining division
17.12.2019Despatch of a communication from the examining division (Time limit: M04)
08.01.2020Reply to a communication from the examining division
25.02.2020Communication of intention to grant the patent
24.06.2020Fee for grant paid
24.06.2020Fee for publishing/printing paid
24.06.2020Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  07.05.2019
Opposition(s)07.05.2021No opposition filed within time limit [2021/28]
Fees paidRenewal fee
20.06.2013Renewal fee patent year 03
12.03.2014Renewal fee patent year 04
27.03.2015Renewal fee patent year 05
31.03.2016Renewal fee patent year 06
27.03.2017Renewal fee patent year 07
27.03.2018Renewal fee patent year 08
27.03.2019Renewal fee patent year 09
27.03.2020Renewal fee patent year 10
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU23.03.2011
AL05.08.2020
AT05.08.2020
CY05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
MK05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
GB23.03.2021
IE23.03.2021
LU23.03.2021
BE31.03.2021
CH31.03.2021
FR31.03.2021
LI31.03.2021
[2024/22]
Former [2023/27]HU23.03.2011
AL05.08.2020
AT05.08.2020
CY05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
GB23.03.2021
IE23.03.2021
LU23.03.2021
BE31.03.2021
CH31.03.2021
FR31.03.2021
LI31.03.2021
Former [2023/24]AL05.08.2020
AT05.08.2020
CY05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
GB23.03.2021
IE23.03.2021
LU23.03.2021
BE31.03.2021
CH31.03.2021
FR31.03.2021
LI31.03.2021
Former [2022/34]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
GB23.03.2021
IE23.03.2021
LU23.03.2021
BE31.03.2021
CH31.03.2021
FR31.03.2021
LI31.03.2021
Former [2022/11]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
GB23.03.2021
IE23.03.2021
LU23.03.2021
CH31.03.2021
FR31.03.2021
LI31.03.2021
Former [2022/08]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
GB23.03.2021
IE23.03.2021
LU23.03.2021
FR31.03.2021
Former [2022/07]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
IE23.03.2021
Former [2021/45]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/36]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/34]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/28]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/25]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/23]AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/22]AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/20]AT05.08.2020
DK05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RS05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/12]AT05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RS05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/10]AT05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
PL05.08.2020
RS05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/09]AT05.08.2020
ES05.08.2020
FI05.08.2020
LT05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
PT07.12.2020
Former [2021/08]ES05.08.2020
FI05.08.2020
LT05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
PT07.12.2020
Former [2021/07]FI05.08.2020
LT05.08.2020
NO05.11.2020
Cited inInternational search[A]US2003178714  (SAKODA HIDEHARU [JP], et al) [A] 16-25* the whole document *;
 [X]US2004016942  (MIYAZAWA IKUYA [JP], et al) [X] 1,2,5,6,11-13,24,25 * paragraph [0063]; figure 5 *;
 [XY]US2004155354  (HANAOKA TERUNAO [JP], et al) [X] 1-6,8,10-18,20-25 * paragraphs [0165] - [0169] - [ 185]; figures 10, 11 * [Y] 7,9;
 [Y]US2006154446  (WOOD ALAN G [US], et al) [Y] 7,9 * paragraphs [0051] , [0 55]; figures 2D-2F *;
 [A]US2007035020  (UMEMOTO MITSUO [JP]) [A] 1,12,15,17,18 * figures 8-10 *;
 [I]US2008230923  (JO CHA-JEA [KR], et al) [I] 16-25 * paragraphs [0048] - [0065]; figures 3A-E, 4 *;
 [X]US2009032966  (LEE JONG HO [KR], et al) [X] 16,20-24 * paragraphs [0036] - [0044] - [0 67] , [0 68] , [0 71]; figures 1A-E, 10, 11, 14 *;
 [A]US2009045504  (SUH MIN SUK [KR]) [A] 1-10,12,15,24,25 * figures 3, 5, 7, 9-11 *;
 [A]US2010193964  (FAROOQ MUKTA G [US], et al) [A] 1-15,24,25 * paragraph [0046]; figure 12 *
ExaminationJP2005019521
 US2007037379
by applicantUS2008246136
 US20100842717
 US20100842612
 US20100842669
 US20100842692
 US20100842587
 US20100842651
 US20100419033
 US20100958866
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.