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Extract from the Register of European Patents

EP About this file: EP2545503

EP2545503 - ELECTRONIC DEVICE HAVING A CHIP AND METHOD FOR MANUFACTURING BY COILS [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  24.10.2014
Database last updated on 12.07.2024
Most recent event   Tooltip12.10.2018Lapse of the patent in a contracting state
New state(s): AL		published on 14.11.2018  [2018/46]
Applicant(s)For all designated states
Smartflex Innovation Pte. Ltd.
27 Ubi Road 4, No. 04-0'4
Singapore 408618 / SG
[2013/03]
Inventor(s)01 / ORMEROD, Simon
813 Avenue des Grainières
F-13600 La Ciotat / FR
02 / SALVAGIONE, Alain
Le Grand Prè
275 chemin de Sequi
F-13112 La Destrousse / FR
03 / ELBAZ, Didier
Résidence Saint Loup
103 Boulevard de Saint Loup
Tour A
F-13010 Marseille / FR
 [2013/03]
Representative(s)Hirsch & Associés
154 Boulevard Haussmann
75008 Paris / FR
[N/P]
Former [2013/03]Hirsch & Associés
58, avenue Marceau
75008 Paris / FR
Application number, filing date11712974.207.03.2011
WO2011FR50467
Priority number, dateFR2010000092608.03.2010         Original published format: FR 1000926
[2013/03]
Filing languageFR
Procedural languageFR
PublicationType: A1 Application with search report
No.:WO2011110781
Date:15.09.2011
Language:FR
[2011/37]
Type: A1 Application with search report 
No.:EP2545503
Date:16.01.2013
Language:FR
The application published by WIPO in one of the EPO official languages on 15.09.2011 takes the place of the publication of the European patent application.
[2013/03]
Type: B1 Patent specification 
No.:EP2545503
Date:18.12.2013
Language:FR
[2013/51]
Search report(s)International search report - published on:EP15.09.2011
ClassificationIPC:G06K19/07, G06K19/077, H01L23/498
[2013/30]
CPC:
G06K19/072 (EP); G06K19/07718 (EP); G06K19/07732 (EP);
G06K19/07743 (EP); G06K19/07749 (EP); G06K19/07769 (EP);
G06K19/07779 (EP); G06K19/07783 (EP); H01L23/49855 (EP);
H01L2924/0002 (EP) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP)
Former IPC [2013/03]G06K19/077, H01L23/498
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2013/03]
Extension statesBANot yet paid
MENot yet paid
TitleGerman:ELEKTRONISCHE VORRICHTUNG MIT EINEM CHIP UND HERSTELLUNGSVERFAHREN MITTELS SPULEN[2013/03]
English:ELECTRONIC DEVICE HAVING A CHIP AND METHOD FOR MANUFACTURING BY COILS[2013/03]
French:DISPOSITIF ÉLECTRONIQUE À PUCE ET PROCÉDÉ DE FABRICATION PAR BOBINES[2013/03]
Entry into regional phase08.10.2012National basic fee paid 
08.10.2012Designation fee(s) paid 
08.10.2012Examination fee paid 
Examination procedure09.01.2012Request for preliminary examination filed
International Preliminary Examining Authority: EP
08.10.2012Examination requested  [2013/03]
18.04.2013Amendment by applicant (claims and/or description)
02.07.2013Communication of intention to grant the patent
08.11.2013Fee for grant paid
08.11.2013Fee for publishing/printing paid
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  02.07.2013
Opposition(s)19.09.2014No opposition filed within time limit [2014/48]
Fees paidRenewal fee
02.04.2013Renewal fee patent year 03
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU07.03.2011
AL18.12.2013
AT18.12.2013
BG18.12.2013
CY18.12.2013
DK18.12.2013
EE18.12.2013
FI18.12.2013
HR18.12.2013
LT18.12.2013
LV18.12.2013
MC18.12.2013
MK18.12.2013
MT18.12.2013
RS18.12.2013
SE18.12.2013
SI18.12.2013
SK18.12.2013
SM18.12.2013
IE07.03.2014
LU07.03.2014
NO18.03.2014
IS18.04.2014
[2018/46]
Former [2018/31]HU07.03.2011
AT18.12.2013
BG18.12.2013
CY18.12.2013
DK18.12.2013
EE18.12.2013
FI18.12.2013
HR18.12.2013
LT18.12.2013
LV18.12.2013
MC18.12.2013
MK18.12.2013
MT18.12.2013
RS18.12.2013
SE18.12.2013
SI18.12.2013
SK18.12.2013
SM18.12.2013
IE07.03.2014
LU07.03.2014
NO18.03.2014
IS18.04.2014
Former [2016/32]HU07.03.2011
AT18.12.2013
BG18.12.2013
CY18.12.2013
DK18.12.2013
EE18.12.2013
FI18.12.2013
HR18.12.2013
LT18.12.2013
LV18.12.2013
MC18.12.2013
MT18.12.2013
RS18.12.2013
SE18.12.2013
SI18.12.2013
SK18.12.2013
SM18.12.2013
IE07.03.2014
LU07.03.2014
NO18.03.2014
IS18.04.2014
Former [2016/28]AT18.12.2013
BG18.12.2013
CY18.12.2013
DK18.12.2013
EE18.12.2013
FI18.12.2013
HR18.12.2013
LT18.12.2013
LV18.12.2013
MC18.12.2013
MT18.12.2013
RS18.12.2013
SE18.12.2013
SI18.12.2013
SK18.12.2013
SM18.12.2013
IE07.03.2014
LU07.03.2014
NO18.03.2014
IS18.04.2014
Former [2016/27]AT18.12.2013
CY18.12.2013
DK18.12.2013
EE18.12.2013
FI18.12.2013
HR18.12.2013
LT18.12.2013
LV18.12.2013
MC18.12.2013
MT18.12.2013
RS18.12.2013
SE18.12.2013
SI18.12.2013
SK18.12.2013
SM18.12.2013
IE07.03.2014
LU07.03.2014
NO18.03.2014
IS18.04.2014
Former [2016/22]AT18.12.2013
CY18.12.2013
DK18.12.2013
EE18.12.2013
FI18.12.2013
HR18.12.2013
LT18.12.2013
LV18.12.2013
MT18.12.2013
RS18.12.2013
SE18.12.2013
SI18.12.2013
SK18.12.2013
SM18.12.2013
IE07.03.2014
LU07.03.2014
NO18.03.2014
IS18.04.2014
Former [2016/12]AT18.12.2013
CY18.12.2013
DK18.12.2013
EE18.12.2013
FI18.12.2013
HR18.12.2013
LT18.12.2013
LV18.12.2013
MT18.12.2013
RS18.12.2013
SE18.12.2013
SI18.12.2013
SK18.12.2013
IE07.03.2014
LU07.03.2014
NO18.03.2014
IS18.04.2014
Former [2015/24]AT18.12.2013
CY18.12.2013
DK18.12.2013
EE18.12.2013
FI18.12.2013
HR18.12.2013
LT18.12.2013
LV18.12.2013
RS18.12.2013
SE18.12.2013
SI18.12.2013
SK18.12.2013
IE07.03.2014
LU07.03.2014
NO18.03.2014
IS18.04.2014
Former [2015/07]AT18.12.2013
CY18.12.2013
DK18.12.2013
EE18.12.2013
FI18.12.2013
HR18.12.2013
LT18.12.2013
LV18.12.2013
RS18.12.2013
SE18.12.2013
SK18.12.2013
IE07.03.2014
LU07.03.2014
NO18.03.2014
IS18.04.2014
Former [2014/48]AT18.12.2013
CY18.12.2013
DK18.12.2013
EE18.12.2013
FI18.12.2013
HR18.12.2013
LT18.12.2013
LV18.12.2013
RS18.12.2013
SE18.12.2013
SK18.12.2013
LU07.03.2014
NO18.03.2014
IS18.04.2014
Former [2014/37]AT18.12.2013
CY18.12.2013
EE18.12.2013
FI18.12.2013
HR18.12.2013
LT18.12.2013
LV18.12.2013
RS18.12.2013
SE18.12.2013
SK18.12.2013
NO18.03.2014
IS18.04.2014
Former [2014/36]EE18.12.2013
FI18.12.2013
HR18.12.2013
LT18.12.2013
LV18.12.2013
RS18.12.2013
SE18.12.2013
NO18.03.2014
IS18.04.2014
Former [2014/25]FI18.12.2013
HR18.12.2013
LT18.12.2013
LV18.12.2013
RS18.12.2013
SE18.12.2013
NO18.03.2014
Former [2014/24]FI18.12.2013
HR18.12.2013
LT18.12.2013
RS18.12.2013
SE18.12.2013
NO18.03.2014
Former [2014/23]FI18.12.2013
HR18.12.2013
LT18.12.2013
SE18.12.2013
NO18.03.2014
Former [2014/22]FI18.12.2013
LT18.12.2013
SE18.12.2013
NO18.03.2014
Former [2014/20]LT18.12.2013
NO18.03.2014
Cited inInternational search[XI]US2008205012  (HEINEMANN ERIK [DE], et al) [X] 1,3,7,8,10,12 * figures 1-3 * * paragraphs [0017] - [0039] - [0056] , [0003] * * figure 7 * * paragraphs [0052] - [0055] * [I] 2,4-6,9,11,13-38;
 [XI]WO0065689  (AMERASIA INT TECHNOLOGY INC [US], et al) [X] 1,13 * figures 1-3B * * page 3, line 22 - page 9, line 27 * [I] 2-12;
 [I]EP0307773  (EM MICROELECTRONIC MARIN SA [CH]) [I] 1-38 * figures 1-8 * * column 5, line 9 - column 10, line 31 *;
 [I]US2003226901  (KIM DEOK-HEUNG [KR], et al) [I] 1-13 * figures 3A-3L,4,5 * * paragraphs [0035] - [0054] *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.