EP2565913 - METHOD FOR ENCAPSULATING OF A SEMICONDUCTOR [Right-click to bookmark this link] | |||
Former [2013/10] | METHOD FOR ENCAPSULATING SEMICONDUCTOR AND STRUCTURE THEREOF | ||
[2018/32] | Status | No opposition filed within time limit Status updated on 24.01.2020 Database last updated on 15.06.2024 | |
Former | The patent has been granted Status updated on 15.02.2019 | ||
Former | Grant of patent is intended Status updated on 08.02.2019 | ||
Former | Examination is in progress Status updated on 30.01.2019 | ||
Former | Grant of patent is intended Status updated on 22.07.2018 | ||
Former | Examination is in progress Status updated on 26.07.2017 | Most recent event Tooltip | 01.07.2022 | Lapse of the patent in a contracting state New state(s): MK | published on 03.08.2022 [2022/31] | Applicant(s) | For all designated states Huawei Device Co., Ltd. B2-5 of Nanfang Factory No.2 of Xincheng Road Songshan Lake Science and Technology Industrial Zone Dongguan, Guangdong 523808 / CN | [2019/10] |
Former [2013/10] | For all designated states Huawei Device Co., Ltd. Building B2 Huawei Industrial Base Bantian Longgang District Shenzhen, Guangdong 518129 / CN | Inventor(s) | 01 /
YANG, Xiong Huawei Administration Building Bantian Longgang District Shenzhen Guangdong 518129 / CN | [2013/10] | Representative(s) | Maiwald GmbH Elisenhof Elisenstraße 3 80335 München / DE | [N/P] |
Former [2019/12] | Maiwald Patent- und Rechtsanwaltsgesellschaft mbH Elisenhof Elisenstraße 3 80335 München / DE | ||
Former [2013/12] | Maiwald Patentanwalts GmbH Engineering Elisenhof Elisenstrasse 3 80335 München / DE | ||
Former [2013/10] | Maiwald, Walter Maiwald Patentanwalts GmbH Elisenhof Elisenstrasse 3 80335 München / DE | Application number, filing date | 11789258.8 | 22.06.2011 | [2019/12] | WO2011CN76087 | Filing language | ZH | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | WO2011150879 | Date: | 08.12.2011 | Language: | ZH | [2011/49] | Type: | A2 Application without search report | No.: | EP2565913 | Date: | 06.03.2013 | Language: | EN | [2013/10] | Type: | B1 Patent specification | No.: | EP2565913 | Date: | 20.03.2019 | Language: | EN | [2019/12] | Search report(s) | International search report - published on: | CN | 24.05.2012 | (Supplementary) European search report - dispatched on: | EP | 02.07.2013 | Classification | IPC: | H01L21/56, H01L23/31, B29C39/42, H01L25/16 | [2013/31] | CPC: |
H01L21/56 (EP,US);
H01L21/565 (EP,US);
H01L23/3121 (EP,US);
H01L25/165 (EP,US);
H01L2924/0002 (EP,US);
Y10T428/239 (EP,US)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
|
Former IPC [2013/10] | H01L21/56, H01L23/31, B29C39/42 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2013/10] | Extension states | BA | Not yet paid | ME | Not yet paid | Title | German: | VERFAHREN ZUR EINKAPSELUNG EINES HALBLEITERS | [2018/32] | English: | METHOD FOR ENCAPSULATING OF A SEMICONDUCTOR | [2018/32] | French: | PROCÉDÉ D'ENCAPSULATION DE SEMI-CONDUCTEUR | [2018/32] |
Former [2013/10] | VERFAHREN ZUR EINKAPSELUNG EINES HALBLEITERS UND STRUKTUR DAFÜR | ||
Former [2013/10] | METHOD FOR ENCAPSULATING SEMICONDUCTOR AND STRUCTURE THEREOF | ||
Former [2013/10] | PROCÉDÉ D'ENCAPSULATION DE SEMI-CONDUCTEUR, ET STRUCTURE AINSI RÉALISÉE | Entry into regional phase | 26.11.2012 | Translation filed | 26.11.2012 | National basic fee paid | 26.11.2012 | Search fee paid | 26.11.2012 | Designation fee(s) paid | 26.11.2012 | Examination fee paid | Examination procedure | 26.11.2012 | Examination requested [2013/10] | 11.11.2013 | Amendment by applicant (claims and/or description) | 27.04.2015 | Despatch of a communication from the examining division (Time limit: M04) | 18.06.2015 | Reply to a communication from the examining division | 14.07.2017 | Despatch of a communication from the examining division (Time limit: M04) | 14.11.2017 | Reply to a communication from the examining division | 23.07.2018 | Communication of intention to grant the patent | 26.10.2018 | Fee for grant paid | 26.10.2018 | Fee for publishing/printing paid | 30.11.2018 | Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO | 07.02.2019 | Information about intention to grant a patent | 07.02.2019 | Receipt of the translation of the claim(s) | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 27.04.2015 | Opposition(s) | 02.01.2020 | No opposition filed within time limit [2020/09] | Fees paid | Renewal fee | 06.06.2013 | Renewal fee patent year 03 | 17.06.2014 | Renewal fee patent year 04 | 30.06.2015 | Renewal fee patent year 05 | 23.06.2016 | Renewal fee patent year 06 | 22.06.2017 | Renewal fee patent year 07 | 14.06.2018 | Renewal fee patent year 08 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 22.06.2011 | AL | 20.03.2019 | AT | 20.03.2019 | CY | 20.03.2019 | CZ | 20.03.2019 | DK | 20.03.2019 | EE | 20.03.2019 | ES | 20.03.2019 | FI | 20.03.2019 | HR | 20.03.2019 | IT | 20.03.2019 | LT | 20.03.2019 | LV | 20.03.2019 | MC | 20.03.2019 | MK | 20.03.2019 | MT | 20.03.2019 | PL | 20.03.2019 | RO | 20.03.2019 | RS | 20.03.2019 | SE | 20.03.2019 | SI | 20.03.2019 | SK | 20.03.2019 | SM | 20.03.2019 | TR | 20.03.2019 | BG | 20.06.2019 | NO | 20.06.2019 | GR | 21.06.2019 | IE | 22.06.2019 | LU | 22.06.2019 | BE | 30.06.2019 | CH | 30.06.2019 | LI | 30.06.2019 | IS | 20.07.2019 | PT | 20.07.2019 | [2022/31] |
Former [2021/34] | HU | 22.06.2011 | |
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BE | 30.06.2019 | ||
CH | 30.06.2019 | ||
LI | 30.06.2019 | ||
IS | 20.07.2019 | ||
PT | 20.07.2019 | ||
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BE | 30.06.2019 | ||
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LI | 30.06.2019 | ||
IS | 20.07.2019 | ||
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BE | 30.06.2019 | ||
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LI | 30.06.2019 | ||
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BG | 20.06.2019 | ||
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IE | 22.06.2019 | ||
LU | 22.06.2019 | ||
BE | 30.06.2019 | ||
CH | 30.06.2019 | ||
LI | 30.06.2019 | ||
IS | 20.07.2019 | ||
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GR | 21.06.2019 | ||
IS | 20.07.2019 | ||
PT | 20.07.2019 | ||
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SM | 20.03.2019 | ||
BG | 20.06.2019 | ||
NO | 20.06.2019 | ||
GR | 21.06.2019 | ||
PT | 20.07.2019 | ||
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BG | 20.06.2019 | ||
NO | 20.06.2019 | ||
GR | 21.06.2019 | ||
PT | 20.07.2019 | ||
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CZ | 20.03.2019 | ||
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BG | 20.06.2019 | ||
NO | 20.06.2019 | ||
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PT | 20.07.2019 | ||
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PT | 20.07.2019 | ||
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BG | 20.06.2019 | ||
NO | 20.06.2019 | ||
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BG | 20.06.2019 | ||
NO | 20.06.2019 | ||
GR | 21.06.2019 | ||
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Former [2019/33] | FI | 20.03.2019 | |
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NO | 20.06.2019 | Documents cited: | Search | [A]US5105259 (MCSHANE MICHAEL B [US], et al) [A] 1-7* figure 3 *; | [XI]EP1198005 (HITACHI LTD [JP]) [X] 1,4,5,7 * figures 11A-E * [I] 2,3,6; | [XI]WO2005067029 (INFINEON TECHNOLOGIES AG [SG], et al) [X] 1,4,5,7 * figures 5-7 * [I] 2,3,6; | [XI]US2009298228 (SATO TAKAO [JP], et al) [X] 1,4,5,7 * figure 4 * [I] 2,3,6 | International search | [X]CN101110406 (GLOBAL ADVANCED PACKAGING TECH [CN]); | [Y]CN101110406 (GLOBAL ADVANCED PACKAGING TECH [CN]); | [Y]CN101611483 (FICO BV [NL]) | Examination | US2008251901 |