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Extract from the Register of European Patents

EP About this file: EP2587525

EP2587525 - METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
Former [2013/18]METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
[2020/12]
StatusNo opposition filed within time limit
Status updated on  12.02.2021
Database last updated on 12.07.2024
FormerThe patent has been granted
Status updated on  21.02.2020
FormerGrant of patent is intended
Status updated on  24.09.2019
FormerExamination is in progress
Status updated on  20.07.2018
Most recent event   Tooltip08.07.2022Lapse of the patent in a contracting state
New state(s): MK		published on 10.08.2022  [2022/32]
Applicant(s)For all designated states
Fuji Electric Co., Ltd.
1-1, Tanabeshinden
Kawasaki-ku
Kawasaki-shi
210-9530 / JP
[2013/18]
Inventor(s)01 / TAMENORI, Akira
c/o FUJI ELECTRIC CO. LTD.
1-1, Tanabeshinden
Kawasaki-ku
Kawasaki-shi Kanagawa 210-9530 / JP
 [2013/18]
Representative(s)MERH-IP Matias Erny Reichl Hoffmann Patentanwälte PartG mbB
Paul-Heyse-Strasse 29
80336 München / DE
[2020/13]
Former [2013/18]MERH-IP Matias Erny Reichl Hoffmann
Paul-Heyse-Strasse 29
80336 München / DE
Application number, filing date11826848.120.09.2011
[2020/13]
WO2011JP71408
Priority number, dateJP2010021148722.09.2010         Original published format: JP 2010211487
[2013/18]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2012039403
Date:29.03.2012
Language:JA
[2012/13]
Type: A1 Application with search report 
No.:EP2587525
Date:01.05.2013
Language:EN
[2013/18]
Type: B1 Patent specification 
No.:EP2587525
Date:25.03.2020
Language:EN
[2020/13]
Search report(s)International search report - published on:JP29.03.2012
(Supplementary) European search report - dispatched on:EP23.06.2017
ClassificationIPC:H01L21/78
[2017/30]
CPC:
H01L29/66348 (EP,US); H01L21/782 (US); H01L21/78 (EP,US);
H01L21/67092 (EP,US)
Former IPC [2013/18]H01L21/301
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2013/18]
Extension statesBANot yet paid
MENot yet paid
TitleGerman:HERSTELLUNGSVERFAHREN FÜR HALBLEITERBAUELEMENT[2013/18]
English:METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE[2020/12]
French:PROCÉDÉ DE FABRICATION DE DISPOSITIF À SEMI-CONDUCTEUR[2013/18]
Former [2013/18]METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Entry into regional phase24.01.2013Translation filed 
24.01.2013National basic fee paid 
24.01.2013Search fee paid 
24.01.2013Designation fee(s) paid 
24.01.2013Examination fee paid 
Examination procedure24.01.2013Examination requested  [2013/18]
29.12.2017Amendment by applicant (claims and/or description)
19.07.2018Despatch of a communication from the examining division (Time limit: M04)
19.11.2018Reply to a communication from the examining division
19.06.2019Despatch of a communication from the examining division (Time limit: M02)
26.08.2019Reply to a communication from the examining division
25.09.2019Communication of intention to grant the patent
05.02.2020Fee for grant paid
05.02.2020Fee for publishing/printing paid
05.02.2020Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  19.07.2018
Opposition(s)12.01.2021No opposition filed within time limit [2021/11]
Fees paidRenewal fee
30.09.2013Renewal fee patent year 03
30.09.2014Renewal fee patent year 04
30.09.2015Renewal fee patent year 05
30.09.2016Renewal fee patent year 06
02.10.2017Renewal fee patent year 07
01.10.2018Renewal fee patent year 08
30.09.2019Renewal fee patent year 09
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU20.09.2011
AL25.03.2020
AT25.03.2020
CY25.03.2020
CZ25.03.2020
DK25.03.2020
EE25.03.2020
ES25.03.2020
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LU20.09.2020
BE30.09.2020
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FR30.09.2020
LI30.09.2020
[2022/31]
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Former [2022/27]HU20.09.2011
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PT18.08.2020
GB20.09.2020
IE20.09.2020
LU20.09.2020
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IS25.07.2020
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BE30.09.2020
CH30.09.2020
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GR26.06.2020
IS25.07.2020
PT18.08.2020
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PT18.08.2020
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SM25.03.2020
BG25.06.2020
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GR26.06.2020
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PT18.08.2020
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BG25.06.2020
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PT18.08.2020
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Documents cited:Search[A]US6389680  (MATSUTA KATSUJI [JP], et al) [A] 1-7 * abstract *;
 [A]US2005170555  (HIRANO NAOHIKO [JP], et al) [A] 1-7* abstract *
International search[Y]JPH05315304  (SONY CORP);
 [Y]JP2005244165  (DENSO CORP);
 [A]JP2006032390  (SEIKO EPSON CORP);
 [Y]JP2007036129  (RENESAS TECH CORP);
 [A]JP2007287780  (TOSHIBA CORP)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.