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EP2487730
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EP About this file: EP2487730
| EP2487730 - Flip chip LED package and manufacturing method thereof [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 03.10.2014 Database last updated on 09.09.2024 | Most recent event Tooltip | 03.10.2014 | Withdrawal of application | published on 05.11.2014 [2014/45] | Applicant(s) | For all designated states Samsung Electronics Co., Ltd. 129, Samsung-ro Yeongtong-gu Suwon-si, Gyeonggi-do, 443-742 / KR | [2013/02] |
| Former [2012/33] | For all designated states Samsung LED Co., Ltd. San 24, Nongseo-dong Giheung-gu Yongi-city, Gyeonggi-Do 446-711 / KR | Inventor(s) | 01 /
Kim, Kwon Joong 101-803 Osan Fiore, Galgot-dong, Osan-si 447-310 Gyeonggi-do / KR | 02 /
Paek, Ho Sun 109-604 We`ve Haulche, Maetan-dong, Yeongtong-gu Suwon-si 443-370 Gyeonggi-do / KR | 03 /
Kim, Hak Hwan 105-401 DongSuwon LG Village 1 Cha, Mangpo-dong Yeongtong-gu 443-706 Gyeonggi-do / KR | [2012/33] | Representative(s) | Grünecker Patent- und Rechtsanwälte PartG mbB Leopoldstrasse 4 80802 München / DE | [N/P] |
| Former [2012/33] | Grünecker, Kinkeldey, Stockmair & Schwanhäusser Leopoldstrasse 4 80802 München / DE | Application number, filing date | 12153743.5 | 03.02.2012 | [2012/33] | Priority number, date | KR20110011877 | 10.02.2011 Original published format: KR 20110011877 | [2012/33] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP2487730 | Date: | 15.08.2012 | Language: | EN | [2012/33] | Classification | IPC: | H01L33/48, H01L33/36, H01L33/62 | [2012/33] | CPC: |
H01L33/486 (EP,US);
H01L33/62 (EP,KR,US);
H01L33/36 (EP,US);
H01L33/48 (KR);
H01L2224/16245 (EP,US);
H01L2933/0016 (EP,US)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2012/33] | Extension states | BA | Not yet paid | ME | Not yet paid | Title | German: | Flipchip-LED-Baugruppe und Herstellungsverfahren dafür | [2012/33] | English: | Flip chip LED package and manufacturing method thereof | [2012/33] | French: | Boîtier de DEL à puce retournée et son procédé de fabrication | [2012/33] | Examination procedure | 03.02.2012 | Examination requested [2012/33] | 26.09.2014 | Application withdrawn by applicant [2014/45] | Fees paid | Renewal fee | 24.02.2014 | Renewal fee patent year 03 |
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