EP2639278 - Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing seminconductor device using the tape [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 22.08.2014 Database last updated on 19.10.2024 | Most recent event Tooltip | 22.08.2014 | Application deemed to be withdrawn | published on 24.09.2014 [2014/39] | Applicant(s) | For all designated states Nitto Denko Corporation 1-2, Shimohozumi 1-chome Ibaraki-shi, Osaka / JP | [2013/38] | Inventor(s) | 01 /
Arimitsu, Yukio c/o Nitto Denko Corporation 1-2, Shimohozumi 1-chome Ibaraki-shi / JP | [2013/38] | Representative(s) | Grünecker Patent- und Rechtsanwälte PartG mbB Leopoldstrasse 4 80802 München / DE | [N/P] |
Former [2013/38] | Grünecker, Kinkeldey, Stockmair & Schwanhäusser Leopoldstrasse 4 80802 München / DE | Application number, filing date | 12159244.8 | 13.03.2012 | [2013/38] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2639278 | Date: | 18.09.2013 | Language: | EN | [2013/38] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 15.11.2012 | Classification | IPC: | C09J7/02, H01L21/56 | [2013/38] | CPC: |
H01L21/568 (EP);
C09J7/25 (EP);
C09J7/38 (EP);
H01L24/19 (EP);
H01L24/96 (EP);
C09J2203/326 (EP);
C09J2301/312 (EP);
C09J2479/086 (EP);
C09J2483/00 (EP);
H01L2224/12105 (EP);
H01L2224/24137 (EP);
H01L2224/24195 (EP);
| C-Set: |
H01L2924/181, H01L2924/00 (EP)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2013/38] | Extension states | BA | Not yet paid | ME | Not yet paid | Title | German: | Hitzebeständiges druckempfindliches Klebeband zur Herstellung eines Halbleiterbauelements und Verfahren zur Herstellung von Halbleiterbauelementen unter Verwendung des Klebebandes | [2013/38] | English: | Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing seminconductor device using the tape | [2013/38] | French: | Ruban adhésif sensible à la pression résistant à la chaleur pour la fabrication d'un dispositif semi-conducteur et procédé de fabrication de dispositif semi-conducteur utilisant le ruban | [2013/38] | Examination procedure | 09.10.2013 | Amendment by applicant (claims and/or description) | 09.10.2013 | Examination requested [2013/47] | 09.12.2013 | Despatch of a communication from the examining division (Time limit: M04) | 23.04.2014 | Application deemed to be withdrawn, date of legal effect [2014/39] | 16.05.2014 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2014/39] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 09.12.2013 | Fees paid | Renewal fee | 27.03.2014 | Renewal fee patent year 03 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]WO2005033238 (KOLON INC [KR], et al) [X] 1-6* page 5 - page 6; examples 1-10; claims 1-3 *; | [X]WO2007075716 (3M INNOVATIVE PROPERTIES CO [US], et al) [X] 1-6 * abstract * * page 9, line 5 - page 10, line 22; examples 1-3; claims 1,8,9,12,13,16,18; tables 4,6 *; | [X]US2010323191 (SUGO YUKI [JP], et al) [X] 1-6 * abstract * * paragraphs [0014] , [0017] , [0031] , [0044] - paragraph [0046]; example -; claims 1,4-9,13-16; table 1 *; | [A] - "Dupont Kapton HN polyimide film", INTERNET CITATION, (20060101), pages 1 - 5, URL: http://www2.dupont.com/kapton/en_US/assets/downloads/pdf/HN_datasheet.pdf, (20091125), XP002557286 [A] 1 * table 2 * | by applicant | JP2001308116 | JP2001313350 | JP2010206159 |