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EP2525401
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EP About this file: EP2525401
| EP2525401 - Common drain exposed conductive clip for high power semiconductor packages [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 09.02.2018 Database last updated on 03.06.2024 | Most recent event Tooltip | 09.02.2018 | Withdrawal of application | published on 14.03.2018 [2018/11] | Applicant(s) | For all designated states International Rectifier Corporation 101 N. Sepulveda Blvd. El Segundo, CA 90245 / US | [2012/47] | Inventor(s) | 01 /
Cho, Eung San 3013 Lazy Meadow Drive Torrance, CA 90505 / US | [2012/47] | Representative(s) | JENSEN & SON 366-368 Old Street London EC1V 9LT / GB | [N/P] |
| Former [2012/47] | Dr. Weitzel & Partner Patentanwälte Friedenstrasse 10 89522 Heidenheim / DE | Application number, filing date | 12165280.4 | 24.04.2012 | [2012/47] | Priority number, date | US201113111904 | 19.05.2011 Original published format: US201113111904 | [2012/47] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP2525401 | Date: | 21.11.2012 | Language: | EN | [2012/47] | Type: | A3 Search report | No.: | EP2525401 | Date: | 10.12.2014 | Language: | EN | [2014/50] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 12.11.2014 | Classification | IPC: | H01L23/495 | [2012/47] | CPC: |
H01L23/49575 (EP,US);
H01L23/49524 (EP,US);
H01L23/49562 (EP,US);
H01L24/36 (US);
H01L24/37 (EP,US);
H01L24/40 (EP,US);
H01L24/73 (EP,US);
H01L24/84 (EP);
H01L2224/0603 (EP);
H01L2224/16245 (EP,US);
H01L2224/32245 (EP,US);
H01L2224/33181 (EP,US);
H01L2224/37147 (EP,US);
H01L2224/40095 (EP,US);
H01L2224/40137 (EP,US);
H01L2224/40245 (EP,US);
H01L2224/40247 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48247 (EP,US);
H01L2224/73221 (EP,US);
H01L2224/73265 (EP,US);
H01L2224/84801 (EP);
H01L2224/8485 (EP);
H01L23/3107 (EP,US);
H01L24/48 (EP,US);
H01L25/16 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/014 (EP,US);
H01L2924/1306 (EP,US);
| C-Set: |
H01L2224/37147, H01L2924/00 (US,EP);
H01L2224/48091, H01L2924/00012 (EP,US);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/73221, H01L2224/40245, H01L2224/48247, H01L2924/00 (EP);
H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00 (EP,US);
H01L2224/84801, H01L2924/00014 (EP);
H01L2224/8485, H01L2924/00014 (EP);
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP,US);
H01L2924/00014, H01L2224/45099 (EP,US);
H01L2924/1306, H01L2924/00 (US,EP); | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2015/29] |
| Former [2012/47] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | ME | Not yet paid | Title | German: | Exponierte Common Drain Leitungsklemme für Hochleistungs-Halbleiterpackungen | [2012/47] | English: | Common drain exposed conductive clip for high power semiconductor packages | [2012/47] | French: | Pince conductrice exposée de drain commun pour des boîtiers à semi-conducteurs de forte puissance | [2012/47] | Examination procedure | 02.06.2015 | Amendment by applicant (claims and/or description) | 02.06.2015 | Examination requested [2015/29] | 06.02.2018 | Application withdrawn by applicant [2018/11] | Fees paid | Renewal fee | 28.04.2014 | Renewal fee patent year 03 | 27.04.2015 | Renewal fee patent year 04 | 29.03.2016 | Renewal fee patent year 05 | 21.04.2017 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US2005161785 (KAWASHIMA TETSUYA [JP], et al) [A] 1,9* paragraphs [0099] - [0111]; figures 9, 10 *; | [XI]US2009230518 (LIU YONG [US], et al) [X] 1,3-7,9,11-14 * paragraphs [0025] - [0035]; figures 4A,4C,9 * [I] 2,8,10,15 |