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EP2560199
European procedure
Extract from the Register of European Patents
EP About this file: EP2560199
| EP2560199 - Process for manufacturing a through insulated interconnection in a body of semiconductor material [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 09.06.2017 Database last updated on 15.06.2024 | Most recent event Tooltip | 02.03.2018 | Lapse of the patent in a contracting state | published on 04.04.2018 [2018/14] | Applicant(s) | For all designated states STMicroelectronics S.r.l. Via C. Olivetti 2 Agrate Brianza / IT | [2013/08] | Inventor(s) | 01 /
Mastromatteo, Ubaldo Via S. Stefano, 27 20010 Bareggio / IT | 02 /
Ferrari, Paolo Via Cavallotti, 14 21013 Gallarate / IT | [2013/08] | Representative(s) | Cerbaro, Elena, et al Studio Torta S.p.A. Via Viotti, 9 10121 Torino / IT | [2014/44] |
| Former [2013/23] | Bergadano, Mirko, et al Studio Torta S.p.A. Via Viotti, 9 10121 Torino / IT | ||
| Former [2013/08] | Jorio, Paolo, et al Studio Torta S.p.A. Via Viotti, 9 10121 Torino / IT | Application number, filing date | 12190466.8 | 05.04.2002 | [2013/08] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2560199 | Date: | 20.02.2013 | Language: | EN | [2013/08] | Type: | B1 Patent specification | No.: | EP2560199 | Date: | 03.08.2016 | Language: | EN | [2016/31] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 21.01.2013 | Classification | IPC: | H01L21/768, H01L23/48 | [2013/08] | CPC: |
H01L21/76898 (EP,US);
H01L23/481 (EP,US);
H01L2224/0401 (EP,US);
H01L2224/05009 (EP,US);
H01L2224/05572 (EP,US);
H01L2224/13025 (EP,US);
| C-Set: |
H01L2224/05572, H01L2924/00012 (EP,US);
H01L2924/00014, H01L2224/05552 (US,EP);
H01L2924/0002, H01L2224/05552 (US,EP);
H01L2924/1461, H01L2924/00 (US,EP) | Designated contracting states | DE, FR, GB, IT [2016/31] |
| Former [2013/08] | DE, FR, GB, IT | Title | German: | Verfahren zum Herstellen einer durchisolierten Verbindung in einem Körper aus einem Halbleitermaterial | [2013/08] | English: | Process for manufacturing a through insulated interconnection in a body of semiconductor material | [2013/08] | French: | Procédé de fabrication d'une interconnexion isolée traversant un corps de matériau semi-conducteur | [2013/08] | Examination procedure | 06.08.2013 | Amendment by applicant (claims and/or description) | 16.08.2013 | Examination requested [2013/39] | 25.09.2015 | Despatch of a communication from the examining division (Time limit: M04) | 18.11.2015 | Reply to a communication from the examining division | 11.02.2016 | Communication of intention to grant the patent | 10.06.2016 | Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO | 10.06.2016 | Fee for grant paid | 10.06.2016 | Fee for publishing/printing paid | 28.06.2016 | Information about intention to grant a patent | 28.06.2016 | Receipt of the translation of the claim(s) | Parent application(s) Tooltip | EP02425207.4 / EP1351288 | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued (EP20020425207) is 18.10.2010 | Opposition(s) | 04.05.2017 | No opposition filed within time limit [2017/28] | Fees paid | Renewal fee | 28.11.2012 | Renewal fee patent year 03 | 28.11.2012 | Renewal fee patent year 04 | 28.11.2012 | Renewal fee patent year 05 | 28.11.2012 | Renewal fee patent year 06 | 28.11.2012 | Renewal fee patent year 07 | 28.11.2012 | Renewal fee patent year 08 | 28.11.2012 | Renewal fee patent year 09 | 28.11.2012 | Renewal fee patent year 10 | 28.11.2012 | Renewal fee patent year 11 | 24.04.2013 | Renewal fee patent year 12 | 23.10.2014 | Renewal fee patent year 13 | 27.04.2015 | Renewal fee patent year 14 | 25.04.2016 | Renewal fee patent year 15 | Penalty fee | Additional fee for renewal fee | 30.04.2014 | 13 M06 Fee paid on 23.10.2014 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | GB | 05.04.2017 | [2018/14] | Documents cited: | Search | [XA]EP0974817 (YAMATAKE CORP [JP]) [X] 1,2,12,14,15 * paragraph [0021] - paragraph [0044]; figures 3,5-10 * [A] 3-11,13,16; | [A]EP1071126 (AGILENT TECHNOLOGIES INC [US]) [A] 1-16 * paragraph [0029] - paragraph [0034] * * paragraph [0039] - paragraph [0042]; figures 2a-h *; | [A]US6313531 (GEUSIC JOSEPH E [US], et al) [A] 1-16 * column 3, line 13 - column 4, line 46 * * column 5, line 11 - line 22 ** column 5, line 49 - column 6, line 47; figures 5,7-11 * | by applicant | EP0926723 | EP1151962 |