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Extract from the Register of European Patents

EP About this file: EP2610365

EP2610365 - ELECTROLESS PLATING METHOD [Right-click to bookmark this link]
Former [2013/27]Plating catalyst and method
[2019/44]
StatusNo opposition filed within time limit
Status updated on  01.01.2021
Database last updated on 16.09.2024
FormerThe patent has been granted
Status updated on  24.01.2020
FormerGrant of patent is intended
Status updated on  09.10.2019
FormerExamination is in progress
Status updated on  11.07.2019
Most recent event   Tooltip08.07.2022Lapse of the patent in a contracting state
New state(s): AL, MK
published on 10.08.2022  [2022/32]
Applicant(s)For all designated states
Rohm and Haas Electronic Materials LLC
455 Forest Street
Marlborough, MA 01752 / US
[2013/27]
Inventor(s)01 / Chan, Dennis Chit Yiu
c/o Rohm and Haas Electronic Materials LLC
Patent Department - Paralegal
455 Forest Street
Marlborough, MA 01752 / US
02 / Kwong, Suk Kwan
Flat 2408, 24/F
Block A
On Kay Court
Ngau Tau Kok, Hong Kong / CN
03 / Yee, Dennis Kwok Wai
Flat E, 7/F, Block 6
Emerald Green
138 Shap Pat Heung Road
Yuen Long, Hong Kong / CN
04 / Zhou, Weijuan
3319, Block A, Po Nga Court
Tai Po Tai Wo Road
Hong Kong / CN
05 / Zhou, Wenjia
Flat A, 22F
Canary Court
Fanling, N.T., Hong Kong / CN
 [2013/27]
Representative(s)Houghton, Mark Phillip, et al
Patent Outsourcing Limited
1 King Street
Bakewell, Derbyshire DE45 1DZ / GB
[2020/09]
Former [2013/27]Buckley, Guy Julian
Patent Outsourcing Limited 1 King Street Bakewell
Derbyshire DE45 1DZ / GB
Application number, filing date12199767.028.12.2012
[2013/27]
Priority number, dateUS201161582264P31.12.2011         Original published format: US 201161582264 P
[2013/27]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP2610365
Date:03.07.2013
Language:EN
[2013/27]
Type: A3 Search report 
No.:EP2610365
Date:06.08.2014
Language:EN
[2014/32]
Type: B1 Patent specification 
No.:EP2610365
Date:26.02.2020
Language:EN
[2020/09]
Search report(s)(Supplementary) European search report - dispatched on:EP04.07.2014
ClassificationIPC:C23C18/18, H05K3/42, B01J31/06, C23C18/20, C23C18/30, // H05K3/24
[2019/44]
CPC:
C23C18/1841 (EP,US); C23C30/00 (KR); B01J31/06 (US);
C23C18/1844 (EP,US); C23C18/1889 (EP,US); C23C18/1893 (EP,US);
C23C18/208 (EP,US); C23C18/2086 (EP,US); C23C18/30 (EP,US);
C23C18/40 (US); C23C22/70 (KR); H05K3/422 (EP,US);
H05K2203/0307 (EP,US); H05K2203/072 (EP,US) (-)
Former IPC [2014/32]C23C18/18, C23C18/40, H05K3/42, B01J31/06, C23C18/20, C23C18/30, // H05K3/24
Former IPC [2013/27]C23C18/18, C23C18/40, H05K3/24
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2013/27]
TitleGerman:STROMLOSES ABSCHEIDUNGSVERFAHREN[2019/44]
English:ELECTROLESS PLATING METHOD[2019/44]
French:PROCÉDÉ DE PLACAGE CHIMIQUE[2019/44]
Former [2013/27]Plattierkatalysator und Verfahren
Former [2013/27]Plating catalyst and method
Former [2013/27]Catalyseur de placage et procédé
Examination procedure28.12.2012Examination requested  [2013/27]
17.07.2014Despatch of a communication from the examining division (Time limit: M04)
26.11.2014Reply to a communication from the examining division
18.07.2019Despatch of a communication from the examining division (Time limit: M04)
19.08.2019Reply to a communication from the examining division
10.10.2019Communication of intention to grant the patent
14.01.2020Fee for grant paid
14.01.2020Fee for publishing/printing paid
14.01.2020Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  17.07.2014
Opposition(s)27.11.2020No opposition filed within time limit [2021/05]
Fees paidRenewal fee
11.12.2014Renewal fee patent year 03
10.12.2015Renewal fee patent year 04
13.12.2016Renewal fee patent year 05
12.12.2017Renewal fee patent year 06
12.12.2018Renewal fee patent year 07
13.12.2019Renewal fee patent year 08
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Lapses during opposition  TooltipHU28.12.2012
AL26.02.2020
AT26.02.2020
CY26.02.2020
CZ26.02.2020
DK26.02.2020
EE26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
IT26.02.2020
LT26.02.2020
LV26.02.2020
MC26.02.2020
MK26.02.2020
MT26.02.2020
NL26.02.2020
PL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SI26.02.2020
SK26.02.2020
SM26.02.2020
TR26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
[2022/31]
Former [2022/27]HU28.12.2012
AT26.02.2020
CY26.02.2020
CZ26.02.2020
DK26.02.2020
EE26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
IT26.02.2020
LT26.02.2020
LV26.02.2020
MC26.02.2020
MT26.02.2020
NL26.02.2020
PL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SI26.02.2020
SK26.02.2020
SM26.02.2020
TR26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
Former [2022/26]AT26.02.2020
CZ26.02.2020
DK26.02.2020
EE26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
IT26.02.2020
LT26.02.2020
LV26.02.2020
MC26.02.2020
NL26.02.2020
PL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SI26.02.2020
SK26.02.2020
SM26.02.2020
TR26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
Former [2021/40]AT26.02.2020
CZ26.02.2020
DK26.02.2020
EE26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
IT26.02.2020
LT26.02.2020
LV26.02.2020
MC26.02.2020
NL26.02.2020
PL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SI26.02.2020
SK26.02.2020
SM26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
Former [2021/10]AT26.02.2020
CZ26.02.2020
DK26.02.2020
EE26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
IT26.02.2020
LT26.02.2020
LV26.02.2020
NL26.02.2020
PL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SI26.02.2020
SK26.02.2020
SM26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
Former [2020/50]CZ26.02.2020
DK26.02.2020
EE26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
LT26.02.2020
LV26.02.2020
NL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SK26.02.2020
SM26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
Former [2020/49]CZ26.02.2020
DK26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
LT26.02.2020
LV26.02.2020
NL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SK26.02.2020
SM26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
Former [2020/48]DK26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
LT26.02.2020
LV26.02.2020
NL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SM26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
Former [2020/47]DK26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
LT26.02.2020
LV26.02.2020
NL26.02.2020
RS26.02.2020
SE26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
Former [2020/45]FI26.02.2020
HR26.02.2020
LV26.02.2020
NL26.02.2020
RS26.02.2020
SE26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
Former [2020/40]FI26.02.2020
HR26.02.2020
LV26.02.2020
RS26.02.2020
SE26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
Former [2020/39]FI26.02.2020
HR26.02.2020
LV26.02.2020
RS26.02.2020
SE26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
Former [2020/38]FI26.02.2020
HR26.02.2020
LV26.02.2020
RS26.02.2020
SE26.02.2020
NO26.05.2020
GR27.05.2020
Former [2020/37]FI26.02.2020
HR26.02.2020
LV26.02.2020
RS26.02.2020
SE26.02.2020
NO26.05.2020
Former [2020/35]FI26.02.2020
NO26.05.2020
Documents cited:Search[XY]US2004043153  (OKUHAMA YOSHIAKI [JP], et al) [X] 1,2,6,8 * abstract * * paragraph [0093] - paragraph [0094] * * paragraph [0102] * * paragraph [0050] * * paragraph [0125] * [Y] 3;
 [X]US2010084599  (LEWIS JENNIFER A [US], et al) [X] 1,4,6 * abstract * * paragraph [0042] *;
 [X]US2011303885  (VANHEUSDEN KAREL [US], et al) [X] 1,4,6 * abstract * * paragraph [0035] ** paragraph [0045] *;
 [XYI]  - A MAYER ET AL, "ORIGINAL CONTRIBUTION", COLLOID POLYM SCI, (19980101), vol. 276, pages 769 - 779, XP055124343 [X] 1,4,6,7 * abstract * * Experimental section; page 771 * [Y] 3 [I] 5

DOI:   http://dx.doi.org/10.1007/s003960050309
ExaminationJP4558934B
by applicantUS3011920
 US3904792
 US3993799
 US4725314
 JPH10229280
 JP2001044242
 US6645557
 US7166152
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