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EP2766922
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EP About this file: EP2766922
| EP2766922 - POWER SEMI-CONDUCTOR CHIP WITH A METAL MOULDED BODY FOR CONTACTING THICK WIRES OR STRIPS, AND METHOD FOR THE PRODUCTION THEREOF [Right-click to bookmark this link] | Status | Examination is in progress Status updated on 03.03.2017 Database last updated on 15.06.2024 | Most recent event Tooltip | 19.12.2023 | New entry: Date of oral proceedings | Applicant(s) | For all designated states Danfoss Silicon Power GmbH Husumer Strasse 251 24941 Flensburg / DE | [2014/34] | Inventor(s) | 01 /
BECKER, Martin Franckstrasse 6 24118 Kiel / DE | 02 /
EISELE, Ronald Faulstrasse 21 24229 Surendorf / DE | 03 /
OSTERWALD, Frank Jakobsleiter 7 24159 Kiel / DE | 04 /
RUDZKI, Jacek Gurlittstrasse 6 24106 Kiel / DE | [2014/34] | Representative(s) | Lobemeier, Martin Landolf, et al c/o lbmr. Patent- und Markenrecht Holtenauer Strasse 57 24105 Kiel / DE | [N/P] |
| Former [2014/34] | Lobemeier, Martin Landolf Boehmert & Boehmert Anwaltssozietät Niemannsweg 133 24105 Kiel / DE | Application number, filing date | 12769904.9 | 10.09.2012 | WO2012EP03787 | Priority number, date | DE201110115887 | 15.10.2011 Original published format: DE102011115887 | [2014/34] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | WO2013053420 | Date: | 18.04.2013 | Language: | DE | [2013/16] | Type: | A1 Application with search report | No.: | EP2766922 | Date: | 20.08.2014 | Language: | DE | The application published by WIPO in one of the EPO official languages on 18.04.2013 takes the place of the publication of the European patent application. | [2014/34] | Search report(s) | International search report - published on: | EP | 18.04.2013 | Classification | IPC: | H01L21/60, H01L23/485 | [2014/34] | CPC: |
A41F1/00 (EP);
H01L24/05 (EP,CN,US);
H01L23/4924 (US);
A41F15/02 (EP);
H01L21/6835 (US);
H01L23/562 (US);
H01L24/03 (EP);
H01L24/06 (EP);
H01L24/48 (EP,CN,US);
H01L24/49 (EP,CN,US);
H01L24/85 (US);
H01L2221/68372 (US);
H01L2224/03013 (EP,CN,US);
H01L2224/0311 (EP,CN,US);
H01L2224/03438 (EP);
H01L2224/04042 (EP,US);
H01L2224/05139 (EP);
H01L2224/05541 (EP);
H01L2224/05551 (EP);
H01L2224/05554 (EP);
H01L2224/05573 (EP);
H01L2224/05624 (EP);
H01L2224/05639 (EP,US);
H01L2224/05644 (EP,US);
H01L2224/05647 (EP,US);
H01L2224/0603 (EP,US);
H01L2224/06051 (EP);
H01L2224/061 (EP);
H01L2224/0612 (EP);
H01L2224/06181 (EP);
H01L2224/12105 (EP);
H01L2224/2612 (EP);
H01L2224/2908 (EP,CN,US);
H01L2224/32225 (EP,CN,US);
H01L2224/45014 (EP,CN,US);
H01L2224/45015 (EP,CN,US);
H01L2224/45124 (EP,US);
H01L2224/45139 (EP,US);
H01L2224/45147 (EP,CN,US);
H01L2224/4801 (EP);
H01L2224/48227 (EP,CN,US);
H01L2224/48472 (EP,CN,US);
H01L2224/48475 (EP);
H01L2224/48491 (EP,CN,US);
H01L2224/48824 (EP);
H01L2224/48839 (EP);
H01L2224/48844 (EP);
H01L2224/48847 (EP);
H01L2224/49111 (EP,CN,US);
H01L2224/49176 (EP);
H01L2224/73265 (EP,CN,US);
H01L2224/786 (EP,CN,US);
H01L2224/83801 (EP,CN,US);
H01L2224/8382 (EP,CN,US);
H01L2224/8384 (EP,CN,US);
H01L2224/8385 (EP);
H01L2224/85001 (US);
H01L24/45 (EP,US);
H01L2924/00011 (EP);
H01L2924/00014 (EP,US);
H01L2924/00015 (EP,CN,US);
H01L2924/01013 (EP,CN,US);
H01L2924/01014 (EP,CN,US);
H01L2924/01015 (EP,CN,US);
H01L2924/01028 (EP,CN,US);
H01L2924/01029 (EP,CN,US);
H01L2924/01047 (EP,CN,US);
H01L2924/10162 (EP);
H01L2924/10253 (EP,CN,US);
| C-Set: |
H01L2224/04042, H01L2924/00 (US,EP);
H01L2224/05139, H01L2924/00014 (EP);
H01L2224/05541, H01L2924/206 (EP);
H01L2224/05624, H01L2924/00014 (EP);
H01L2224/05639, H01L2924/00014 (EP);
H01L2224/05644, H01L2924/00014 (EP);
H01L2224/05647, H01L2924/00014 (EP);
H01L2224/061, H01L2924/00012 (EP);
H01L2224/45014, H01L2224/45147, H01L2924/00 (EP,CN,US);
H01L2224/45014, H01L2924/00014 (CN,US,EP);
H01L2224/45015, H01L2924/2076 (US,EP,CN);
H01L2224/45124, H01L2924/00015 (EP,US);
H01L2224/45139, H01L2924/00 (US);
H01L2224/45139, H01L2924/00011 (EP,US);
H01L2224/45147, H01L2924/00014 (CN,US,EP);
H01L2224/4801, H01L2924/207 (EP);
H01L2224/48472, H01L2224/48227, H01L2924/00 (CN,US,EP);
H01L2224/48824, H01L2924/00 (EP);
H01L2224/48839, H01L2924/00 (EP);
H01L2224/48844, H01L2924/00 (EP);
H01L2224/48847, H01L2924/00 (EP);
H01L2224/49111, H01L2224/48472, H01L2924/00 (EP,CN,US);
H01L2224/49111, H01L2924/00014 (US,EP,CN);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (CN,US,EP);
H01L2224/83801, H01L2924/00015 (US,EP,CN);
H01L2224/8382, H01L2924/00015 (US,EP,CN);
H01L2224/8384, H01L2924/00015 (CN,US,EP);
H01L2924/00011, H01L2924/01049 (EP);
H01L2924/00014, H01L2224/45014, H01L2924/206 (US,EP);
H01L2924/00014, H01L2224/45099 (EP);
H01L2924/00015, H01L2224/45124 (US,EP,CN);
H01L2924/01015, H01L2924/00 (US,EP,CN); | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2014/34] | Title | German: | LEISTUNGSHALBLEITERCHIP MIT METALLISCHEN FORMKÖRPERN ZUM KONTAKTIEREN MIT DICKDRÄHTEN ODER BÄNDCHEN SOWIE VERFAHREN ZU DESSEN HERSTELLUNG | [2014/34] | English: | POWER SEMI-CONDUCTOR CHIP WITH A METAL MOULDED BODY FOR CONTACTING THICK WIRES OR STRIPS, AND METHOD FOR THE PRODUCTION THEREOF | [2014/34] | French: | PUCE DE SEMI-CONDUCTEUR DE PUISSANCE DOTÉE DE CORPS MOULÉS MÉTALLIQUES POUR LA MISE EN CONTACT ÉLECTRIQUE AVEC DE GROS FILS OU DES BANDELETTES, ET PROCÉDÉ DE PRODUCTION | [2014/34] | Entry into regional phase | 13.05.2014 | National basic fee paid | 13.05.2014 | Designation fee(s) paid | 13.05.2014 | Examination fee paid | Examination procedure | 13.05.2014 | Amendment by applicant (claims and/or description) | 13.05.2014 | Examination requested [2014/34] | 02.03.2017 | Despatch of a communication from the examining division (Time limit: M06) | 04.09.2017 | Reply to a communication from the examining division | 11.03.2021 | Despatch of a communication from the examining division (Time limit: M06) | 13.09.2021 | Reply to a communication from the examining division | 20.06.2024 | Date of oral proceedings | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 02.03.2017 | Fees paid | Renewal fee | 12.09.2014 | Renewal fee patent year 03 | 11.09.2015 | Renewal fee patent year 04 | 13.09.2016 | Renewal fee patent year 05 | 12.09.2017 | Renewal fee patent year 06 | 11.09.2018 | Renewal fee patent year 07 | 13.09.2019 | Renewal fee patent year 08 | 14.09.2020 | Renewal fee patent year 09 | 15.09.2021 | Renewal fee patent year 10 | 11.08.2022 | Renewal fee patent year 11 | 24.08.2023 | Renewal fee patent year 12 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [X]JPS56101752 (MITSUBISHI ELECTRIC CORP); | [X]EP0520294 (SIEMENS AG [DE]); | [X]US5510650 (ERSKINE JR JAMES C [US]); | [XAI]EP1772900 (SEMIKRON ELEKTRONIK GMBH [DE]); | [XAI]US2007246833 (SOGA TASAO [JP], et al); | [X]US2007278550 (ASAI YASUTOMI [JP], et al) |