-
EP2579312
European procedure
- EP About this file
- EP Legal status
- EP Federated register
- EP Event history
- EP Citations
- EP Patent family
- EP All documents
Extract from the Register of European Patents
EP About this file: EP2579312
| EP2579312 - Solid state imaging device and manufacturing method thereof [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 26.12.2014 Database last updated on 19.10.2024 | Most recent event Tooltip | 26.12.2014 | Application deemed to be withdrawn | published on 28.01.2015 [2015/05] | Applicant(s) | For all designated states Fujifilm Corporation 26-30, Nishiazabu 2-chome Minato-ku Tokyo 106-8620 / JP | [N/P] |
| Former [2013/15] | For all designated states Fujifilm Corporation 26-30, Nishiazabu 2-chome Minato-ku Tokyo 106-8620 / JP | Inventor(s) | 01 /
Nishida, Kazuhiro c/o Fujifilm Dimatix, Inc. 2250 Martin Avenue Santa Clara, CA 95050 / US | 02 /
Shimamura, Hitoshi c/o Fujifilm Corporation 324, Uetake-cho 1-chome Kita-ku, Saitama-shi Saitama / JP | 03 /
Takasaki, Kosuke c/o Fujifilm Corporation 210, Nakanuma Minami-ashigara-shi Kanagawa / JP | [2013/15] | Representative(s) | Klunker . Schmitt-Nilson . Hirsch Patentanwälte Destouchesstraße 68 80796 München / DE | [N/P] |
| Former [2013/15] | Klunker . Schmitt-Nilson . Hirsch Patentanwälte Destouchesstrasse 68 80796 München / DE | Application number, filing date | 13150059.7 | 24.03.2006 | [2013/15] | Priority number, date | JP20050087968 | 25.03.2005 Original published format: JP 2005087968 | [2013/15] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP2579312 | Date: | 10.04.2013 | Language: | EN | [2013/15] | Type: | A3 Search report | No.: | EP2579312 | Date: | 29.05.2013 | Language: | EN | [2013/22] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 03.05.2013 | Classification | IPC: | H01L27/146, H01L23/10, H01L21/683, H01L27/148 | [2013/22] | CPC: |
H01L21/6835 (EP,US);
H01L24/97 (EP,US);
H01L27/14618 (EP,US);
H01L27/14683 (EP,US);
H01L21/561 (EP,US);
H01L21/566 (EP,US);
H01L2223/54433 (EP,US);
H01L2223/54486 (EP,US);
H01L2224/32225 (EP,US);
H01L2224/48227 (EP,US);
H01L2224/48247 (EP,US);
H01L2224/48465 (EP,US);
H01L2224/73265 (EP,US);
H01L2224/8501 (EP,US);
H01L2224/85013 (EP,US);
H01L2224/97 (EP,US);
H01L23/3121 (EP,US);
H01L23/544 (EP,US);
H01L25/0657 (EP,US);
H01L27/14621 (EP,US);
H01L27/14627 (EP,US);
H01L27/14643 (EP,US);
H01L27/14685 (EP,US);
H01L27/148 (EP,US);
H01L2924/01046 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/10253 (EP,US);
H01L2924/12042 (EP,US);
H01L2924/15183 (EP,US);
H01L2924/15311 (EP,US);
H01L2924/15788 (EP,US);
H01L2924/16195 (EP,US);
H01L2924/16235 (EP,US);
H01L2924/181 (EP,US);
H01L2924/1815 (EP,US);
H01L2924/351 (EP,US)
(-)
| C-Set: |
H01L2224/48465, H01L2224/48227 (US,EP);
H01L2224/48465, H01L2224/48227, H01L2924/00 (US,EP);
H01L2224/48465, H01L2224/48247, H01L2924/00 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (US,EP);
H01L2224/97, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (EP,US);
H01L2224/97, H01L2224/85 (EP,US);
H01L2924/10253, H01L2924/00 (EP,US);
H01L2924/12042, H01L2924/00 (US,EP);
H01L2924/15311, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (EP,US);
H01L2924/15788, H01L2924/00 (US,EP); |
| Former IPC [2013/15] | H01L27/146, H01L23/10, H01L21/683 | Designated contracting states | DE, FR, GB [2013/15] | Title | German: | Halbleiter-Bildgebungsbauelement und Herstellungsverfahren dafür | [2013/15] | English: | Solid state imaging device and manufacturing method thereof | [2013/15] | French: | Dispositif d'imagerie à semi-conducteurs et son procédé de fabrication | [2013/15] | Examination procedure | 15.11.2013 | Amendment by applicant (claims and/or description) | 15.11.2013 | Examination requested [2013/52] | 12.05.2014 | Despatch of a communication from the examining division (Time limit: M03) | 23.08.2014 | Application deemed to be withdrawn, date of legal effect [2015/05] | 22.09.2014 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2015/05] | Parent application(s) Tooltip | EP06730719.9 / EP1861879 | Fees paid | Renewal fee | 02.01.2013 | Renewal fee patent year 03 | 02.01.2013 | Renewal fee patent year 04 | 02.01.2013 | Renewal fee patent year 05 | 02.01.2013 | Renewal fee patent year 06 | 02.01.2013 | Renewal fee patent year 07 | 27.03.2013 | Renewal fee patent year 08 | 27.03.2014 | Renewal fee patent year 09 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US6358629 (AGA FUMIAKI [JP]); | [A]US2002195696 (YONEDA YOSHIHIRO [JP]); | [Y]JP2003154551 (SONY CORP); | [XI]US2003222333 (BOLKEN TODD O [US], et al); | [A]US2004051168 (ARAI YOSHIYUKI [JP], et al); | [XYI]EP1445803 (SHARP KK [JP]); | [Y]WO2004090033 (HITACHI CHEMICAL CO LTD [JP], et al); | [A]JP2004296584 (SONY CORP); | [XYI]JP2004363400 (SANYO ELECTRIC CO, et al); | US2006214153 [ ] (IKEZAWA RYOICHI [JP], et al) | by applicant | JP2001257334 | US6777767 |