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Extract from the Register of European Patents

EP About this file: EP2648238

EP2648238 - Light-emitting element mounting package, and manufacturing method of the same [Right-click to bookmark this link]
Former [2013/41]Light-emitting element mounting package, manufacturing method of the same, and light-emitting element package
[2019/04]
StatusNo opposition filed within time limit
Status updated on  06.03.2020
Database last updated on 10.08.2024
FormerThe patent has been granted
Status updated on  29.03.2019
FormerGrant of patent is intended
Status updated on  07.01.2019
FormerExamination is in progress
Status updated on  11.05.2018
Most recent event   Tooltip08.07.2022Lapse of the patent in a contracting state
New state(s): MK		published on 10.08.2022  [2022/32]
Applicant(s)For all designated states
Shinko Electric Industries Co., Ltd.
80, Oshimada-machi
Nagano-shi, Nagano 381-2287 / JP
[2013/41]
Inventor(s)01 / Nakamura, Atsushi
c/o SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, Oshimada-machi Nagano-Shi
Nagano 381-2287 / JP
02 / Nakanishi, Tsukasa
c/o SHINKO ELECTRIC INDUSTRIES CO., LTD.
80 Oshimada-machi, Nagano-Shi
Nagano 381-2287 / JP
03 / Matsumoto, Takayuki
c/o SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, Oshimada-machi, Nagano-Shi
Nagano 381-2287 / JP
 [2013/41]
Representative(s)Regimbeau
20, rue de Chazelles
75847 Paris Cedex 17 / FR
[2013/41]
Application number, filing date13159690.018.03.2013
[2013/41]
Priority number, dateJP2012006831423.03.2012         Original published format: JP 2012068314
JP2012025542821.11.2012         Original published format: JP 2012255428
[2013/41]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP2648238
Date:09.10.2013
Language:EN
[2013/41]
Type: A3 Search report 
No.:EP2648238
Date:14.01.2015
Language:EN
[2015/03]
Type: B1 Patent specification 
No.:EP2648238
Date:01.05.2019
Language:EN
[2019/18]
Search report(s)(Supplementary) European search report - dispatched on:EP11.12.2014
ClassificationIPC:H01L33/48, H01L33/64, // H05K1/02, H05K1/11, H01L33/62
[2015/03]
CPC:
H01L33/647 (EP,US); H01L33/64 (US); H01L33/486 (EP,US);
H01L33/62 (EP,US); H01L2224/16 (EP,US); H05K1/0206 (EP,US);
H05K1/113 (EP,US) (-)
Former IPC [2013/41]H01L33/48, // H05K1/02, H05K1/11
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2015/23]
Former [2013/41]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:Montageverpackung für lichtemittierendes Element, und Herstellungsverfahren dafür[2019/04]
English:Light-emitting element mounting package, and manufacturing method of the same[2019/04]
French:Ensemble de montage d'élément électroluminescent, et procédé de fabrication correspondant[2019/04]
Former [2013/41]Montageverpackung für lichtemittierendes Element, Herstellungsverfahren dafür und lichtemittierende Elementverpackung
Former [2013/41]Light-emitting element mounting package, manufacturing method of the same, and light-emitting element package
Former [2013/41]Ensemble de montage d'élément électroluminescent, son procédé de fabrication et ensemble d'élément électroluminescent
Examination procedure23.04.2015Examination requested  [2015/23]
22.06.2015Amendment by applicant (claims and/or description)
11.05.2018Despatch of a communication from the examining division (Time limit: M04)
27.08.2018Reply to a communication from the examining division
08.01.2019Communication of intention to grant the patent
18.03.2019Fee for grant paid
18.03.2019Fee for publishing/printing paid
18.03.2019Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  11.05.2018
Opposition(s)04.02.2020No opposition filed within time limit [2020/15]
Fees paidRenewal fee
10.03.2015Renewal fee patent year 03
10.03.2016Renewal fee patent year 04
10.03.2017Renewal fee patent year 05
13.03.2018Renewal fee patent year 06
13.03.2019Renewal fee patent year 07
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU18.03.2013
AL01.05.2019
AT01.05.2019
CY01.05.2019
CZ01.05.2019
DK01.05.2019
EE01.05.2019
ES01.05.2019
FI01.05.2019
HR01.05.2019
IT01.05.2019
LT01.05.2019
LV01.05.2019
MC01.05.2019
MK01.05.2019
MT01.05.2019
NL01.05.2019
PL01.05.2019
RO01.05.2019
RS01.05.2019
SE01.05.2019
SI01.05.2019
SK01.05.2019
SM01.05.2019
TR01.05.2019
BG01.08.2019
NO01.08.2019
GR02.08.2019
IS01.09.2019
PT01.09.2019
[2022/32]
Former [2022/27]HU18.03.2013
AL01.05.2019
AT01.05.2019
CY01.05.2019
CZ01.05.2019
DK01.05.2019
EE01.05.2019
ES01.05.2019
FI01.05.2019
HR01.05.2019
IT01.05.2019
LT01.05.2019
LV01.05.2019
MC01.05.2019
MT01.05.2019
NL01.05.2019
PL01.05.2019
RO01.05.2019
RS01.05.2019
SE01.05.2019
SI01.05.2019
SK01.05.2019
SM01.05.2019
TR01.05.2019
BG01.08.2019
NO01.08.2019
GR02.08.2019
IS01.09.2019
PT01.09.2019
Former [2020/49]AL01.05.2019
AT01.05.2019
CZ01.05.2019
DK01.05.2019
EE01.05.2019
ES01.05.2019
FI01.05.2019
HR01.05.2019
IT01.05.2019
LT01.05.2019
LV01.05.2019
MC01.05.2019
NL01.05.2019
PL01.05.2019
RO01.05.2019
RS01.05.2019
SE01.05.2019
SI01.05.2019
SK01.05.2019
SM01.05.2019
TR01.05.2019
BG01.08.2019
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GR02.08.2019
IS01.09.2019
PT01.09.2019
Former [2020/25]AL01.05.2019
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CZ01.05.2019
DK01.05.2019
EE01.05.2019
ES01.05.2019
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HR01.05.2019
IT01.05.2019
LT01.05.2019
LV01.05.2019
NL01.05.2019
PL01.05.2019
RO01.05.2019
RS01.05.2019
SE01.05.2019
SI01.05.2019
SK01.05.2019
SM01.05.2019
TR01.05.2019
BG01.08.2019
NO01.08.2019
GR02.08.2019
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PT01.09.2019
Former [2020/17]AL01.05.2019
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EE01.05.2019
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FI01.05.2019
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LT01.05.2019
LV01.05.2019
NL01.05.2019
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SE01.05.2019
SK01.05.2019
SM01.05.2019
TR01.05.2019
BG01.08.2019
NO01.08.2019
GR02.08.2019
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Former [2020/14]AL01.05.2019
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PT01.09.2019
Former [2020/12]AL01.05.2019
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PT01.09.2019
Former [2020/11]AL01.05.2019
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EE01.05.2019
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LT01.05.2019
LV01.05.2019
NL01.05.2019
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SE01.05.2019
SK01.05.2019
BG01.08.2019
NO01.08.2019
GR02.08.2019
IS01.09.2019
PT01.09.2019
Former [2020/10]AL01.05.2019
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ES01.05.2019
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NL01.05.2019
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RS01.05.2019
SE01.05.2019
BG01.08.2019
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IS01.09.2019
PT01.09.2019
Former [2020/09]AL01.05.2019
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ES01.05.2019
FI01.05.2019
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NL01.05.2019
RS01.05.2019
SE01.05.2019
BG01.08.2019
NO01.08.2019
GR02.08.2019
IS01.09.2019
PT01.09.2019
Former [2020/04]AL01.05.2019
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FI01.05.2019
HR01.05.2019
LT01.05.2019
LV01.05.2019
NL01.05.2019
RS01.05.2019
SE01.05.2019
BG01.08.2019
NO01.08.2019
GR02.08.2019
IS01.09.2019
PT01.09.2019
Former [2019/51]AL01.05.2019
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FI01.05.2019
HR01.05.2019
LT01.05.2019
LV01.05.2019
NL01.05.2019
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SE01.05.2019
BG01.08.2019
NO01.08.2019
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PT01.09.2019
Former [2019/50]AL01.05.2019
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FI01.05.2019
HR01.05.2019
LT01.05.2019
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NL01.05.2019
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SE01.05.2019
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PT01.09.2019
Former [2019/49]AL01.05.2019
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FI01.05.2019
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NL01.05.2019
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PT01.09.2019
Former [2019/48]ES01.05.2019
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PT01.09.2019
Former [2019/47]ES01.05.2019
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LT01.05.2019
NO01.08.2019
Documents cited:Search[A]JP2005217216  (HITACHI CABLE) [A] 1 * abstract ** figures 1,2 *;
 [XY]US2009001404  (OHATA TAKAFUMI [JP]) [X] 1-5,7-10,12,13 * abstract * * paragraph [0060] - paragraph [0067]; figures 1A,1B * * paragraph [0107] - paragraph [0109]; figure 9 * * paragraph [0114]; figure 12 * [Y] 6,15;
 [Y]JP2009246066  (SUMITOMO METAL ELECTRONICS DEV) [Y] 15 * paragraphs [0013] - [0016]; figures 1(b),3 * * abstract *;
 [X]US2009273002  (CHIOU WEN-CHIH [TW], et al) [X] 1-5,7-10,12,13 * abstract * * paragraphs [0033] , [0034] , [0037] , [0038] , [0040] , [0043] , [0044]; figure 7 *;
 [Y]JP2011029634  (SHARP KK) [Y] 6 * abstract * * paragraph [0079] - paragraph [0085]; figures 15A, 15B *;
 [X]EP2355140  (ASAHI GLASS CO LTD [JP]) [X] 1-3,5,7,12,13 * abstract * * paragraphs [0021] - [0026]; figures 1,2 *;
 [XI]WO2012002580  (CITIZEN HOLDINGS CO LTD [JP], et al) [X] 1-5,7,11-13 * abstract * * page 17 - page 24; figures 10-13 * [I] 14;
 [A]JP2012031401  (HITACHI CHEMICAL CO LTD) [A] 5,14 * abstract * * paragraph [0098]; figure 1 *
ExaminationUS2011108857
by applicantJP2003092011
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.