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EP2675253
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EP About this file: EP2675253
| EP2675253 - Flexible-rigid circuit board composite [Right-click to bookmark this link] | |||
| Former [2013/51] | Flexible-rigid circuit board composite and method for producing a flexible-rigid circuit board composite | ||
| [2021/12] | Status | The application is deemed to be withdrawn Status updated on 03.12.2021 Database last updated on 19.10.2024 | |
| Former | Grant of patent is intended Status updated on 18.03.2021 | ||
| Former | Examination is in progress Status updated on 27.07.2018 | Most recent event Tooltip | 03.12.2021 | Application deemed to be withdrawn | published on 05.01.2022 [2022/01] | Applicant(s) | For all designated states BIOTRONIK SE & Co. KG Woermannkehre 1 12359 Berlin / DE | [2013/51] | Inventor(s) | 01 /
Sporon-Fiedler, Frederik 4194 SW Fairhaven Dr. Corvallis, Oregon 97333 / US | 02 /
Carraway, Jana 12494 SW 133rd Ave Tigard, Oregon 97223 / US | 03 /
Henderson, Michael 1886 North Teakwood St. Canby, Oregon 97013 / US | [2013/51] | Representative(s) | Biotronik Corporate Services SE Corporate Intellectual Property Sieversufer 7-9 12359 Berlin / DE | [N/P] |
| Former [2013/51] | Lindner-Vogt, Karin L., et al Biotronik SE & Co. KG Corporate Intellectual Properties Woermannkehre 1 12359 Berlin / DE | Application number, filing date | 13167449.1 | 13.05.2013 | [2013/51] | Priority number, date | US201261659988P | 15.06.2012 Original published format: US 201261659988 P | [2013/51] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2675253 | Date: | 18.12.2013 | Language: | EN | [2013/51] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 30.10.2013 | Classification | IPC: | H05K3/36, H05K3/46 | [2013/51] | CPC: |
H05K3/363 (EP,US);
H05K1/0278 (US);
H05K3/361 (US);
H05K3/368 (EP,US);
H05K3/4638 (EP,US);
H05K2203/166 (EP,US);
Y10T29/49126 (EP,US)
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| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2013/51] | Extension states | BA | Not yet paid | ME | Not yet paid | Title | German: | Flexibel-steifer Leiterplattenverbund | [2021/12] | English: | Flexible-rigid circuit board composite | [2021/12] | French: | Composite de carte de circuit flexible-rigide | [2021/12] |
| Former [2013/51] | Flexibel-steifer Leiterplattenverbund und Verfahren zur Herstellung eines flexibel-steifen Leiterplattenverbunds | ||
| Former [2013/51] | Flexible-rigid circuit board composite and method for producing a flexible-rigid circuit board composite | ||
| Former [2013/51] | Composite de carte de circuit flexible-rigide et procédé de production d'un tel composite | Examination procedure | 12.06.2014 | Amendment by applicant (claims and/or description) | 12.06.2014 | Examination requested [2014/30] | 27.07.2018 | Despatch of a communication from the examining division (Time limit: M06) | 01.02.2019 | Reply to a communication from the examining division | 19.03.2021 | Communication of intention to grant the patent | 30.07.2021 | Application deemed to be withdrawn, date of legal effect [2022/01] | 19.08.2021 | Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time [2022/01] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 27.07.2018 | Fees paid | Renewal fee | 11.05.2015 | Renewal fee patent year 03 | 04.05.2016 | Renewal fee patent year 04 | 10.05.2017 | Renewal fee patent year 05 | 24.05.2018 | Renewal fee patent year 06 | 28.05.2019 | Renewal fee patent year 07 | 25.05.2020 | Renewal fee patent year 08 | 26.05.2021 | Renewal fee patent year 09 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP0065425 (MATSUSHITA ELECTRIC IND CO LTD [JP]) [A] 8-15 * figures 2-9 *; | [A]WO2007116344 (KONINKL PHILIPS ELECTRONICS NV [NL], et al) [A] 1-15 * page 10, line 19 - page 12, line 32; figures 1,2 *; | [X]US2008045077 (CHOU YUNG-WEI [CN]) [X] 1,2 * paragraph [0039] - paragraph [0043]; figures 5A-7D *; | [IA]US2009205200 (ROSENBLATT MICHAEL N [US], et al) [I] 12 * paragraph [0024] - paragraph [0037]; figures 1-5B *[A] 13-15; | [X]US2009288871 (LIN CHIH-TSUNG [TW]) [X] 1,2,5,8 * paragraph [0015] - paragraph [0019]; figures 2,3 *; | [A]WO2010086416 (IMEC [BE], et al) [A] 1-15 * figures 5-10 * | by applicant | US2004118595 | US7690104 |