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Extract from the Register of European Patents

EP About this file: EP2840387

EP2840387 - Lock-in thermography method and system for hot spot localization [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  09.10.2015
Database last updated on 02.07.2024
Most recent event   Tooltip09.10.2015Application deemed to be withdrawnpublished on 11.11.2015  [2015/46]
Applicant(s)For all designated states
DCG Systems, Inc.
45900 Northport Loop East
Fremont, CA 94538 / US
For all designated states
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Hansastrasse 27c
80686 München / DE
[N/P]
Former [2015/09]For all designated states
DCG Systems, Inc.
45900 Northport Loop East
Fremont, CA 94538 / US
For all designated states
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Hansastrasse 27c
80686 München / DE
Inventor(s)01 / Schmidt, Christian
c/o DCG Systems GmbH
Am Weichselgarten 7
91058 Erlangen / DE
02 / Meinhardt-Wildegger, Raiko
c/o DCG Systems GmbH
Am Weichselgarten 7
91058 Erlangen / DE
03 / Altmann, Frank
Saalestraße 1
06118 Halle / DE
04 / Naumann, Falk
Otto-Kilian-Straße 57
06160 Halle / DE
 [2015/09]
Representative(s)Puschmann Borchert Kaiser Klettner Patentanwälte Partnerschaft mbB
Postfach 10 12 31
80086 München / DE
[N/P]
Former [2015/09]Puschmann Borchert Bardehle Patentanwälte Partnerschaft mbB
Postfach 10 12 31
80086 München / DE
Application number, filing date13181506.023.08.2013
[2015/09]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP2840387
Date:25.02.2015
Language:EN
[2015/09]
Search report(s)(Supplementary) European search report - dispatched on:EP24.10.2013
ClassificationIPC:G01N25/72, G01R31/309
[2015/09]
CPC:
G01N25/72 (EP,US); G01J5/0066 (US); G01J5/0096 (US);
G01J5/10 (US); G01R31/309 (US); G01R31/311 (EP)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2015/09]
Extension statesBANot yet paid
MENot yet paid
TitleGerman:Lock-in Thermographie Verfahren und Vorrichtung zur Lokalisierung von heißen Punkten[2015/09]
English:Lock-in thermography method and system for hot spot localization[2015/09]
French:Procédé et dispositif de thermographie lock-in pour localiser des points chauds[2015/09]
Examination procedure06.06.2014Amendment by applicant (claims and/or description)
06.06.2014Examination requested  [2015/09]
14.07.2014Despatch of a communication from the examining division (Time limit: M04)
21.11.2014Reply to a communication from the examining division
26.01.2015Despatch of a communication from the examining division (Time limit: M04)
06.06.2015Application deemed to be withdrawn, date of legal effect  [2015/46]
06.07.2015Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2015/46]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  14.07.2014
Fees paidPenalty fee
Additional fee for renewal fee
31.08.201503   M06   Not yet paid
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Documents cited:Search[Y]US6812468  (BAUMANN JOACHIM [DE], et al) [Y] 1-15 * column 2, lines 18-32; figures 1, 2 *;
 [YD]WO2011156527  (DCG SYSTEMS INC [US], et al) [YD] 1-15 * paragraph [0037] - paragraph [0057]; figures 4-8, 11A, 11B *;
 [Y]  - Fernando Lopez Rodriguez ET AL, "NON-DESTRUCTIVE EVALUATION OF COMPOSITES MATERIALS BY PULSED-PHASE THERMOGRAPHY: DEPTH INVERSION", Proceedings of COBEM 2011, (20111028), pages 1 - 11, URL: http://emc.ufsc.br/labtermo/publica/ac19_COB25761_2011 TIR.pdf, (20131003), XP055082429 [Y] 1-15 * Introduction, 2.2 Principles of Pulsed Phase Thermography, 2.3 Data acquisition and processing in PPT;; figures 1,2,7,8 *
 [YD]  - CHRISTIAN SCHMIDT ET AL, "Non-destructive defect depth determination at fully packaged and stacked die devices using Lock-in Thermography", PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2010 17TH IEEE INTERNATIONAL SYMPOSIUM ON THE, IEEE, PISCATAWAY, NJ, USA, (20100705), ISBN 978-1-4244-5596-6, pages 1 - 5, XP031720074 [YD] 1-15 * the whole document *
 [A]  - MALDAGUE X ET AL, "PULSE PHASE INFRARED THERMOGRAPHY", JOURNAL OF APPLIED PHYSICS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, (19960301), vol. 79, no. 5, doi:10.1063/1.362662, ISSN 0021-8979, pages 2694 - 2698, XP000593846 [A] 1-15 * the whole document *

DOI:   http://dx.doi.org/10.1063/1.362662
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.