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Extract from the Register of European Patents

EP About this file: EP2738806

EP2738806 - Semiconductor device including a redistribution layer and metallic pillars coupled thereto [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 09.08.2019 Database last updated on 15.05.2024
Former	Examination is in progress Status updated on 23.11.2018
Former	Request for examination was made Status updated on 23.06.2017
Most recent event Tooltip	09.08.2019	Application deemed to be withdrawn	published on 11.09.2019 [2019/37]
Applicant(s)	For all designated states Enpirion, Inc. 53, Frontage Road, Suite 210 Perryville III, Hampton NJ 08827 / US
	[2014/23]
Inventor(s)	01 / Lotfi, Ashraf W. Altera Corporation 101 Innovation Drive San Jose, CA California 95134 / US
	02 / Demski, Jeffrey Altera Corporation 101 Innovation Drive San Jose, CA California 95134 / US
	03 / Feygenson, Anatoly Altera Corporation 101 Innovation Drive San Jose, CA California 95134 / US
	04 / Lopata, Douglas Dean Altera Corporation 101 Innovation Drive San Jose, CA California 95134 / US
	05 / Norton, Jay Altera Corporation 101 Innovation Drive San Jose, CA California 95134 / US
	06 / Weld, John D. Altera Corporation 101 Innovation Drive San Jose, CA California 95134 / US
	[2014/23]
Representative(s)	Epping - Hermann - Fischer Patentanwaltsgesellschaft mbH Schloßschmidstraße 5 80639 München / DE
	[2014/23]
Application number, filing date	13194661.8	27.11.2013
	[2014/23]
Priority number, date	US201261732208P	30.11.2012 Original published format: US 201261732208 P
	[2014/23]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP2738806
	Date:	04.06.2014
	Language:	EN
	[2014/23]
	Type:	A3 Search report
	No.:	EP2738806
	Date:	11.01.2017
	Language:	EN
	[2017/02]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	12.12.2016
Classification	IPC:	H01L29/417, H01L21/336, H01L23/522, H01L23/31, H01L23/64, H01L23/00, H01L29/66, H01L21/768, H01L21/285, H01L23/482, H01L23/495, H01L21/8238, H01L23/36, H01L29/45, H01L29/49, H01L27/02, H01L27/092, H01L29/08, H01L29/10, H01L29/78	[2017/02]
	CPC:	H01L27/0207 (EP,CN,US); H01L21/823871 (EP,CN,US); H01L21/8234 (US); H01L23/36 (EP,CN,US); H01L23/4824 (EP,CN,US); H01L23/495 (EP,CN,US); (+) H01L23/49589 (EP,CN,US); H01L23/522 (EP,CN,US); H01L24/83 (US); H01L25/50 (US); H01L27/0203 (EP,CN,US); H01L27/0688 (US); H01L27/088 (US); H01L27/092 (EP,CN,US); H01L27/0922 (EP,CN,US); H01L29/41758 (EP,CN,US); H01L29/665 (EP,CN,US); H01L29/66659 (EP,CN,US); H01L29/7835 (EP,CN,US); H01L21/28518 (EP,CN,US); H01L21/76801 (EP,CN,US); H01L21/76895 (EP,CN,US); H01L2224/0401 (EP,CN,US); H01L2224/04042 (EP,CN,US); H01L2224/05647 (EP,CN,US); H01L2224/16225 (EP,CN,US); H01L2224/16235 (EP,US); H01L2224/32245 (EP,CN,US); H01L2224/45144 (EP,CN,US); H01L2224/48247 (EP,CN,US); H01L2224/48647 (EP,US); H01L2224/49175 (EP,CN,US); H01L2224/73253 (EP,CN,US); H01L2224/73265 (EP,CN,US); H01L2224/81815 (EP,CN,US); H01L23/3107 (EP,CN,US); H01L23/642 (EP,CN,US); H01L24/16 (EP,CN,US); H01L24/32 (EP,CN,US); H01L24/45 (EP,CN,US); H01L24/48 (EP,CN,US); H01L24/49 (EP,CN,US); H01L24/73 (EP,CN,US); H01L24/81 (EP,CN,US); H01L29/0847 (EP,CN,US); H01L29/1045 (EP,CN,US); H01L29/1083 (EP,CN,US); H01L29/456 (EP,CN,US); H01L29/4933 (EP,CN,US); H01L2924/10253 (EP,CN,US); H01L2924/1306 (EP,CN,US); H01L2924/13091 (EP,CN,US); H01L2924/15747 (EP,US); H01L2924/181 (EP,US); H01L2924/19041 (EP,CN,US); H01L2924/19105 (EP,CN,US); H01L2924/19106 (EP,CN,US); H01L2924/30107 (EP,CN,US); H01L2924/3011 (EP,CN,US) (-)
	C-Set:	H01L2224/45144, H01L2924/00014 (US,EP); H01L2224/48647, H01L2924/00 (EP,US); H01L2224/49175, H01L2224/48247, H01L2924/00 (EP,US); H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00012 (US,EP); (+) H01L2924/1306, H01L2924/00 (US,EP); H01L2924/15747, H01L2924/00 (US,EP); H01L2924/181, H01L2924/00 (EP,US) (-)
	Former IPC [2014/23]	H01L23/522, H01L23/64
Designated contracting states	AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2017/30]
Former [2014/23]	AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR
Extension states	BA	Not yet paid
	ME	Not yet paid
Title	German:	Halbleitervorrichtung mit einer Umverteilungsschicht und daran gekoppelten metallischen Säulen	[2014/23]
	English:	Semiconductor device including a redistribution layer and metallic pillars coupled thereto	[2014/23]
	French:	Dispositif semi-conducteur comprenant une couche de redistribution et des piliers métalliques couplés à celui-ci	[2014/23]
Examination procedure	13.06.2017	Amendment by applicant (claims and/or description)
	13.06.2017	Examination requested [2017/30]
	26.11.2018	Despatch of a communication from the examining division (Time limit: M04)
	09.04.2019	Application deemed to be withdrawn, date of legal effect [2019/37]
	07.05.2019	Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2019/37]
Divisional application(s)	The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 26.11.2018
Fees paid	Renewal fee
	06.11.2015	Renewal fee patent year 03
	07.11.2016	Renewal fee patent year 04
	13.11.2017	Renewal fee patent year 05
	Penalty fee
	Additional fee for renewal fee
	30.11.2018	06 M06 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[A]US2007032063 (SUTARDJA SEHAT [US]) [A] 1-15* paragraphs [0080] - [0085]; figure 12C *;
		[X]US2009096435 (UEUNTEN PAUL [US]) [X] 1-15 * paragraphs [0021] - [0033]; figures 3-6 *;
		[A]US2010244263 (LIN MOU-SHIUNG [TW], et al) [A] 1,4,11,13 * paragraphs [0072] - [0075]; figure 1t *;
		[A]US2011220979 (KAWASHIMA TETSUYA [JP], et al) [A] 7,8 * the whole document *;
		[A]US2012020042 (GRUENDLER NICKOLAUS J [US], et al) [A] 6-8 * paragraph [0026]; figure 6 *;
		[XI]US8169081 (JERGOVIC ILIJA [US], et al) [X] 1,3,5,6,10,11,15 * column 1, lines 45-52 * * column 6, line 14 - column 17, line 22; figures 1,2,9,10 * [I] 2,7-9,12-14
	by applicant	US6510976
		US6550666
		US6578754
		US6592019
		US6681982
		US7230302
		US2007284658
		US7688172
		US7989963
		US8212315
		US2012306011

The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.

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