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Extract from the Register of European Patents

EP About this file: EP2845220

EP2845220 - TECHNIQUES FOR FORMING OPTOELECTRONIC DEVICES [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  18.12.2020
Database last updated on 04.06.2024
FormerThe patent has been granted
Status updated on  10.01.2020
FormerGrant of patent is intended
Status updated on  17.10.2019
Most recent event   Tooltip08.07.2022Lapse of the patent in a contracting state
New state(s): MK
published on 10.08.2022  [2022/32]
Applicant(s)For all designated states
Silicon Genesis Corporation
145 Baytech Drive
San Jose, CA 95134 / US
[2015/11]
Inventor(s)01 / HENLEY, Francois J.
145 Baytech Drive
San Jose, California 95134 / US
02 / KANG, Sien
145 Baytech Drive
San Jose, California 95134 / US
03 / LAMM, Albert
145 Baytech Drive
San Jose, California 95134 / US
 [2015/11]
Representative(s)Clark, Jane Anne, et al
Mathys & Squire The Shard
32 London Bridge Street
London SE1 9SG / GB
[N/P]
Former [2015/11]Clark, Jane Anne, et al
Mathys & Squire LLP The Shard
32 London Bridge Street
London SE1 9SG / GB
Application number, filing date13784851.103.05.2013
[2020/07]
WO2013US39460
Priority number, dateUS201261643180P04.05.2012         Original published format: US 201261643180 P
US20131388612902.05.2013         Original published format: US201313886129
[2015/11]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2013166381
Date:07.11.2013
Language:EN
[2013/45]
Type: A1 Application with search report 
No.:EP2845220
Date:11.03.2015
Language:EN
The application published by WIPO in one of the EPO official languages on 07.11.2013 takes the place of the publication of the European patent application.
[2015/11]
Type: B1 Patent specification 
No.:EP2845220
Date:12.02.2020
Language:EN
[2020/07]
Search report(s)International search report - published on:US07.11.2013
(Supplementary) European search report - dispatched on:EP20.11.2015
ClassificationIPC:H01L21/30, H01L21/762, H01L29/20, H01L21/02, C30B29/40, C30B33/06
[2015/52]
CPC:
H01L21/185 (EP); H01L21/02005 (EP,CN,US); H01L33/0093 (US);
C30B29/06 (US); C30B29/406 (EP,CN,US); C30B33/06 (EP,CN,US);
H01L21/76254 (CN,US); H01L21/78 (US); H01L29/2003 (EP,CN,US);
H01L31/028 (US); H01L31/03044 (US); H01L31/1804 (US);
H01L31/1856 (US); H01L33/0054 (US); H01L33/32 (US);
H01L33/34 (US); H01S5/3013 (US); H01S5/3027 (US) (-)
Former IPC [2015/11]H01L21/30
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2015/11]
Extension statesBANot yet paid
MENot yet paid
TitleGerman:VERFAHREN ZUR HERSTELLUNG VON OPTOELEKTRONISCHEN VORRICHTUNGEN[2015/11]
English:TECHNIQUES FOR FORMING OPTOELECTRONIC DEVICES[2015/11]
French:TECHNIQUES PERMETTANT DE FORMER DES DISPOSITIFS OPTO-ÉLECTRONIQUES[2015/11]
Entry into regional phase05.11.2014National basic fee paid 
05.11.2014Search fee paid 
05.11.2014Designation fee(s) paid 
05.11.2014Examination fee paid 
Examination procedure05.11.2014Examination requested  [2015/11]
22.03.2016Amendment by applicant (claims and/or description)
18.10.2019Communication of intention to grant the patent
18.12.2019Fee for grant paid
18.12.2019Fee for publishing/printing paid
18.12.2019Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  18.10.2019
Opposition(s)13.11.2020No opposition filed within time limit [2021/03]
Fees paidRenewal fee
01.06.2015Renewal fee patent year 03
27.05.2016Renewal fee patent year 04
26.05.2017Renewal fee patent year 05
29.05.2018Renewal fee patent year 06
30.05.2019Renewal fee patent year 07
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See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU03.05.2013
AL12.02.2020
AT12.02.2020
CY12.02.2020
CZ12.02.2020
DK12.02.2020
EE12.02.2020
ES12.02.2020
FI12.02.2020
HR12.02.2020
IT12.02.2020
LT12.02.2020
LV12.02.2020
MC12.02.2020
MK12.02.2020
MT12.02.2020
NL12.02.2020
PL12.02.2020
RO12.02.2020
RS12.02.2020
SE12.02.2020
SI12.02.2020
SK12.02.2020
SM12.02.2020
TR12.02.2020
IE03.05.2020
LU03.05.2020
BG12.05.2020
GB12.05.2020
NO12.05.2020
GR13.05.2020
BE31.05.2020
CH31.05.2020
FR31.05.2020
LI31.05.2020
IS12.06.2020
PT05.07.2020
[2022/31]
Former [2022/30]HU03.05.2013
AL12.02.2020
AT12.02.2020
CY12.02.2020
CZ12.02.2020
DK12.02.2020
EE12.02.2020
ES12.02.2020
FI12.02.2020
HR12.02.2020
IT12.02.2020
LT12.02.2020
LV12.02.2020
MC12.02.2020
MT12.02.2020
NL12.02.2020
PL12.02.2020
RO12.02.2020
RS12.02.2020
SE12.02.2020
SI12.02.2020
SK12.02.2020
SM12.02.2020
TR12.02.2020
IE03.05.2020
LU03.05.2020
BG12.05.2020
GB12.05.2020
NO12.05.2020
GR13.05.2020
BE31.05.2020
CH31.05.2020
FR31.05.2020
LI31.05.2020
IS12.06.2020
PT05.07.2020
Former [2022/27]HU03.05.2013
AT12.02.2020
CY12.02.2020
CZ12.02.2020
DK12.02.2020
EE12.02.2020
ES12.02.2020
FI12.02.2020
HR12.02.2020
IT12.02.2020
LT12.02.2020
LV12.02.2020
MC12.02.2020
MT12.02.2020
NL12.02.2020
PL12.02.2020
RO12.02.2020
RS12.02.2020
SE12.02.2020
SI12.02.2020
SK12.02.2020
SM12.02.2020
TR12.02.2020
IE03.05.2020
LU03.05.2020
BG12.05.2020
GB12.05.2020
NO12.05.2020
GR13.05.2020
BE31.05.2020
CH31.05.2020
FR31.05.2020
LI31.05.2020
IS12.06.2020
PT05.07.2020
Former [2022/26]AT12.02.2020
CZ12.02.2020
DK12.02.2020
EE12.02.2020
ES12.02.2020
FI12.02.2020
HR12.02.2020
IT12.02.2020
LT12.02.2020
LV12.02.2020
MC12.02.2020
NL12.02.2020
PL12.02.2020
RO12.02.2020
RS12.02.2020
SE12.02.2020
SI12.02.2020
SK12.02.2020
SM12.02.2020
TR12.02.2020
IE03.05.2020
LU03.05.2020
BG12.05.2020
GB12.05.2020
NO12.05.2020
GR13.05.2020
BE31.05.2020
CH31.05.2020
FR31.05.2020
LI31.05.2020
IS12.06.2020
PT05.07.2020
Former [2021/23]AT12.02.2020
CZ12.02.2020
DK12.02.2020
EE12.02.2020
ES12.02.2020
FI12.02.2020
HR12.02.2020
IT12.02.2020
LT12.02.2020
LV12.02.2020
MC12.02.2020
NL12.02.2020
PL12.02.2020
RO12.02.2020
RS12.02.2020
SE12.02.2020
SI12.02.2020
SK12.02.2020
SM12.02.2020
IE03.05.2020
LU03.05.2020
BG12.05.2020
GB12.05.2020
NO12.05.2020
GR13.05.2020
BE31.05.2020
CH31.05.2020
FR31.05.2020
LI31.05.2020
IS12.06.2020
PT05.07.2020
Former [2021/22]AT12.02.2020
CZ12.02.2020
DK12.02.2020
EE12.02.2020
ES12.02.2020
FI12.02.2020
HR12.02.2020
IT12.02.2020
LT12.02.2020
LV12.02.2020
MC12.02.2020
NL12.02.2020
PL12.02.2020
RO12.02.2020
RS12.02.2020
SE12.02.2020
SI12.02.2020
SK12.02.2020
SM12.02.2020
IE03.05.2020
LU03.05.2020
BG12.05.2020
GB12.05.2020
NO12.05.2020
GR13.05.2020
CH31.05.2020
LI31.05.2020
IS12.06.2020
PT05.07.2020
Former [2021/20]AT12.02.2020
CZ12.02.2020
DK12.02.2020
EE12.02.2020
ES12.02.2020
FI12.02.2020
HR12.02.2020
IT12.02.2020
LT12.02.2020
LV12.02.2020
MC12.02.2020
NL12.02.2020
PL12.02.2020
RO12.02.2020
RS12.02.2020
SE12.02.2020
SI12.02.2020
SK12.02.2020
SM12.02.2020
IE03.05.2020
LU03.05.2020
BG12.05.2020
NO12.05.2020
GR13.05.2020
CH31.05.2020
LI31.05.2020
IS12.06.2020
PT05.07.2020
Former [2021/15]AT12.02.2020
CZ12.02.2020
DK12.02.2020
EE12.02.2020
ES12.02.2020
FI12.02.2020
HR12.02.2020
IT12.02.2020
LT12.02.2020
LV12.02.2020
MC12.02.2020
NL12.02.2020
PL12.02.2020
RO12.02.2020
RS12.02.2020
SE12.02.2020
SI12.02.2020
SK12.02.2020
SM12.02.2020
LU03.05.2020
BG12.05.2020
NO12.05.2020
GR13.05.2020
CH31.05.2020
LI31.05.2020
IS12.06.2020
PT05.07.2020
Former [2021/10]AT12.02.2020
CZ12.02.2020
DK12.02.2020
EE12.02.2020
ES12.02.2020
FI12.02.2020
HR12.02.2020
IT12.02.2020
LT12.02.2020
LV12.02.2020
MC12.02.2020
NL12.02.2020
PL12.02.2020
RO12.02.2020
RS12.02.2020
SE12.02.2020
SI12.02.2020
SK12.02.2020
SM12.02.2020
BG12.05.2020
NO12.05.2020
GR13.05.2020
CH31.05.2020
LI31.05.2020
IS12.06.2020
PT05.07.2020
Former [2021/07]CZ12.02.2020
DK12.02.2020
EE12.02.2020
ES12.02.2020
FI12.02.2020
HR12.02.2020
LT12.02.2020
LV12.02.2020
NL12.02.2020
RO12.02.2020
RS12.02.2020
SE12.02.2020
SK12.02.2020
SM12.02.2020
BG12.05.2020
NO12.05.2020
GR13.05.2020
CH31.05.2020
LI31.05.2020
IS12.06.2020
PT05.07.2020
Former [2020/50]CZ12.02.2020
DK12.02.2020
EE12.02.2020
ES12.02.2020
FI12.02.2020
HR12.02.2020
LT12.02.2020
LV12.02.2020
NL12.02.2020
RO12.02.2020
RS12.02.2020
SE12.02.2020
SK12.02.2020
SM12.02.2020
BG12.05.2020
NO12.05.2020
GR13.05.2020
IS12.06.2020
PT05.07.2020
Former [2020/49]CZ12.02.2020
DK12.02.2020
ES12.02.2020
FI12.02.2020
HR12.02.2020
LT12.02.2020
LV12.02.2020
NL12.02.2020
RO12.02.2020
RS12.02.2020
SE12.02.2020
SK12.02.2020
SM12.02.2020
BG12.05.2020
NO12.05.2020
GR13.05.2020
IS12.06.2020
PT05.07.2020
Former [2020/48]DK12.02.2020
ES12.02.2020
FI12.02.2020
HR12.02.2020
LT12.02.2020
LV12.02.2020
NL12.02.2020
RO12.02.2020
RS12.02.2020
SE12.02.2020
SM12.02.2020
BG12.05.2020
NO12.05.2020
GR13.05.2020
IS12.06.2020
PT05.07.2020
Former [2020/47]DK12.02.2020
ES12.02.2020
FI12.02.2020
HR12.02.2020
LT12.02.2020
LV12.02.2020
NL12.02.2020
RS12.02.2020
SE12.02.2020
BG12.05.2020
NO12.05.2020
GR13.05.2020
IS12.06.2020
Former [2020/45]FI12.02.2020
HR12.02.2020
LV12.02.2020
NL12.02.2020
RS12.02.2020
SE12.02.2020
BG12.05.2020
NO12.05.2020
GR13.05.2020
IS12.06.2020
Former [2020/40]FI12.02.2020
HR12.02.2020
LV12.02.2020
RS12.02.2020
SE12.02.2020
BG12.05.2020
NO12.05.2020
GR13.05.2020
IS12.06.2020
Former [2020/39]FI12.02.2020
HR12.02.2020
LV12.02.2020
RS12.02.2020
SE12.02.2020
BG12.05.2020
NO12.05.2020
GR13.05.2020
Former [2020/38]FI12.02.2020
HR12.02.2020
LV12.02.2020
RS12.02.2020
SE12.02.2020
NO12.05.2020
GR13.05.2020
Former [2020/37]FI12.02.2020
HR12.02.2020
LV12.02.2020
RS12.02.2020
SE12.02.2020
NO12.05.2020
Former [2020/35]FI12.02.2020
NO12.05.2020
Documents cited:Search[A]US2007032044  (HENLEY FRANCOIS J [US]) [A] 1-15* abstract *;
 [X]US2011156212  (ARENA CHANTAL [US]) [X] 1-7,11,14,15 * paragraph [0047] - paragraph [0074]; figures 1-7 *;
 [XI]US2012098033  (FAURE BRUCE [FR]) [X] 1-7,11,12,14,15 * paragraph [0069] - paragraph [0081]; figures 1-7 * [I] 8-10,13
International search[A]US6420242  (CHEUNG NATHAN W [US], et al);
 [Y]EP1936678  (IMEC INTER UNI MICRO ELECTR [BE]);
 [A]US2010147448  (AGARWAL ADITYA [US], et al);
 [Y]US2010176371  (LOCHTEFELD ANTHONY J [US]);
 [Y]US2011111194  (CARRE ALAIN R E [FR], et al);
 [Y]US2011156212  (ARENA CHANTAL [US]);
 [A]US2012056510  (CHEN DAVID M [US], et al);
 [Y]US2012100691  (FAURE BRUCE [FR])
by applicantUS5374564
 US6013563
 US2011156212
 US2012098033
    - CUI ET AL., "The Effect of Surface Roughness on Direct Wafer Bonding", JOURNAL OF APPLIED PHYSICS, (1999), vol. 85, no. 10, pages 7448 - 7454
    - JOTHILINGAM ET AL., "A Study of Cracking in GaN Grown on Silicon by Molecular Beam Epitaxy", JOURNAL OF ELECTRONIC MATERIALS, (2001), vol. 30, no. 7, pages 821 - 824
    - M.K. WELDON, "On the Mechanism of Hydrogen- Induced Exfoliation of Silicon", J. VAC. SCI. TECHNOL., (199707), vol. 15, no. 4
    - PAUL K. CHU; CHUNG CHAN; NATHAN W. CHEUNG, "Recent Applications of Plasma Immersion Ion Implantation", SEMICONDUCTOR INTERNATIONAL, (199606), pages 165 - 172
    - P. K. CHU; S. QIN; C. CHAN; N. W. CHEUNG; L. A. LARSON, "Plasma Immersion Ion Implantation--A Fledgling Technique for Semiconductor Processing", MATERIALS SCIENCE AND ENGINEERING REPORTS: A REVIEW JOURNAL, (19961130), vol. R17, no. 6-7, pages 207 - 280
    - JOTHILINGAM, "A Study of Cracking in GaN Grown on Silicon by Molecular Beam Epitaxy", JOURNAL OF ELECTRONIC MATERIALS, (2001), vol. 30, no. 7, pages 821 - 824
 US20070685686
 US20070784524
 US20070852088
 US20070935197
 US20070936582
 US20080019886
 US20080244687
 US20100730113
 US20100789361
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.