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Extract from the Register of European Patents

EP About this file: EP2856502

EP2856502 - SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THEREOF [Right-click to bookmark this link]
Former [2015/15]SEMICONDUCTOR PACKAGE SUBSTRATE, PACKAGE SYSTEM USING THE SAME AND METHOD FOR MANUFACTURING THEREOF
[2020/09]
StatusNo opposition filed within time limit
Status updated on  11.06.2021
Database last updated on 24.08.2024
FormerThe patent has been granted
Status updated on  03.07.2020
FormerGrant of patent is intended
Status updated on  27.02.2020
FormerExamination is in progress
Status updated on  12.08.2019
Most recent event   Tooltip27.04.2024Lapse of the patent in a contracting state
New state(s): MK		published on 29.05.2024  [2024/22]
Applicant(s)For all designated states
LG Innotek Co., Ltd.
98, Huam-ro, Jung-gu
Seoul, 04637 / KR
[2017/20]
Former [2015/15]For all designated states
LG Innotek Co., Ltd.
Seoul Square 541 Namdaemunno 5-ga Jung-gu
Seoul 100-714 / KR
Inventor(s)01 / RYU, Sung Wuk
Seoul Square
541 Namdaemunno 5-ga
Jung-gu
Seoul 100-714 / KR
02 / KIM, Dong Sun
Seoul Square
541 Namdaemunno 5-ga
Jung-gu
Seoul 100-714 / KR
03 / SHIN, Seung Yul
Seoul Square
541 Namdaemunno 5-ga
Jung-gu
Seoul 100-714 / KR
 [2015/15]
Representative(s)M. Zardi & Co S.A.
Via G. B. Pioda, 6
6900 Lugano / CH
[N/P]
Former [2020/32]M. Zardi & Co S.A.
Via G. B. Pioda, 6
6900 Lugano / CH
Former [2015/15]Zardi, Marco
M. Zardi & Co. SA
Via Pioda 6
6900 Lugano / CH
Application number, filing date13793826.224.05.2013
[2020/32]
WO2013KR04578
Priority number, dateKR2012005635625.05.2012         Original published format: KR 20120056356
[2015/15]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2013176519
Date:28.11.2013
Language:EN
[2013/48]
Type: A1 Application with search report 
No.:EP2856502
Date:08.04.2015
Language:EN
The application published by WIPO in one of the EPO official languages on 28.11.2013 takes the place of the publication of the European patent application.
[2015/15]
Type: B1 Patent specification 
No.:EP2856502
Date:05.08.2020
Language:EN
[2020/32]
Search report(s)International search report - published on:KR28.11.2013
(Supplementary) European search report - dispatched on:EP03.07.2015
ClassificationIPC:H01L23/12, H01L23/15
[2015/15]
CPC:
H01L23/49816 (EP,US); H01L23/15 (KR); H01L23/12 (KR,US);
H01L21/4846 (US); H01L24/13 (EP,US); H01L24/17 (US);
H01L24/81 (EP,US); H05K1/181 (US); H01L2224/131 (EP,US);
H01L2224/13147 (EP,US); H01L2224/134 (EP,US); H01L2224/16238 (EP,US);
H01L2224/81192 (EP,US); H01L2224/81447 (EP,US); H01L2225/06517 (EP,US);
H01L2225/06562 (EP,US); H01L23/49822 (EP,US); H01L24/16 (EP,US);
H01L25/0657 (EP,US); H01L2924/01029 (US); H01L2924/014 (US);
H01L2924/12042 (EP,US); H01L2924/151 (US); H01L2924/15787 (EP,US) (-)
C-Set:
H01L2224/131, H01L2924/014 (EP,US);
H01L2224/134, H01L2924/014 (US,EP);
H01L2924/12042, H01L2924/00 (US,EP);
H01L2924/15787, H01L2924/00 (US,EP)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2015/15]
Extension statesBANot yet paid
MENot yet paid
TitleGerman:HALBLEITERVERKAPSELUNGSSUBSTRAT UND VERFAHREN ZUR HERSTELLUNG DAVON[2020/09]
English:SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THEREOF[2020/09]
French:SUBSTRAT DE BOÎTIER DE SEMI-CONDUCTEURS ET SON PROCÉDÉ DE FABRICATION[2020/09]
Former [2015/15]HALBLEITERVERKAPSELUNGSSUBSTRAT, VERKAPSELUNGSSYSTEM DAMIT UND VERFAHREN ZUR HERSTELLUNG DAVON
Former [2015/15]SEMICONDUCTOR PACKAGE SUBSTRATE, PACKAGE SYSTEM USING THE SAME AND METHOD FOR MANUFACTURING THEREOF
Former [2015/15]SUBSTRAT DE BOÎTIER DE SEMI-CONDUCTEURS, SYSTÈME DE BOÎTIER UTILISANT UN TEL SUBSTRAT ET SON PROCÉDÉ DE FABRICATION
Entry into regional phase23.12.2014National basic fee paid 
23.12.2014Search fee paid 
23.12.2014Designation fee(s) paid 
23.12.2014Examination fee paid 
Examination procedure23.12.2014Examination requested  [2015/15]
21.01.2016Amendment by applicant (claims and/or description)
16.08.2019Invitation to indicate the basis for amendments (Time limit: M01)
24.09.2019Reply to an invitation to indicate the basis for amendments
28.02.2020Communication of intention to grant the patent
24.06.2020Fee for grant paid
24.06.2020Fee for publishing/printing paid
24.06.2020Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  28.02.2020
Opposition(s)07.05.2021No opposition filed within time limit [2021/28]
Fees paidRenewal fee
15.05.2015Renewal fee patent year 03
25.05.2016Renewal fee patent year 04
23.05.2017Renewal fee patent year 05
23.05.2018Renewal fee patent year 06
22.05.2019Renewal fee patent year 07
24.03.2020Renewal fee patent year 08
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU24.05.2013
AL05.08.2020
AT05.08.2020
CY05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
MK05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
[2024/22]
Former [2023/30]HU24.05.2013
AL05.08.2020
AT05.08.2020
CY05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2023/29]HU24.05.2013
AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2022/07]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/36]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/34]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/28]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SK05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/25]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/23]AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SM05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/22]AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/20]AT05.08.2020
DK05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RS05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/12]AT05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RS05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/10]AT05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
PL05.08.2020
RS05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/09]AT05.08.2020
ES05.08.2020
FI05.08.2020
LT05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
PT07.12.2020
Former [2021/08]ES05.08.2020
FI05.08.2020
LT05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
PT07.12.2020
Former [2021/07]FI05.08.2020
LT05.08.2020
NO05.11.2020
Documents cited:Search[Y]EP0889512  (DELCO ELECTRONICS CORP [US]) [Y] 1-15 * figure 2 *;
 [Y]KR20060085464  (SAMSUNG ELECTRO MECH [KR]) [Y] 1-15 * figure 4 *;
 [Y]KR20060094248  (SAMSUNG ELECTRO MECH [KR]) [Y] 1-15* figure 4 *;
 [A]EP1843391  (MURATA MANUFACTURING CO [JP]) [A] 1-15 * figure 1 *;
 [I]US2008217046  (TANG SAO-HSIA [TW], et al) [I] 1-15 * figures 3A-3H, 4 *
International search[X]JP2003110052  (NEC TOPPAN CIRCUIT SOLUTIONS);
 [A]US2005095836  (LAI CHIA-HUNG [TW], et al);
 [A]US2006223230  (HSU SHIH-PING [TW], et al);
 [A]US2011003431  (HUANG CHENG-TANG [TW]);
 [A]KR101067216B  (SAMSUNG ELECTRO MECH [KR])
by applicantEP0889512
 EP1843391
 US2008217046
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.