EP2856502 - SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THEREOF [Right-click to bookmark this link] | |||
Former [2015/15] | SEMICONDUCTOR PACKAGE SUBSTRATE, PACKAGE SYSTEM USING THE SAME AND METHOD FOR MANUFACTURING THEREOF | ||
[2020/09] | Status | No opposition filed within time limit Status updated on 11.06.2021 Database last updated on 24.08.2024 | |
Former | The patent has been granted Status updated on 03.07.2020 | ||
Former | Grant of patent is intended Status updated on 27.02.2020 | ||
Former | Examination is in progress Status updated on 12.08.2019 | Most recent event Tooltip | 27.04.2024 | Lapse of the patent in a contracting state New state(s): MK | published on 29.05.2024 [2024/22] | Applicant(s) | For all designated states LG Innotek Co., Ltd. 98, Huam-ro, Jung-gu Seoul, 04637 / KR | [2017/20] |
Former [2015/15] | For all designated states LG Innotek Co., Ltd. Seoul Square 541 Namdaemunno 5-ga Jung-gu Seoul 100-714 / KR | Inventor(s) | 01 /
RYU, Sung Wuk Seoul Square 541 Namdaemunno 5-ga Jung-gu Seoul 100-714 / KR | 02 /
KIM, Dong Sun Seoul Square 541 Namdaemunno 5-ga Jung-gu Seoul 100-714 / KR | 03 /
SHIN, Seung Yul Seoul Square 541 Namdaemunno 5-ga Jung-gu Seoul 100-714 / KR | [2015/15] | Representative(s) | M. Zardi & Co S.A. Via G. B. Pioda, 6 6900 Lugano / CH | [N/P] |
Former [2020/32] | M. Zardi & Co S.A. Via G. B. Pioda, 6 6900 Lugano / CH | ||
Former [2015/15] | Zardi, Marco M. Zardi & Co. SA Via Pioda 6 6900 Lugano / CH | Application number, filing date | 13793826.2 | 24.05.2013 | [2020/32] | WO2013KR04578 | Priority number, date | KR20120056356 | 25.05.2012 Original published format: KR 20120056356 | [2015/15] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2013176519 | Date: | 28.11.2013 | Language: | EN | [2013/48] | Type: | A1 Application with search report | No.: | EP2856502 | Date: | 08.04.2015 | Language: | EN | The application published by WIPO in one of the EPO official languages on 28.11.2013 takes the place of the publication of the European patent application. | [2015/15] | Type: | B1 Patent specification | No.: | EP2856502 | Date: | 05.08.2020 | Language: | EN | [2020/32] | Search report(s) | International search report - published on: | KR | 28.11.2013 | (Supplementary) European search report - dispatched on: | EP | 03.07.2015 | Classification | IPC: | H01L23/12, H01L23/15 | [2015/15] | CPC: |
H01L23/49816 (EP,US);
H01L23/15 (KR);
H01L23/12 (KR,US);
H01L21/4846 (US);
H01L24/13 (EP,US);
H01L24/17 (US);
H01L24/81 (EP,US);
H05K1/181 (US);
H01L2224/131 (EP,US);
H01L2224/13147 (EP,US);
H01L2224/134 (EP,US);
H01L2224/16238 (EP,US);
H01L2224/81192 (EP,US);
H01L2224/81447 (EP,US);
H01L2225/06517 (EP,US);
H01L2225/06562 (EP,US);
H01L23/49822 (EP,US);
H01L24/16 (EP,US);
H01L25/0657 (EP,US);
H01L2924/01029 (US);
H01L2924/014 (US);
| C-Set: |
H01L2224/131, H01L2924/014 (EP,US);
H01L2224/134, H01L2924/014 (US,EP);
H01L2924/12042, H01L2924/00 (US,EP);
H01L2924/15787, H01L2924/00 (US,EP) | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2015/15] | Extension states | BA | Not yet paid | ME | Not yet paid | Title | German: | HALBLEITERVERKAPSELUNGSSUBSTRAT UND VERFAHREN ZUR HERSTELLUNG DAVON | [2020/09] | English: | SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THEREOF | [2020/09] | French: | SUBSTRAT DE BOÎTIER DE SEMI-CONDUCTEURS ET SON PROCÉDÉ DE FABRICATION | [2020/09] |
Former [2015/15] | HALBLEITERVERKAPSELUNGSSUBSTRAT, VERKAPSELUNGSSYSTEM DAMIT UND VERFAHREN ZUR HERSTELLUNG DAVON | ||
Former [2015/15] | SEMICONDUCTOR PACKAGE SUBSTRATE, PACKAGE SYSTEM USING THE SAME AND METHOD FOR MANUFACTURING THEREOF | ||
Former [2015/15] | SUBSTRAT DE BOÎTIER DE SEMI-CONDUCTEURS, SYSTÈME DE BOÎTIER UTILISANT UN TEL SUBSTRAT ET SON PROCÉDÉ DE FABRICATION | Entry into regional phase | 23.12.2014 | National basic fee paid | 23.12.2014 | Search fee paid | 23.12.2014 | Designation fee(s) paid | 23.12.2014 | Examination fee paid | Examination procedure | 23.12.2014 | Examination requested [2015/15] | 21.01.2016 | Amendment by applicant (claims and/or description) | 16.08.2019 | Invitation to indicate the basis for amendments (Time limit: M01) | 24.09.2019 | Reply to an invitation to indicate the basis for amendments | 28.02.2020 | Communication of intention to grant the patent | 24.06.2020 | Fee for grant paid | 24.06.2020 | Fee for publishing/printing paid | 24.06.2020 | Receipt of the translation of the claim(s) | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 28.02.2020 | Opposition(s) | 07.05.2021 | No opposition filed within time limit [2021/28] | Fees paid | Renewal fee | 15.05.2015 | Renewal fee patent year 03 | 25.05.2016 | Renewal fee patent year 04 | 23.05.2017 | Renewal fee patent year 05 | 23.05.2018 | Renewal fee patent year 06 | 22.05.2019 | Renewal fee patent year 07 | 24.03.2020 | Renewal fee patent year 08 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 24.05.2013 | AL | 05.08.2020 | AT | 05.08.2020 | CY | 05.08.2020 | CZ | 05.08.2020 | DK | 05.08.2020 | EE | 05.08.2020 | ES | 05.08.2020 | FI | 05.08.2020 | HR | 05.08.2020 | IT | 05.08.2020 | LT | 05.08.2020 | LV | 05.08.2020 | MC | 05.08.2020 | MK | 05.08.2020 | NL | 05.08.2020 | PL | 05.08.2020 | RO | 05.08.2020 | RS | 05.08.2020 | SE | 05.08.2020 | SI | 05.08.2020 | SK | 05.08.2020 | SM | 05.08.2020 | BG | 05.11.2020 | NO | 05.11.2020 | GR | 06.11.2020 | IS | 05.12.2020 | PT | 07.12.2020 | [2024/22] |
Former [2023/30] | HU | 24.05.2013 | |
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EE | 05.08.2020 | ||
ES | 05.08.2020 | ||
FI | 05.08.2020 | ||
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MC | 05.08.2020 | ||
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PL | 05.08.2020 | ||
RO | 05.08.2020 | ||
RS | 05.08.2020 | ||
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SM | 05.08.2020 | ||
BG | 05.11.2020 | ||
NO | 05.11.2020 | ||
GR | 06.11.2020 | ||
IS | 05.12.2020 | ||
PT | 07.12.2020 | ||
Former [2023/29] | HU | 24.05.2013 | |
AL | 05.08.2020 | ||
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CZ | 05.08.2020 | ||
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EE | 05.08.2020 | ||
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SI | 05.08.2020 | ||
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SM | 05.08.2020 | ||
BG | 05.11.2020 | ||
NO | 05.11.2020 | ||
GR | 06.11.2020 | ||
IS | 05.12.2020 | ||
PT | 07.12.2020 | ||
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BG | 05.11.2020 | ||
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IS | 05.12.2020 | ||
PT | 07.12.2020 | ||
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SM | 05.08.2020 | ||
BG | 05.11.2020 | ||
NO | 05.11.2020 | ||
GR | 06.11.2020 | ||
IS | 05.12.2020 | ||
PT | 07.12.2020 | ||
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CZ | 05.08.2020 | ||
DK | 05.08.2020 | ||
EE | 05.08.2020 | ||
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SE | 05.08.2020 | ||
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SM | 05.08.2020 | ||
BG | 05.11.2020 | ||
NO | 05.11.2020 | ||
GR | 06.11.2020 | ||
IS | 05.12.2020 | ||
PT | 07.12.2020 | ||
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AT | 05.08.2020 | ||
CZ | 05.08.2020 | ||
DK | 05.08.2020 | ||
EE | 05.08.2020 | ||
ES | 05.08.2020 | ||
FI | 05.08.2020 | ||
HR | 05.08.2020 | ||
LT | 05.08.2020 | ||
LV | 05.08.2020 | ||
NL | 05.08.2020 | ||
PL | 05.08.2020 | ||
RO | 05.08.2020 | ||
RS | 05.08.2020 | ||
SE | 05.08.2020 | ||
SM | 05.08.2020 | ||
BG | 05.11.2020 | ||
NO | 05.11.2020 | ||
GR | 06.11.2020 | ||
IS | 05.12.2020 | ||
PT | 07.12.2020 | ||
Former [2021/23] | AT | 05.08.2020 | |
CZ | 05.08.2020 | ||
DK | 05.08.2020 | ||
EE | 05.08.2020 | ||
ES | 05.08.2020 | ||
FI | 05.08.2020 | ||
HR | 05.08.2020 | ||
LT | 05.08.2020 | ||
LV | 05.08.2020 | ||
NL | 05.08.2020 | ||
PL | 05.08.2020 | ||
RO | 05.08.2020 | ||
RS | 05.08.2020 | ||
SE | 05.08.2020 | ||
SM | 05.08.2020 | ||
BG | 05.11.2020 | ||
NO | 05.11.2020 | ||
GR | 06.11.2020 | ||
IS | 05.12.2020 | ||
PT | 07.12.2020 | ||
Former [2021/22] | AT | 05.08.2020 | |
CZ | 05.08.2020 | ||
DK | 05.08.2020 | ||
EE | 05.08.2020 | ||
ES | 05.08.2020 | ||
FI | 05.08.2020 | ||
HR | 05.08.2020 | ||
LT | 05.08.2020 | ||
LV | 05.08.2020 | ||
NL | 05.08.2020 | ||
PL | 05.08.2020 | ||
RO | 05.08.2020 | ||
RS | 05.08.2020 | ||
SE | 05.08.2020 | ||
BG | 05.11.2020 | ||
NO | 05.11.2020 | ||
GR | 06.11.2020 | ||
IS | 05.12.2020 | ||
PT | 07.12.2020 | ||
Former [2021/20] | AT | 05.08.2020 | |
DK | 05.08.2020 | ||
ES | 05.08.2020 | ||
FI | 05.08.2020 | ||
HR | 05.08.2020 | ||
LT | 05.08.2020 | ||
LV | 05.08.2020 | ||
NL | 05.08.2020 | ||
PL | 05.08.2020 | ||
RS | 05.08.2020 | ||
SE | 05.08.2020 | ||
BG | 05.11.2020 | ||
NO | 05.11.2020 | ||
GR | 06.11.2020 | ||
IS | 05.12.2020 | ||
PT | 07.12.2020 | ||
Former [2021/12] | AT | 05.08.2020 | |
ES | 05.08.2020 | ||
FI | 05.08.2020 | ||
HR | 05.08.2020 | ||
LT | 05.08.2020 | ||
LV | 05.08.2020 | ||
NL | 05.08.2020 | ||
PL | 05.08.2020 | ||
RS | 05.08.2020 | ||
SE | 05.08.2020 | ||
BG | 05.11.2020 | ||
NO | 05.11.2020 | ||
GR | 06.11.2020 | ||
IS | 05.12.2020 | ||
PT | 07.12.2020 | ||
Former [2021/10] | AT | 05.08.2020 | |
ES | 05.08.2020 | ||
FI | 05.08.2020 | ||
HR | 05.08.2020 | ||
LT | 05.08.2020 | ||
LV | 05.08.2020 | ||
PL | 05.08.2020 | ||
RS | 05.08.2020 | ||
SE | 05.08.2020 | ||
BG | 05.11.2020 | ||
NO | 05.11.2020 | ||
GR | 06.11.2020 | ||
IS | 05.12.2020 | ||
PT | 07.12.2020 | ||
Former [2021/09] | AT | 05.08.2020 | |
ES | 05.08.2020 | ||
FI | 05.08.2020 | ||
LT | 05.08.2020 | ||
SE | 05.08.2020 | ||
BG | 05.11.2020 | ||
NO | 05.11.2020 | ||
GR | 06.11.2020 | ||
PT | 07.12.2020 | ||
Former [2021/08] | ES | 05.08.2020 | |
FI | 05.08.2020 | ||
LT | 05.08.2020 | ||
SE | 05.08.2020 | ||
BG | 05.11.2020 | ||
NO | 05.11.2020 | ||
PT | 07.12.2020 | ||
Former [2021/07] | FI | 05.08.2020 | |
LT | 05.08.2020 | ||
NO | 05.11.2020 | Documents cited: | Search | [Y]EP0889512 (DELCO ELECTRONICS CORP [US]) [Y] 1-15 * figure 2 *; | [Y]KR20060085464 (SAMSUNG ELECTRO MECH [KR]) [Y] 1-15 * figure 4 *; | [Y]KR20060094248 (SAMSUNG ELECTRO MECH [KR]) [Y] 1-15* figure 4 *; | [A]EP1843391 (MURATA MANUFACTURING CO [JP]) [A] 1-15 * figure 1 *; | [I]US2008217046 (TANG SAO-HSIA [TW], et al) [I] 1-15 * figures 3A-3H, 4 * | International search | [X]JP2003110052 (NEC TOPPAN CIRCUIT SOLUTIONS); | [A]US2005095836 (LAI CHIA-HUNG [TW], et al); | [A]US2006223230 (HSU SHIH-PING [TW], et al); | [A]US2011003431 (HUANG CHENG-TANG [TW]); | [A]KR101067216B (SAMSUNG ELECTRO MECH [KR]) | by applicant | EP0889512 | EP1843391 | US2008217046 |