EP2779248 - Apparatus related to termination regions of a semiconductor device [Right-click to bookmark this link] | Status | The patent has been granted Status updated on 03.05.2024 Database last updated on 19.10.2024 | |
Former | Grant of patent is intended Status updated on 21.04.2024 | ||
Former | Examination is in progress Status updated on 12.09.2022 | ||
Former | Grant of patent is intended Status updated on 10.05.2022 | ||
Former | Examination is in progress Status updated on 16.02.2022 | ||
Former | Grant of patent is intended Status updated on 08.02.2022 | ||
Former | Examination is in progress Status updated on 05.04.2019 | Most recent event Tooltip | 18.10.2024 | Lapse of the patent in a contracting state New state(s): GR | published on 20.11.2024 [2024/47] | Applicant(s) | For all designated states Semiconductor Components Industries, LLC 5005 East McDowell Road Phoenix, AZ 85008 / US | [2024/44] |
Former [2014/38] | For all designated states Fairchild Semiconductor Corporation 3030 Orchard Parkway San Jose, CA 95134 / US | Inventor(s) | 01 /
Yedinak, Joseph A. 114 Ash Lane Mountain Top, PA 18707 / US | 02 /
Probst, Dean E. 6867 Liza Lane West Jordan, UT 84081 / US | 03 /
Stokes, Richard 276 Jackson Road Shavertown, PA 18708 / US | 04 /
Kim, Suku 11721 Suntea Way South Jordan, UT 84095 / US | 05 /
Higgs, Jason 791 St. Mary's Road Mountain Top, PA 18707 / US | 06 /
Session, Fred 12139 Nicklaus Road Sandy, UT 84092 / US | 07 /
Chen, Hui 11467 Wexford Way South Jordan, UT 84095 / US | 08 /
Sapp, Steven 834 Pine Drive Felton, CA 95018 / US | 09 /
Preece, Jayson 3182W 13010S Riverton, UT 84065 / US | 10 /
Rinehimer, Mark L. 85 Fieldstone Way Mountain Top, PA 18707 / US | [2014/38] | Representative(s) | Schmidt, Steffen J., et al Wuesthoff & Wuesthoff Patentanwälte und Rechtsanwalt PartG mbB Schweigerstrasse 2 81541 München / DE | [2024/23] |
Former [2014/38] | Müller-Boré & Partner Patentanwälte PartG mbB Friedenheimer Brücke 21 80639 München / DE | Application number, filing date | 14000929.1 | 13.03.2014 | [2014/38] | Priority number, date | US201361801253P | 15.03.2013 Original published format: US 201361801253 P | US201361801272P | 15.03.2013 Original published format: US 201361801272 P | US201414204765 | 11.03.2014 Original published format: US201414204765 | [2014/38] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP2779248 | Date: | 17.09.2014 | Language: | EN | [2014/38] | Type: | A3 Search report | No.: | EP2779248 | Date: | 14.01.2015 | Language: | EN | [2015/03] | Type: | B1 Patent specification | No.: | EP2779248 | Date: | 05.06.2024 | Language: | EN | [2024/23] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 16.12.2014 | Classification | IPC: | H01L29/40, H01L29/78, H01L29/739 | [2021/43] | CPC: |
H01L29/7813 (EP,CN,US);
H01L29/7802 (KR);
H01L29/7811 (EP,CN,US);
H01L21/02104 (US);
H01L29/06 (US);
H01L29/0649 (EP,US);
H01L29/0661 (US);
H01L29/404 (EP,US);
H01L29/407 (EP,US);
H01L29/41 (EP);
H01L29/4238 (EP,US);
H01L29/7395 (US);
|
Former IPC [2014/40] | H01L29/78, H01L29/739 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2015/35] |
Former [2014/38] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | Vorrichtung entsprechend Randabschlussregionen eines Halbleiterbauelements | [2021/43] | English: | Apparatus related to termination regions of a semiconductor device | [2014/38] | French: | Appareil relatifs aux régions de terminaison d'un dispositif à semi-conducteurs | [2014/38] |
Former [2014/38] | Vorrichtung zur Bestimmung der Regionen einer Halbleitervorrichtung | Examination procedure | 14.07.2015 | Amendment by applicant (claims and/or description) | 14.07.2015 | Examination requested [2015/35] | 09.04.2019 | Despatch of a communication from the examining division (Time limit: M04) | 19.07.2019 | Reply to a communication from the examining division | 21.07.2020 | Despatch of a communication from the examining division (Time limit: M02) | 22.07.2020 | Reply to a communication from the examining division | 02.11.2020 | Despatch of a communication from the examining division (Time limit: M02) | 29.12.2020 | Reply to a communication from the examining division | 09.02.2022 | Communication of intention to grant the patent | 16.02.2022 | Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO | 11.05.2022 | Communication of intention to grant the patent | 09.09.2022 | Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO | 24.11.2022 | Despatch of a communication from the examining division (Time limit: M02) | 24.01.2023 | Reply to a communication from the examining division | 22.04.2024 | Communication of intention to grant the patent | 24.04.2024 | Fee for grant paid | 24.04.2024 | Fee for publishing/printing paid | 24.04.2024 | Receipt of the translation of the claim(s) | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 09.04.2019 | Fees paid | Renewal fee | 23.03.2016 | Renewal fee patent year 03 | 23.03.2017 | Renewal fee patent year 04 | 23.03.2018 | Renewal fee patent year 05 | 22.03.2019 | Renewal fee patent year 06 | 20.03.2020 | Renewal fee patent year 07 | 23.03.2021 | Renewal fee patent year 08 | 23.03.2022 | Renewal fee patent year 09 | 21.03.2023 | Renewal fee patent year 10 | 20.03.2024 | Renewal fee patent year 11 |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | BG | 05.06.2024 | FI | 05.06.2024 | HR | 05.06.2024 | NO | 05.09.2024 | GR | 06.09.2024 | [2024/47] |
Former [2024/46] | BG | 05.06.2024 | |
FI | 05.06.2024 | ||
HR | 05.06.2024 | ||
NO | 05.09.2024 | Documents cited: | Search | [A]US2003222297 (KRUMREY JOACHIM [DE], et al); | [XA]US2005017293 (ZUNDEL MARKUS [DE], et al); | [XA]JP2005322949 (RENESAS TECH CORP, et al); | [XA]JP2006032420 (TOYOTA MOTOR CORP, et al); | [XA]DE102006030225 (INFINEON TECHNOLOGIES AUSTRIA [AT]); | [XA]EP2339636 (ST MICROELECTRONICS SRL [IT]) |