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Extract from the Register of European Patents

EP About this file: EP2779248

EP2779248 - Apparatus related to termination regions of a semiconductor device [Right-click to bookmark this link]
StatusThe patent has been granted
Status updated on  03.05.2024
Database last updated on 19.10.2024
FormerGrant of patent is intended
Status updated on  21.04.2024
FormerExamination is in progress
Status updated on  12.09.2022
FormerGrant of patent is intended
Status updated on  10.05.2022
FormerExamination is in progress
Status updated on  16.02.2022
FormerGrant of patent is intended
Status updated on  08.02.2022
FormerExamination is in progress
Status updated on  05.04.2019
Most recent event   Tooltip18.10.2024Lapse of the patent in a contracting state
New state(s): GR
published on 20.11.2024 [2024/47]
Applicant(s)For all designated states
Semiconductor Components Industries, LLC
5005 East McDowell Road
Phoenix, AZ 85008 / US
[2024/44]
Former [2014/38]For all designated states
Fairchild Semiconductor Corporation
3030 Orchard Parkway
San Jose, CA 95134 / US
Inventor(s)01 / Yedinak, Joseph A.
114 Ash Lane
Mountain Top, PA 18707 / US
02 / Probst, Dean E.
6867 Liza Lane
West Jordan, UT 84081 / US
03 / Stokes, Richard
276 Jackson Road
Shavertown, PA 18708 / US
04 / Kim, Suku
11721 Suntea Way
South Jordan, UT 84095 / US
05 / Higgs, Jason
791 St. Mary's Road
Mountain Top, PA 18707 / US
06 / Session, Fred
12139 Nicklaus Road
Sandy, UT 84092 / US
07 / Chen, Hui
11467 Wexford Way
South Jordan, UT 84095 / US
08 / Sapp, Steven
834 Pine Drive
Felton, CA 95018 / US
09 / Preece, Jayson
3182W 13010S
Riverton, UT 84065 / US
10 / Rinehimer, Mark L.
85 Fieldstone Way
Mountain Top, PA 18707 / US
 [2014/38]
Representative(s)Schmidt, Steffen J., et al
Wuesthoff & Wuesthoff
Patentanwälte und Rechtsanwalt PartG mbB
Schweigerstrasse 2
81541 München / DE
[2024/23]
Former [2014/38]Müller-Boré & Partner Patentanwälte PartG mbB
Friedenheimer Brücke 21
80639 München / DE
Application number, filing date14000929.113.03.2014
[2014/38]
Priority number, dateUS201361801253P15.03.2013         Original published format: US 201361801253 P
US201361801272P15.03.2013         Original published format: US 201361801272 P
US20141420476511.03.2014         Original published format: US201414204765
[2014/38]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP2779248
Date:17.09.2014
Language:EN
[2014/38]
Type: A3 Search report 
No.:EP2779248
Date:14.01.2015
Language:EN
[2015/03]
Type: B1 Patent specification 
No.:EP2779248
Date:05.06.2024
Language:EN
[2024/23]
Search report(s)(Supplementary) European search report - dispatched on:EP16.12.2014
ClassificationIPC:H01L29/40, H01L29/78, H01L29/739
[2021/43]
CPC:
H01L29/7813 (EP,CN,US); H01L29/7802 (KR); H01L29/7811 (EP,CN,US);
H01L21/02104 (US); H01L29/06 (US); H01L29/0649 (EP,US);
H01L29/0661 (US); H01L29/404 (EP,US); H01L29/407 (EP,US);
H01L29/41 (EP); H01L29/4238 (EP,US); H01L29/7395 (US);
H01L29/7827 (US); H01L29/0638 (EP,US); H01L29/42364 (EP,CN,US) (-)
Former IPC [2014/40]H01L29/78, H01L29/739
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2015/35]
Former [2014/38]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:Vorrichtung entsprechend Randabschlussregionen eines Halbleiterbauelements[2021/43]
English:Apparatus related to termination regions of a semiconductor device[2014/38]
French:Appareil relatifs aux régions de terminaison d'un dispositif à semi-conducteurs[2014/38]
Former [2014/38]Vorrichtung zur Bestimmung der Regionen einer Halbleitervorrichtung
Examination procedure14.07.2015Amendment by applicant (claims and/or description)
14.07.2015Examination requested  [2015/35]
09.04.2019Despatch of a communication from the examining division (Time limit: M04)
19.07.2019Reply to a communication from the examining division
21.07.2020Despatch of a communication from the examining division (Time limit: M02)
22.07.2020Reply to a communication from the examining division
02.11.2020Despatch of a communication from the examining division (Time limit: M02)
29.12.2020Reply to a communication from the examining division
09.02.2022Communication of intention to grant the patent
16.02.2022Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
11.05.2022Communication of intention to grant the patent
09.09.2022Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
24.11.2022Despatch of a communication from the examining division (Time limit: M02)
24.01.2023Reply to a communication from the examining division
22.04.2024Communication of intention to grant the patent
24.04.2024Fee for grant paid
24.04.2024Fee for publishing/printing paid
24.04.2024Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  09.04.2019
Fees paidRenewal fee
23.03.2016Renewal fee patent year 03
23.03.2017Renewal fee patent year 04
23.03.2018Renewal fee patent year 05
22.03.2019Renewal fee patent year 06
20.03.2020Renewal fee patent year 07
23.03.2021Renewal fee patent year 08
23.03.2022Renewal fee patent year 09
21.03.2023Renewal fee patent year 10
20.03.2024Renewal fee patent year 11
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Lapses during opposition  TooltipBG05.06.2024
FI05.06.2024
HR05.06.2024
NO05.09.2024
GR06.09.2024
[2024/47]
Former [2024/46]BG05.06.2024
FI05.06.2024
HR05.06.2024
NO05.09.2024
Documents cited:Search[A]US2003222297  (KRUMREY JOACHIM [DE], et al);
 [XA]US2005017293  (ZUNDEL MARKUS [DE], et al);
 [XA]JP2005322949  (RENESAS TECH CORP, et al);
 [XA]JP2006032420  (TOYOTA MOTOR CORP, et al);
 [XA]DE102006030225  (INFINEON TECHNOLOGIES AUSTRIA [AT]);
 [XA]EP2339636  (ST MICROELECTRONICS SRL [IT])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.