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Extract from the Register of European Patents

EP About this file: EP2782126

EP2782126 - Member for semiconductor manufacturing apparatuses [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  26.02.2021
Database last updated on 02.08.2024
FormerThe patent has been granted
Status updated on  20.03.2020
FormerGrant of patent is intended
Status updated on  13.11.2019
Most recent event   Tooltip14.06.2024Lapse of the patent in a contracting state
New state(s): TR		published on 17.07.2024  [2024/29]
Applicant(s)For all designated states
NGK Insulators, Ltd.
2-56, Suda-cho, Mizuho-ku
Nagoya-city, Aichi 467-8530 / JP
[2014/39]
Inventor(s)01 / Ohba, Kazuma
c/o NGK Insulators, Ltd., Legal Affairs &
Intellectual Property Dept.
2-56 Suda-cho
Mizuho-ku
Nagoya-city, Aichi 467-8530 / JP
02 / Kawajiri, Tetsuya
c/o NGK Insulators, Ltd., Legal Affairs &
Intellectual Property Dept.
2-56 Suda-cho
Mizuho-ku
Nagoya-city, Aichi 467-8530 / JP
03 / Kataigi, Takashi
c/o NGK Insulators, Ltd., Legal Affairs &
Intellectual Property Dept.
2-56 Suda-cho
Mizuho-ku
Nagoya-city, Aichi 467-8530 / JP
 [2014/39]
Representative(s)Mewburn Ellis LLP
Aurora Building
Counterslip
Bristol BS1 6BX / GB
[N/P]
Former [2020/17]Mewburn Ellis LLP
City Tower
40 Basinghall Street
London EC2V 5DE / GB
Former [2014/39]Naylor, Matthew John, et al
Mewburn Ellis LLP
33 Gutter Lane
London
EC2V 8AS / GB
Application number, filing date14159711.214.03.2014
[2014/39]
Priority number, dateJP2013005484018.03.2013         Original published format: JP 2013054840
[2014/39]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP2782126
Date:24.09.2014
Language:EN
[2014/39]
Type: B1 Patent specification 
No.:EP2782126
Date:22.04.2020
Language:EN
[2020/17]
Search report(s)(Supplementary) European search report - dispatched on:EP12.05.2014
ClassificationIPC:H01L21/67, H01L21/683
[2014/39]
CPC:
H01L21/67103 (EP,CN,US); H01L21/67 (US); B32B15/04 (US);
B32B18/00 (US); B32B7/12 (US); H01L21/6833 (EP,CN,US);
Y10T428/31522 (EP,US) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2015/18]
Former [2014/39]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:Element für Halbleiterherstellungsvorrichtungen[2014/39]
English:Member for semiconductor manufacturing apparatuses[2014/39]
French:Élément pour appareils de fabrication de semi-conducteur[2014/39]
Examination procedure24.03.2015Amendment by applicant (claims and/or description)
24.03.2015Examination requested  [2015/18]
14.11.2019Communication of intention to grant the patent
21.02.2020Fee for grant paid
21.02.2020Fee for publishing/printing paid
21.02.2020Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  14.11.2019
Opposition(s)25.01.2021No opposition filed within time limit [2021/13]
Fees paidRenewal fee
21.03.2016Renewal fee patent year 03
27.01.2017Renewal fee patent year 04
13.03.2018Renewal fee patent year 05
13.03.2019Renewal fee patent year 06
12.03.2020Renewal fee patent year 07
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU14.03.2014
AL22.04.2020
AT22.04.2020
CY22.04.2020
CZ22.04.2020
DK22.04.2020
EE22.04.2020
ES22.04.2020
FI22.04.2020
HR22.04.2020
IT22.04.2020
LT22.04.2020
LV22.04.2020
MC22.04.2020
MK22.04.2020
NL22.04.2020
PL22.04.2020
RO22.04.2020
RS22.04.2020
SE22.04.2020
SI22.04.2020
SK22.04.2020
SM22.04.2020
TR22.04.2020
BG22.07.2020
NO22.07.2020
GR23.07.2020
IS22.08.2020
PT24.08.2020
[2024/29]
Former [2024/22]HU14.03.2014
AL22.04.2020
AT22.04.2020
CY22.04.2020
CZ22.04.2020
DK22.04.2020
EE22.04.2020
ES22.04.2020
FI22.04.2020
HR22.04.2020
IT22.04.2020
LT22.04.2020
LV22.04.2020
MC22.04.2020
MK22.04.2020
NL22.04.2020
PL22.04.2020
RO22.04.2020
RS22.04.2020
SE22.04.2020
SI22.04.2020
SK22.04.2020
SM22.04.2020
BG22.07.2020
NO22.07.2020
GR23.07.2020
IS22.08.2020
PT24.08.2020
Former [2023/30]HU14.03.2014
AL22.04.2020
AT22.04.2020
CY22.04.2020
CZ22.04.2020
DK22.04.2020
EE22.04.2020
ES22.04.2020
FI22.04.2020
HR22.04.2020
IT22.04.2020
LT22.04.2020
LV22.04.2020
MC22.04.2020
NL22.04.2020
PL22.04.2020
RO22.04.2020
RS22.04.2020
SE22.04.2020
SI22.04.2020
SK22.04.2020
SM22.04.2020
BG22.07.2020
NO22.07.2020
GR23.07.2020
IS22.08.2020
PT24.08.2020
Former [2023/27]HU14.03.2014
AL22.04.2020
AT22.04.2020
CZ22.04.2020
DK22.04.2020
EE22.04.2020
ES22.04.2020
FI22.04.2020
HR22.04.2020
IT22.04.2020
LT22.04.2020
LV22.04.2020
MC22.04.2020
NL22.04.2020
PL22.04.2020
RO22.04.2020
RS22.04.2020
SE22.04.2020
SI22.04.2020
SK22.04.2020
SM22.04.2020
BG22.07.2020
NO22.07.2020
GR23.07.2020
IS22.08.2020
PT24.08.2020
Former [2021/45]AL22.04.2020
AT22.04.2020
CZ22.04.2020
DK22.04.2020
EE22.04.2020
ES22.04.2020
FI22.04.2020
HR22.04.2020
IT22.04.2020
LT22.04.2020
LV22.04.2020
MC22.04.2020
NL22.04.2020
PL22.04.2020
RO22.04.2020
RS22.04.2020
SE22.04.2020
SI22.04.2020
SK22.04.2020
SM22.04.2020
BG22.07.2020
NO22.07.2020
GR23.07.2020
IS22.08.2020
PT24.08.2020
Former [2021/24]AL22.04.2020
AT22.04.2020
CZ22.04.2020
DK22.04.2020
EE22.04.2020
ES22.04.2020
FI22.04.2020
HR22.04.2020
IT22.04.2020
LT22.04.2020
LV22.04.2020
NL22.04.2020
PL22.04.2020
RO22.04.2020
RS22.04.2020
SE22.04.2020
SI22.04.2020
SK22.04.2020
SM22.04.2020
BG22.07.2020
NO22.07.2020
GR23.07.2020
IS22.08.2020
PT24.08.2020
Former [2021/10]AL22.04.2020
AT22.04.2020
CZ22.04.2020
DK22.04.2020
EE22.04.2020
ES22.04.2020
FI22.04.2020
HR22.04.2020
IT22.04.2020
LT22.04.2020
LV22.04.2020
NL22.04.2020
PL22.04.2020
RO22.04.2020
RS22.04.2020
SE22.04.2020
SK22.04.2020
SM22.04.2020
BG22.07.2020
NO22.07.2020
GR23.07.2020
IS22.08.2020
PT24.08.2020
Former [2021/09]AL22.04.2020
AT22.04.2020
CZ22.04.2020
DK22.04.2020
EE22.04.2020
ES22.04.2020
FI22.04.2020
HR22.04.2020
IT22.04.2020
LT22.04.2020
LV22.04.2020
NL22.04.2020
RO22.04.2020
RS22.04.2020
SE22.04.2020
SM22.04.2020
BG22.07.2020
NO22.07.2020
GR23.07.2020
IS22.08.2020
PT24.08.2020
Former [2021/08]AL22.04.2020
DK22.04.2020
ES22.04.2020
FI22.04.2020
HR22.04.2020
LT22.04.2020
LV22.04.2020
NL22.04.2020
RO22.04.2020
RS22.04.2020
SE22.04.2020
SM22.04.2020
BG22.07.2020
NO22.07.2020
GR23.07.2020
IS22.08.2020
PT24.08.2020
Former [2021/04]AL22.04.2020
FI22.04.2020
HR22.04.2020
LT22.04.2020
LV22.04.2020
NL22.04.2020
RS22.04.2020
SE22.04.2020
BG22.07.2020
NO22.07.2020
GR23.07.2020
IS22.08.2020
PT24.08.2020
Former [2021/01]FI22.04.2020
HR22.04.2020
LT22.04.2020
LV22.04.2020
NL22.04.2020
RS22.04.2020
SE22.04.2020
BG22.07.2020
NO22.07.2020
GR23.07.2020
IS22.08.2020
PT24.08.2020
Former [2020/51]FI22.04.2020
HR22.04.2020
LT22.04.2020
LV22.04.2020
NL22.04.2020
RS22.04.2020
SE22.04.2020
NO22.07.2020
GR23.07.2020
IS22.08.2020
PT24.08.2020
Former [2020/50]FI22.04.2020
HR22.04.2020
LT22.04.2020
LV22.04.2020
NL22.04.2020
SE22.04.2020
NO22.07.2020
GR23.07.2020
IS22.08.2020
PT24.08.2020
Former [2020/48]FI22.04.2020
LT22.04.2020
NL22.04.2020
SE22.04.2020
NO22.07.2020
IS22.08.2020
PT24.08.2020
Former [2020/47]LT22.04.2020
NO22.07.2020
IS22.08.2020
Former [2020/46]IS22.08.2020
Documents cited:Search[Y]US4026831  (MORIYA MASAFUMI, et al) [Y] 1-9 * column 1, line 46 - column 13, line 22 *;
 [Y]US6166897  (MATSUNAGA TADAO [JP]) [Y] 1-9 * column 3, line 49 - column 10, line 35 * * figures 1,2 *;
 [A]US2005046021  (HOSOKAWA KAZUHITO [JP]) [A] 1 * the whole document *;
 [A]EP1986228  (SHINETSU CHEMICAL CO [JP]) [A] 1 * the whole document *;
 [A]US2009246915  (ICHIKAWA ISAO [JP], et al) [A] 1* the whole document *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.