| EP2843913 - Mounting structure for a flexible printed circuit board [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 27.09.2019 Database last updated on 14.03.2026 | |
| Former | The patent has been granted Status updated on 19.10.2018 | ||
| Former | Grant of patent is intended Status updated on 03.07.2018 | ||
| Former | Examination is in progress Status updated on 20.01.2017 | Most recent event Tooltip | 01.07.2022 | Lapse of the patent in a contracting state New state(s): MK | published on 03.08.2022 [2022/31] | Applicant(s) | For all designated states Samsung Electronics Co., Ltd. 129, Samsung-ro Yeongtong-gu Suwon-si Gyeonggi-do 443-742 / KR | [2018/47] |
| Former [2015/10] | For all designated states Samsung Electronics Co., Ltd 129, Samsung-ro Yeongtong-gu Suwon-si Gyeonggi-do 443-742 / KR | Inventor(s) | 01 /
Park, Sung-Wu 117-1505, 500, Dongbuk-ro, Dong-gu Daegu / KR | 02 /
Kim, Min-Suk 101-1107, 545, Parkchunghee-ro, Gumi-si Gyeongsangbuk-do / KR | 03 /
Park, Soon-Sang 203-1706, 123, Dongwon-ro, Suseong-gu Daegu / KR | [2015/10] | Representative(s) | Nederlandsch Octrooibureau P.O. Box 29720 2502 LS The Hague / NL | [2015/10] | Application number, filing date | 14182647.9 | 28.08.2014 | [2015/10] | Priority number, date | KR20130102740 | 28.08.2013 Original published format: KR 20130102740 | [2015/10] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2843913 | Date: | 04.03.2015 | Language: | EN | [2015/10] | Type: | B1 Patent specification | No.: | EP2843913 | Date: | 21.11.2018 | Language: | EN | [2018/47] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 20.01.2015 | Classification | IPC: | H04M1/02, H01Q1/24, H05K1/18 | [2015/10] | CPC: |
H04M1/0277 (EP);
H01Q1/24 (KR);
H01Q1/085 (EP);
H01Q1/12 (EP);
H01Q1/243 (EP);
H01Q1/38 (EP,KR);
H05K3/0064 (EP);
H05K1/028 (EP);
H05K1/0284 (EP);
H05K1/147 (EP);
H05K1/16 (EP);
H05K2201/041 (EP);
H05K2201/046 (EP);
H05K2201/09063 (EP);
H05K2201/10098 (EP);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2015/10] | Title | German: | Montagestruktur für eine flexible Leiterplatte | [2015/10] | English: | Mounting structure for a flexible printed circuit board | [2015/10] | French: | Structure d'assemblage pour un circuit imprimé flexible | [2015/10] | Examination procedure | 28.08.2014 | Examination requested [2015/10] | 03.09.2015 | Amendment by applicant (claims and/or description) | 24.01.2017 | Despatch of a communication from the examining division (Time limit: M04) | 30.05.2017 | Reply to a communication from the examining division | 06.10.2017 | Despatch of a communication from the examining division (Time limit: M01) | 16.11.2017 | Reply to a communication from the examining division | 04.07.2018 | Communication of intention to grant the patent | 09.10.2018 | Fee for grant paid | 09.10.2018 | Fee for publishing/printing paid | 09.10.2018 | Receipt of the translation of the claim(s) | Opposition(s) | 22.08.2019 | No opposition filed within time limit [2019/44] | Fees paid | Renewal fee | 15.08.2016 | Renewal fee patent year 03 | 10.08.2017 | Renewal fee patent year 04 | 22.08.2018 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 28.08.2014 | AL | 21.11.2018 | AT | 21.11.2018 | CY | 21.11.2018 | CZ | 21.11.2018 | DK | 21.11.2018 | EE | 21.11.2018 | ES | 21.11.2018 | FI | 21.11.2018 | HR | 21.11.2018 | IT | 21.11.2018 | LT | 21.11.2018 | LV | 21.11.2018 | MC | 21.11.2018 | MK | 21.11.2018 | MT | 21.11.2018 | PL | 21.11.2018 | RO | 21.11.2018 | RS | 21.11.2018 | SE | 21.11.2018 | SI | 21.11.2018 | SK | 21.11.2018 | SM | 21.11.2018 | TR | 21.11.2018 | BG | 21.02.2019 | NO | 21.02.2019 | GR | 22.02.2019 | IS | 21.03.2019 | PT | 21.03.2019 | [2022/31] |
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| NO | 21.02.2019 | Documents cited: | Search | [XYI] US6770813 (RAMSAGAR PRASANNA et al.) [X] 1-4,6-8,10,11 * column 2, line 41 - column 3, line 45; figures 1-6 *[Y] 5,12,13 [I] 9 | [X] US2012162936 (FUJIMORI KOTARO et al.) [X] 1,6,8,11 * paragraphs [0063] - [0069]; figures 6,9 * | [Y] US2012252535 (KAJIWARA YOSHIFUMI et al.) [Y] 5 * paragraphs [0028] , [0032] - [0036]; figure 1 * * paragraph [0042]; figure 4 * * paragraphs [0060] - [0061]; figures 8,9 * | [Y] US2009322629 (HUNG CHIEN MING et al.) [Y] 12,13 * paragraphs [0005] - [0007]; figure 1A * |