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Extract from the Register of European Patents

EP About this file: EP3018715

EP3018715 - Method for manufacturing a transistor device comprising a germanium channel material on a silicon based substrate [Right-click to bookmark this link]
Former [2016/19]Method for manufacturing a transistor device comprising a germanium channel material on a silicon based substrate, and associated transistor device
[2024/27]
StatusGrant of patent is intended
Status updated on  27.06.2024
Database last updated on 22.08.2024
FormerExamination is in progress
Status updated on  04.11.2019
FormerRequest for examination was made
Status updated on  18.11.2016
Most recent event   Tooltip27.06.2024New entry: Communication of intention to grant a patent 
Applicant(s)For all designated states
IMEC VZW
Kapeldreef 75
3001 Leuven / BE
[2016/19]
Inventor(s)01 / Sun, Jianwu
IMEC VZW, Patent department
Kapeldreef 75
3001 Leuven / BE
02 / Loo, Roger
IMEC VZW, Patent department
Kapeldreef 75
3001 Leuven / BE
 [2016/19]
Representative(s)Patent Department IMEC
IMEC vzw
Patent Department
Kapeldreef 75
3001 Leuven / BE
[2016/19]
Application number, filing date14191938.105.11.2014
[2016/19]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP3018715
Date:11.05.2016
Language:EN
[2016/19]
Search report(s)(Supplementary) European search report - dispatched on:EP15.04.2015
ClassificationIPC:H01L29/66, H01L29/78, H01L29/10
[2016/19]
CPC:
H01L29/66795 (EP,US); H01L21/32055 (US); H01L21/02532 (US);
H01L21/02645 (US); H01L21/02647 (US); H01L21/31111 (US);
H01L29/0649 (US); H01L29/1054 (EP,US); H01L29/161 (US);
H01L29/785 (EP,US) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2016/51]
Former [2016/19]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
Extension statesBANot yet paid
MENot yet paid
TitleGerman:Verfahren zur Herstellung einer Transistorvorrichtung mit einem Germanium-Kanalmaterial auf einem siliziumbasierten Substrat[2024/27]
English:Method for manufacturing a transistor device comprising a germanium channel material on a silicon based substrate[2024/27]
French:Procédé de fabrication d'un dispositif de transistor comprenant un matériau de canal de germanium sur un substrat à base de silicium[2024/27]
Former [2016/19]Verfahren zur Herstellung einer Transistorvorrichtung mit einem Germanium-Kanalmaterial auf einem siliziumbasierten Substrat und zugehörige Transistorvorrichtung
Former [2016/19]Method for manufacturing a transistor device comprising a germanium channel material on a silicon based substrate, and associated transistor device
Former [2016/19]Procédé de fabrication d'un dispositif de transistor comprenant un matériau de canal de germanium sur un substrat à base de silicium et dispositif à transistor associé
Examination procedure05.11.2014Date on which the examining division has become responsible
10.11.2016Amendment by applicant (claims and/or description)
10.11.2016Examination requested  [2016/51]
07.11.2019Despatch of a communication from the examining division (Time limit: M06)
12.05.2020Reply to a communication from the examining division
14.09.2022Despatch of a communication from the examining division (Time limit: M06)
24.03.2023Reply to a communication from the examining division
28.06.2024Communication of intention to grant the patent
Fees paidRenewal fee
23.11.2016Renewal fee patent year 03
22.11.2017Renewal fee patent year 04
22.11.2018Renewal fee patent year 05
20.11.2019Renewal fee patent year 06
19.11.2020Renewal fee patent year 07
18.11.2021Renewal fee patent year 08
22.11.2022Renewal fee patent year 09
22.11.2023Renewal fee patent year 10
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Documents cited:Search[Y]US2009039361  (LI JIZHONG [US], et al);
 [A]US2012094467  (WU CHENG-HSIEN [TW], et al);
 [A]US2013234147  (WU CHENG-HSIEN [TW], et al);
 [A]EP2741320  (IMEC [BE]);
 [A]US2014217499  (LEE YI-JING [TW], et al);
 [XI]US2014319462  (HUANG YU-LIEN [TW], et al);
 [E]US2015054040  (LEE YI-JING [TW], et al);
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.