blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...
blank Related links

Release notes
European Patent Register Assistant
European Patent Register Resource Book
European Patent Register – pocket guide
FAQ - European Patent Register
FAQ - Register Alert
Federated Register (Flyer)
Global Dossier (Flyer)
Register events
Deep link coverage
Federated Register content
The Patent Information Tour
Fair use charter

Extract from the Register of European Patents

EP About this file: EP2956962

EP2956962 - SEMICONDUCTOR DEVICE HAVING STACKED MEMORY ELEMENTS AND METHOD OF STACKING MEMORY ELEMENTS ON A SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  18.09.2020
Database last updated on 24.08.2024
FormerThe patent has been granted
Status updated on  11.10.2019
FormerGrant of patent is intended
Status updated on  30.05.2019
Most recent event   Tooltip08.07.2022Lapse of the patent in a contracting state
New state(s): MK		published on 10.08.2022  [2022/32]
Applicant(s)For all designated states
Qualcomm Incorporated
5775 Morehouse Drive
San Diego, CA 92121-1714 / US
[2015/52]
Inventor(s)01 / HENDERSON, Brian, M.
5775 Morehouse Drive
San Diego, CA 92121-1714 / US
02 / GU, Shiqun
5775 Morehouse Drive
San Diego, CA 92121-1714 / US
 [2015/52]
Representative(s)Loveless, Ian Mark
Reddie & Grose LLP The White Chapel Building
10 Whitechapel High Street
London E1 8QS / GB
[2019/46]
Former [2015/52]Loveless, Ian Mark
Reddie & Grose LLP
16 Theobalds Road
London WC1X 8PL / GB
Application number, filing date14707558.412.02.2014
[2015/52]
WO2014US16081
Priority number, dateUS20131376621813.02.2013         Original published format: US201313766218
[2015/52]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2014127032
Date:21.08.2014
Language:EN
[2014/34]
Type: A1 Application with search report 
No.:EP2956962
Date:23.12.2015
Language:EN
The application published by WIPO in one of the EPO official languages on 21.08.2014 takes the place of the publication of the European patent application.
[2015/52]
Type: B1 Patent specification 
No.:EP2956962
Date:13.11.2019
Language:EN
[2019/46]
Search report(s)International search report - published on:EP21.08.2014
ClassificationIPC:H01L25/065, H01L25/18
[2015/52]
CPC:
H01L25/0657 (EP,US); H01L21/50 (US); H01L23/49827 (EP,US);
H01L23/49833 (EP,US); H01L25/0652 (EP,US); H01L25/18 (EP,US);
H01L2224/13025 (EP,US); H01L2224/16145 (EP,US); H01L2224/16146 (EP,US);
H01L2224/16225 (US); H01L2224/16227 (EP,US); H01L2224/16235 (EP,US);
H01L2224/1703 (EP,US); H01L2224/17181 (EP,US); H01L2224/73253 (EP,US);
H01L2225/06513 (EP,US); H01L2225/06517 (EP,US); H01L2225/06527 (EP,US);
H01L2225/06541 (EP,US); H01L2225/06562 (EP,US); H01L2225/06572 (EP,US);
H01L2225/06589 (EP,US); H01L23/481 (US); H01L23/525 (EP,US);
H01L24/17 (EP,US); H01L2924/00014 (EP,US); H01L2924/0002 (US) (-)
C-Set:
H01L2924/00014, H01L2224/13099 (US,EP);
H01L2924/0002, H01L2924/00 (US)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2015/52]
Extension statesBANot yet paid
MENot yet paid
TitleGerman:HALBLEITERVORRICHTUNG MIT GESTAPELTEN SPEICHERELEMENTEN UND VERFAHREN ZUM STAPELN VON SPEICHERLEMENTEN AUF EINE HALBLEITERVORRICHTUNG[2019/24]
English:SEMICONDUCTOR DEVICE HAVING STACKED MEMORY ELEMENTS AND METHOD OF STACKING MEMORY ELEMENTS ON A SEMICONDUCTOR DEVICE[2015/52]
French:DISPOSITIF SEMI-CONDUCTEUR AVEC ÉLÉMENTS DE MÉMOIRE EMPILÉS ET PROCÉDÉ POUR L'EMPILAGE D'ÉLÉMENTS DE MÉMOIRE SUR UN DISPOSITIF SEMI-CONDUCTEUR[2019/24]
Former [2015/52]HALBLEITERBAUELEMENT MIT GESTAPELTEN SPEICHERELEMENTEN UND VERFAHREN ZUM STAPELN VON SPEICHERELEMENTEN AUF EINEM HALBLEITERBAUELEMENT
Former [2015/52]DISPOSITIF À SEMI-CONDUCTEUR DOTÉ D'ÉLÉMENTS DE MÉMOIRE 3D ET PROCÉDÉ D'EMPILAGE D'ÉLÉMENTS DE MÉMOIRE SUR UN DISPOSITIF À SEMI-CONDUCTEUR
Entry into regional phase06.08.2015National basic fee paid 
06.08.2015Designation fee(s) paid 
06.08.2015Examination fee paid 
Examination procedure12.12.2014Request for preliminary examination filed
International Preliminary Examining Authority: EP
06.08.2015Examination requested  [2015/52]
09.03.2016Amendment by applicant (claims and/or description)
31.05.2019Communication of intention to grant the patent
30.09.2019Fee for grant paid
30.09.2019Fee for publishing/printing paid
30.09.2019Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  31.05.2019
Opposition(s)14.08.2020No opposition filed within time limit [2020/43]
Fees paidRenewal fee
09.12.2015Renewal fee patent year 03
07.02.2017Renewal fee patent year 04
07.02.2018Renewal fee patent year 05
08.02.2019Renewal fee patent year 06
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU12.02.2014
AL13.11.2019
AT13.11.2019
CY13.11.2019
CZ13.11.2019
DK13.11.2019
EE13.11.2019
ES13.11.2019
FI13.11.2019
HR13.11.2019
IT13.11.2019
LT13.11.2019
LV13.11.2019
MC13.11.2019
MK13.11.2019
MT13.11.2019
NL13.11.2019
PL13.11.2019
RO13.11.2019
RS13.11.2019
SE13.11.2019
SI13.11.2019
SK13.11.2019
SM13.11.2019
TR13.11.2019
IE12.02.2020
LU12.02.2020
BG13.02.2020
NO13.02.2020
GR14.02.2020
BE29.02.2020
CH29.02.2020
LI29.02.2020
IS13.03.2020
PT13.03.2020
[2022/32]
Former [2022/27]HU12.02.2014
AL13.11.2019
AT13.11.2019
CY13.11.2019
CZ13.11.2019
DK13.11.2019
EE13.11.2019
ES13.11.2019
FI13.11.2019
HR13.11.2019
IT13.11.2019
LT13.11.2019
LV13.11.2019
MC13.11.2019
MT13.11.2019
NL13.11.2019
PL13.11.2019
RO13.11.2019
RS13.11.2019
SE13.11.2019
SI13.11.2019
SK13.11.2019
SM13.11.2019
TR13.11.2019
IE12.02.2020
LU12.02.2020
BG13.02.2020
NO13.02.2020
GR14.02.2020
BE29.02.2020
CH29.02.2020
LI29.02.2020
IS13.03.2020
PT13.03.2020
Former [2021/10]AL13.11.2019
AT13.11.2019
CZ13.11.2019
DK13.11.2019
EE13.11.2019
ES13.11.2019
FI13.11.2019
HR13.11.2019
IT13.11.2019
LT13.11.2019
LV13.11.2019
MC13.11.2019
NL13.11.2019
PL13.11.2019
RO13.11.2019
RS13.11.2019
SE13.11.2019
SI13.11.2019
SK13.11.2019
SM13.11.2019
IE12.02.2020
LU12.02.2020
BG13.02.2020
NO13.02.2020
GR14.02.2020
BE29.02.2020
CH29.02.2020
LI29.02.2020
IS13.03.2020
PT13.03.2020
Former [2021/08]AL13.11.2019
AT13.11.2019
CZ13.11.2019
DK13.11.2019
EE13.11.2019
ES13.11.2019
FI13.11.2019
HR13.11.2019
LT13.11.2019
LV13.11.2019
MC13.11.2019
NL13.11.2019
PL13.11.2019
RO13.11.2019
RS13.11.2019
SE13.11.2019
SI13.11.2019
SK13.11.2019
SM13.11.2019
IE12.02.2020
LU12.02.2020
BG13.02.2020
NO13.02.2020
GR14.02.2020
CH29.02.2020
LI29.02.2020
IS13.03.2020
PT13.03.2020
Former [2020/51]AL13.11.2019
AT13.11.2019
CZ13.11.2019
DK13.11.2019
EE13.11.2019
ES13.11.2019
FI13.11.2019
HR13.11.2019
LT13.11.2019
LV13.11.2019
MC13.11.2019
NL13.11.2019
PL13.11.2019
RO13.11.2019
RS13.11.2019
SE13.11.2019
SI13.11.2019
SK13.11.2019
SM13.11.2019
LU12.02.2020
BG13.02.2020
NO13.02.2020
GR14.02.2020
CH29.02.2020
LI29.02.2020
IS13.03.2020
PT13.03.2020
Former [2020/50]AL13.11.2019
AT13.11.2019
CZ13.11.2019
DK13.11.2019
EE13.11.2019
ES13.11.2019
FI13.11.2019
HR13.11.2019
LT13.11.2019
LV13.11.2019
MC13.11.2019
NL13.11.2019
PL13.11.2019
RO13.11.2019
RS13.11.2019
SE13.11.2019
SI13.11.2019
SK13.11.2019
SM13.11.2019
LU12.02.2020
BG13.02.2020
NO13.02.2020
GR14.02.2020
IS13.03.2020
PT13.03.2020
Former [2020/48]AL13.11.2019
CZ13.11.2019
DK13.11.2019
EE13.11.2019
ES13.11.2019
FI13.11.2019
HR13.11.2019
LT13.11.2019
LV13.11.2019
NL13.11.2019
PL13.11.2019
RO13.11.2019
RS13.11.2019
SE13.11.2019
SK13.11.2019
SM13.11.2019
LU12.02.2020
BG13.02.2020
NO13.02.2020
GR14.02.2020
IS13.03.2020
PT13.03.2020
Former [2020/37]AL13.11.2019
CZ13.11.2019
DK13.11.2019
EE13.11.2019
ES13.11.2019
FI13.11.2019
HR13.11.2019
LT13.11.2019
LV13.11.2019
NL13.11.2019
PL13.11.2019
RO13.11.2019
RS13.11.2019
SE13.11.2019
SK13.11.2019
SM13.11.2019
BG13.02.2020
NO13.02.2020
GR14.02.2020
IS13.03.2020
PT13.03.2020
Former [2020/36]AL13.11.2019
CZ13.11.2019
DK13.11.2019
EE13.11.2019
ES13.11.2019
FI13.11.2019
HR13.11.2019
LT13.11.2019
LV13.11.2019
NL13.11.2019
PL13.11.2019
RO13.11.2019
RS13.11.2019
SE13.11.2019
BG13.02.2020
NO13.02.2020
GR14.02.2020
IS13.03.2020
PT13.03.2020
Former [2020/35]AL13.11.2019
CZ13.11.2019
ES13.11.2019
FI13.11.2019
HR13.11.2019
LT13.11.2019
LV13.11.2019
NL13.11.2019
PL13.11.2019
RO13.11.2019
RS13.11.2019
SE13.11.2019
BG13.02.2020
NO13.02.2020
GR14.02.2020
IS13.03.2020
PT13.03.2020
Former [2020/34]AL13.11.2019
ES13.11.2019
FI13.11.2019
HR13.11.2019
LT13.11.2019
LV13.11.2019
NL13.11.2019
PL13.11.2019
RS13.11.2019
SE13.11.2019
BG13.02.2020
NO13.02.2020
GR14.02.2020
IS13.03.2020
PT13.03.2020
Former [2020/32]AL13.11.2019
FI13.11.2019
HR13.11.2019
LT13.11.2019
LV13.11.2019
NL13.11.2019
PL13.11.2019
RS13.11.2019
SE13.11.2019
BG13.02.2020
NO13.02.2020
GR14.02.2020
IS13.03.2020
PT13.03.2020
Former [2020/25]FI13.11.2019
HR13.11.2019
LT13.11.2019
LV13.11.2019
NL13.11.2019
PL13.11.2019
RS13.11.2019
SE13.11.2019
BG13.02.2020
NO13.02.2020
GR14.02.2020
IS13.03.2020
PT13.03.2020
Former [2020/24]FI13.11.2019
LT13.11.2019
LV13.11.2019
NL13.11.2019
PL13.11.2019
SE13.11.2019
BG13.02.2020
NO13.02.2020
GR14.02.2020
IS13.03.2020
PT13.03.2020
Former [2020/23]FI13.11.2019
LT13.11.2019
LV13.11.2019
NL13.11.2019
PL13.11.2019
SE13.11.2019
BG13.02.2020
NO13.02.2020
GR14.02.2020
PT13.03.2020
Former [2020/22]FI13.11.2019
LT13.11.2019
SE13.11.2019
BG13.02.2020
NO13.02.2020
PT13.03.2020
Former [2020/21]NO13.02.2020
Cited inInternational search[Y]WO9919911  (GENNUM CORP [CA], et al);
 [Y]US2006113663  (YUAN TSORNG-DIH [US], et al);
 [XY]US2010314730  (LABEEB SHAIK [US])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.