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Extract from the Register of European Patents

EP About this file: EP2984494

EP2984494 - METHOD FOR STUDYING THE TEMPERATURE RELIABILITY OF EN ELECTRONIC COMPONENT [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  02.07.2021
Database last updated on 15.06.2024
FormerExamination is in progress
Status updated on  24.03.2017
Most recent event   Tooltip02.07.2021Withdrawal of applicationpublished on 04.08.2021  [2021/31]
Applicant(s)For all designated states
AIRBUS (SAS)
2, rond-point Emile Dewoitine
31700 Blagnac / FR
[2018/20]
Former [2016/07]For all designated states
Airbus Group SAS
37, Boulevard de Montmorency
75016 Paris / FR
Inventor(s)01 / MILLER, Florent
82 rue du 22 Septembre
92400 Courbevoie / FR
02 / MORAND, Sébastien
11 rue Henri Martin
F-92100 Boulogne Billancourt / FR
03 / MOLIERE, Florian
10 boulevard du Général de Gaulle
F-92120 Montrouge / FR
04 / SANTINI, Thomas
59 boulevard Victor
F-75015 Paris / FR
 [2016/08]
Former [2016/07]01 / MILLER, Florent
82 rue du 22 Septembre
F-92400 Montrouge / FR
02 / MORAND, Sébastien
11 rue Henri Martin
F-92100 Boulogne Billancourt / FR
03 / MOLIERE, Florian
10 boulevard du Général de Gaulle
F-92120 Montrouge / FR
04 / SANTINI, Thomas
59 boulevard Victor
F-75015 Paris / FR
Representative(s)Gicquel, Olivier Yves Gérard, et al
Airbus Opérations (S.A.S)
XIF - M0101/1
316, route de Bayonne
31060 Toulouse Cedex / FR
[N/P]
Former [2016/07]Ipside
29, rue de Lisbonne
75008 Paris / FR
Application number, filing date14712244.417.03.2014
[2016/07]
WO2014EP55257
Priority number, dateFR2013005318409.04.2013         Original published format: FR 1353184
[2016/07]
Filing languageFR
Procedural languageFR
PublicationType: A1 Application with search report
No.:WO2014166701
Date:16.10.2014
Language:FR
[2014/42]
Type: A1 Application with search report 
No.:EP2984494
Date:17.02.2016
Language:FR
The application published by WIPO in one of the EPO official languages on 16.10.2014 takes the place of the publication of the European patent application.
[2016/07]
Search report(s)International search report - published on:EP16.10.2014
ClassificationIPC:G01R31/28, G01R31/311
[2016/07]
CPC:
G01R31/2858 (EP); G01R31/2875 (EP); G01R31/311 (EP)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2016/07]
TitleGerman:VERFAHREN ZUR UNTERSUCHUNG DER TEMPERATURZUVERLÄSSIGKEIT EINES ELEKTRONISCHEN BAUELEMENTS[2016/07]
English:METHOD FOR STUDYING THE TEMPERATURE RELIABILITY OF EN ELECTRONIC COMPONENT[2016/07]
French:PROCEDE D'ETUDE DE LA FIABILITE EN TEMPERATURE D'UN COMPOSANT ELECTRONIQUE[2016/07]
Entry into regional phase20.10.2015National basic fee paid 
20.10.2015Designation fee(s) paid 
20.10.2015Examination fee paid 
Examination procedure20.10.2015Examination requested  [2016/07]
19.05.2016Amendment by applicant (claims and/or description)
23.03.2017Despatch of a communication from the examining division (Time limit: M04)
12.05.2017Reply to a communication from the examining division
29.06.2021Application withdrawn by applicant  [2021/31]
30.06.2021Cancellation of oral proceeding that was planned for 15.07.2021
15.07.2021Date of oral proceedings (cancelled)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  23.03.2017
Fees paidRenewal fee
25.03.2016Renewal fee patent year 03
24.03.2017Renewal fee patent year 04
23.03.2018Renewal fee patent year 05
26.03.2019Renewal fee patent year 06
24.03.2020Renewal fee patent year 07
Penalty fee
Additional fee for renewal fee
31.03.202108   M06   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited inInternational search[AD]FR2959018  (EADS EUROP AERONAUTIC DEFENCE [FR], et al) [AD] 1,7-9 * page 10, lines 26-30 * * page 11, line 1 - page 15, line 18; figures 4a, 4b, 5 *;
 [A]US6483326  (BRUCE MICHAEL R [US], et al) [A] 1,4,5 * column 1, lines 44-45 * * column 2, line 46 - column 4, line 43; figures 3-5 *
 [A]  - ZHU D ET AL, "Application of FIB circuit edit combined with TIVA in advanced failure analysis", PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 2008. IPFA 2008. 15TH INTERNATIONAL SYMPOSIUM ON THE, IEEE, PISCATAWAY, NJ, USA, (20080707), ISBN 978-1-4244-2039-1, pages 1 - 4, XP031297693 [A] 1,2,8 * page 1, column r; figure 1 *
ExaminationUS6078183
    - LELLOUCHI D ET AL, "MEMS failure analysis case studies using the IR-OBIRCH method - Short circuit localization in a MEMS pressure sensor", PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 2009. IPFA 2009. 16TH IEEE INTERNATIONAL SYMPOSIUM ON THE, IEEE, PISCATAWAY, NJ, USA, (20090706), ISBN 978-1-4244-3911-9, pages 827 - 831, XP031526469
    - GLOWACKI A M ET AL, "Systematic Characterization of Integrated Circuit Standard Components as Stimulated by Scanning Laser Beam", IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, (20070301), vol. 7, no. 1, doi:10.1109/TDMR.2007.900056, ISSN 1530-4388, pages 31 - 49, XP011187285

DOI:   http://dx.doi.org/10.1109/TDMR.2007.900056
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