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Extract from the Register of European Patents

EP About this file: EP2988323

EP2988323 - METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  25.08.2017
Database last updated on 11.09.2024
Most recent event   Tooltip25.08.2017Withdrawal of applicationpublished on 27.09.2017  [2017/39]
Applicant(s)For all designated states
Sumitomo Electric Industries, Ltd.
5-33 Kitahama 4-chome Chuo-ku
Osaka-shi, Osaka 541-0041 / JP
[2016/08]
Inventor(s)01 / SAITOH, Yu
c/o Osaka Works of
Sumimoto Electric Industries, Ltd.
1-3, Shimaya 1-chome
Konohana-ku
Osaka-shi Osaka 554-0024 / JP
02 / MASUDA, Takeyoshi
c/o Osaka Works of SUMITOMO ELECTRIC INDUSTRIES
LTD.
1-3 Shimaya 1-chome
Konohana-ku
Osaka-shi Osaka 554-0024 / JP
03 / HIRATSUKA, Kenji
c/o Osaka Works of SUMITOMO ELECTRIC INDUSTRIES
LTD.
1-3 Shimaya 1-chome
Konohana-ku
Osaka-shi Osaka 554-0024 / JP
 [2016/09]
Former [2016/08]01 / SAITOH, Yu
c/o Osaka Works of SUMITOMO ELECTRIC INDUSTRIES
LTD.
1-3 Shimaya 1-chome
Konohana-ku
Osaka-shi Osaka 554-0024 / JP
02 / MASUDA, Takeyoshi
c/o Osaka Works of SUMITOMO ELECTRIC INDUSTRIES
LTD.
1-3 Shimaya 1-chome
Konohana-ku
Osaka-shi Osaka 554-0024 / JP
03 / HIRATSUKA, Kenji
c/o Osaka Works of SUMITOMO ELECTRIC INDUSTRIES
LTD.
1-3 Shimaya 1-chome
Konohana-ku
Osaka-shi Osaka 554-0024 / JP
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstraße 4
80802 München / DE
[2016/08]
Application number, filing date14784819.605.03.2014
[2016/08]
WO2014JP55566
Priority number, dateJP2013008552816.04.2013         Original published format: JP 2013085528
[2016/08]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2014171211
Date:23.10.2014
Language:JA
[2014/43]
Type: A1 Application with search report 
No.:EP2988323
Date:24.02.2016
Language:EN
[2016/08]
Search report(s)International search report - published on:JP23.10.2014
(Supplementary) European search report - dispatched on:EP31.10.2016
ClassificationIPC:H01L21/336, H01L29/78
[2016/48]
CPC:
H01L21/02236 (EP,US); H01L29/4236 (US); H01L21/02238 (US);
H01L21/02255 (EP,US); H01L21/049 (EP,US); H01L21/31111 (US);
H01L21/31144 (US); H01L29/1608 (EP,US); H01L29/42368 (EP,US);
H01L29/66068 (EP,US); H01L29/7813 (EP,US); H01L29/045 (EP,US) (-)
Former IPC [2016/08]H01L21/336, H01L21/316, H01L29/12, H01L29/78
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2016/08]
TitleGerman:VERFAHREN ZUR HERSTELLUNG EINES SILICIUMCARBID-HALBLEITERBAUELEMENTS[2016/08]
English:METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE[2016/08]
French:PROCÉDÉ DE FABRICATION D'UN DISPOSITIF À SEMI-CONDUCTEUR AU CARBURE DE SILICIUM[2016/08]
Entry into regional phase23.09.2015Translation filed 
23.09.2015National basic fee paid 
23.09.2015Search fee paid 
23.09.2015Designation fee(s) paid 
23.09.2015Examination fee paid 
Examination procedure23.09.2015Examination requested  [2016/08]
09.03.2017Amendment by applicant (claims and/or description)
18.08.2017Application withdrawn by applicant  [2017/39]
Fees paidRenewal fee
29.03.2016Renewal fee patent year 03
10.03.2017Renewal fee patent year 04
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[Y]US2004203200  (WILLIAMS RICHARD K [US], et al) [Y] 9 * paragraph [0107] - paragraph [0109]; figures 13E-13F * * paragraph [0116]; figures 16A-16E *;
 [Y]US2007045631  (ENDO TAKESHI [JP], et al) [Y] 1-5,9,10 * paragraph [0118]; figure 3a * * paragraph [0232] - paragraph [0233]; figure 24 *;
 [Y]EP1981076  (SUMITOMO ELECTRIC INDUSTRIES [JP]) [Y] 4 * paragraph [0019]; figure 3 *;
 [A]WO2012098861  (PANASONIC CORP [JP], et al) [A] 1-10 * abstract * * figures 3(a)-3(e) ** figures 4(a)-4(c) *;
 [Y]WO2012127821  (PANASONIC CORP [JP], et al) [Y] 1-5,9,10 * abstract *;
 [A]US2013023113  (MASUDA TAKEYOSHI [JP], et al) [A] 1-10 * paragraph [0053]; figures 1,2,8 *;
 [P]US2013306982  (KUDOU CHIAKI [JP]) [P] * paragraph [0161] - paragraph [0179]; figures 9-17 *
International search[A]JPH07273323  (NIPPON DENSO CO);
 [A]JP2002299619  (SHINDENGEN ELECTRIC MFG);
 [Y]JP2003509836  (WILLIAMS, RICHARD, K.);
 [Y]JP2004303802  (TOSHIBA CORP);
 [A]JP2005019668  (SHINDENGEN ELECTRIC MFG);
 [Y]JP2005510087  (GENERAL SEMICONDUCTOR, INC.);
 [A]JP2006344760  (SHARP KK);
 [Y]JP2007103729  (TOYOTA MOTOR CORP);
 [A]JP2008519436  (INTERNATIONAL RECTIFIER CORP.);
 [A]JP2009088188  (SANYO ELECTRIC CO);
 [A]JP2011216651  (RENESAS ELECTRONICS CORP);
 [A]US2012037983  (HSHIEH FWU-IUAN [US]);
 [Y]JP2012038771  (SUMITOMO ELECTRIC INDUSTRIES);
 [A]JP2012216675  (TOYOTA MOTOR CORP, et al);
 [A]US2012292693  (LEE YEEHENG [US], et al)
by applicantJPH07326755
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.