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Extract from the Register of European Patents

EP About this file: EP3155658

EP3155658 - MEMORY DIE WITH DIRECT INTEGRATION TO LOGIC DIE AND METHOD OF MANUFACTURING THE SAME [Right-click to bookmark this link]
Former [2017/16]METHOD FOR DIRECT INTEGRATION OF MEMORY DIE TO LOGIC DIE WITHOUT USE OF THROUGH SILICON VIAS (TSV)
[2022/19]
StatusNo opposition filed within time limit
Status updated on  29.12.2023
Database last updated on 22.08.2024
FormerThe patent has been granted
Status updated on  20.01.2023
FormerGrant of patent is intended
Status updated on  26.08.2022
FormerExamination is in progress
Status updated on  05.08.2022
FormerGrant of patent is intended
Status updated on  01.05.2022
FormerExamination is in progress
Status updated on  03.07.2020
FormerRequest for examination was made
Status updated on  20.03.2017
FormerThe international publication has been made
Status updated on  04.11.2016
Most recent event   Tooltip24.05.2024Lapse of the patent in a contracting state
New state(s): IT		published on 26.06.2024  [2024/26]
Applicant(s)For all designated states
Intel Corporation
2200 Mission College Boulevard
MS: RNB-4-150
Santa Clara, California 95052 / US
[2017/16]
Inventor(s)01 / NELSON, Donald W.
16985 SW Blackberry Lane
Beaverton, Oregon 97007 / US
02 / WEBB, M Clair
20180 SW Inglis Drive
Aloha, Oregon 97007 / US
03 / MORROW, Patrick
6158 NW Landing Drive
Portland, Oregon 97229 / US
04 / JUN, Kimin
1879 NW 193rd Avenue
Unit 203
Hillsboro, Oregon 97006 / US
 [2017/16]
Representative(s)Goddar, Heinz J.
Boehmert & Boehmert
Anwaltspartnerschaft mbB
Pettenkoferstrasse 22
80336 München / DE
[2023/08]
Former [2017/16]Goddar, Heinz J.
BOEHMERT & BOEHMERT
Anwaltspartnerschaft mbB
Pettenkoferstrasse 20-22
80336 München / DE
Application number, filing date14895276.516.06.2014
[2017/16]
WO2014US42574
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2015195082
Date:23.12.2015
Language:EN
[2015/51]
Type: A1 Application with search report 
No.:EP3155658
Date:19.04.2017
Language:EN
The application published by WIPO in one of the EPO official languages on 23.12.2015 takes the place of the publication of the European patent application.
[2017/16]
Type: B1 Patent specification 
No.:EP3155658
Date:22.02.2023
Language:EN
[2023/08]
Search report(s)International search report - published on:KR23.12.2015
(Supplementary) European search report - dispatched on:EP26.01.2018
ClassificationIPC:H01L25/16, H01L27/06, H01L23/12, H01L21/336, H01L29/78, H01L21/98, H01L23/538, H01L25/00, // H01L23/00, H01L25/18
[2022/19]
CPC:
H01L25/18 (EP); H01L23/5389 (EP,KR,US); H01L25/0652 (KR,US);
H01L23/5383 (EP,KR,US); H01L23/5384 (US); H01L24/03 (US);
H01L24/06 (US); H01L24/17 (EP,US); H01L24/27 (KR);
H01L25/0655 (US); H01L25/50 (EP,US); H01L2224/16145 (EP,US);
H01L2224/16225 (EP,KR,US); H01L2224/16227 (EP,US); H01L2224/17181 (EP,US);
H01L2224/81193 (EP,US); H01L2224/81201 (EP,US); H01L2224/81895 (EP,US);
H01L2224/81986 (EP,US); H01L2224/9202 (EP,US); H01L24/16 (EP,US);
H01L24/81 (EP,US); H01L25/0657 (EP); H01L2924/0002 (EP,US);
H01L2924/13091 (EP,US); H01L2924/1436 (US) (-)
C-Set:
H01L2224/81201, H01L2924/00014 (US,EP);
H01L2224/81895, H01L2924/00014 (US,EP);
H01L2224/9202, H01L2224/11 (US,EP);
H01L2924/0002, H01L2924/00 (US);
H01L2924/13091, H01L2924/00 (US,EP)
(-)
Former IPC [2018/09]H01L27/06, H01L23/12, H01L21/60
Former IPC [2017/16]H01L23/12, H01L21/60
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2017/16]
Extension statesBANot yet paid
MENot yet paid
TitleGerman:SPEICHERCHIP MIT DIREKTER INTEGRATION MIT EINEM LOGIKCHIP UND VERFAHREN ZU DESSEN HERSTELLUNG[2022/19]
English:MEMORY DIE WITH DIRECT INTEGRATION TO LOGIC DIE AND METHOD OF MANUFACTURING THE SAME[2022/19]
French:PUCE DE MEMOIRE AVEC INTEGRATION DIRECTE A UNE PUCE LOGIQUE ET SON PROCEDE DE FABRICATION[2022/19]
Former [2017/16]VERFAHREN ZUR DIREKTEN INTEGRATION EINES SPEICHERCHIPS ZU EINEM LOGISCHEN CHIP OHNE VERWENDUNG VON SILICIUMDURCHKONTAKTIERUNG (TSV)
Former [2017/16]METHOD FOR DIRECT INTEGRATION OF MEMORY DIE TO LOGIC DIE WITHOUT USE OF THROUGH SILICON VIAS (TSV)
Former [2017/16]PROCÉDÉ D'INTÉGRATION DIRECTE DE PUCES DE MÉMOIRE DANS UNE MATRICE LOGIQUE SANS UTILISATION DE TROUS D'INTERCONNEXION TRAVERSANTS EN SILICIUM (TSV)
Entry into regional phase04.11.2016National basic fee paid 
04.11.2016Search fee paid 
04.11.2016Designation fee(s) paid 
04.11.2016Examination fee paid 
Examination procedure04.11.2016Examination requested  [2017/16]
04.11.2016Date on which the examining division has become responsible
23.08.2018Amendment by applicant (claims and/or description)
07.07.2020Despatch of a communication from the examining division (Time limit: M04)
17.11.2020Reply to a communication from the examining division
05.04.2022Cancellation of oral proceeding that was planned for 06.04.2022
06.04.2022Date of oral proceedings (cancelled)
02.05.2022Communication of intention to grant the patent
04.08.2022Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
04.08.2022Fee for grant paid
04.08.2022Fee for publishing/printing paid
05.09.2022Communication of intention to grant the patent
12.01.2023Receipt of the translation of the claim(s)
Opposition(s)23.11.2023No opposition filed within time limit [2024/05]
Fees paidRenewal fee
04.11.2016Renewal fee patent year 03
16.06.2017Renewal fee patent year 04
12.06.2018Renewal fee patent year 05
13.06.2019Renewal fee patent year 06
15.06.2020Renewal fee patent year 07
14.06.2021Renewal fee patent year 08
26.05.2022Renewal fee patent year 09
Opt-out from the exclusive  Tooltip
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
IT22.02.2023
LT22.02.2023
LV22.02.2023
MC22.02.2023
PL22.02.2023
RO22.02.2023
RS22.02.2023
SE22.02.2023
SI22.02.2023
SK22.02.2023
SM22.02.2023
NO22.05.2023
GR23.05.2023
IE16.06.2023
LU16.06.2023
IS22.06.2023
PT22.06.2023
BE30.06.2023
CH30.06.2023
[2024/26]
Former [2024/24]AT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
MC22.02.2023
PL22.02.2023
RO22.02.2023
RS22.02.2023
SE22.02.2023
SI22.02.2023
SK22.02.2023
SM22.02.2023
NO22.05.2023
GR23.05.2023
IE16.06.2023
LU16.06.2023
IS22.06.2023
PT22.06.2023
BE30.06.2023
CH30.06.2023
Former [2024/21]AT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
MC22.02.2023
PL22.02.2023
RO22.02.2023
RS22.02.2023
SE22.02.2023
SI22.02.2023
SK22.02.2023
SM22.02.2023
NO22.05.2023
GR23.05.2023
IE16.06.2023
LU16.06.2023
IS22.06.2023
PT22.06.2023
Former [2024/15]AT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
MC22.02.2023
PL22.02.2023
RO22.02.2023
RS22.02.2023
SE22.02.2023
SI22.02.2023
SK22.02.2023
SM22.02.2023
NO22.05.2023
GR23.05.2023
LU16.06.2023
IS22.06.2023
PT22.06.2023
Former [2024/11]AT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
MC22.02.2023
PL22.02.2023
RO22.02.2023
RS22.02.2023
SE22.02.2023
SI22.02.2023
SK22.02.2023
SM22.02.2023
NO22.05.2023
GR23.05.2023
IS22.06.2023
PT22.06.2023
Former [2024/09]AT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
MC22.02.2023
PL22.02.2023
RO22.02.2023
RS22.02.2023
SE22.02.2023
SK22.02.2023
SM22.02.2023
NO22.05.2023
GR23.05.2023
IS22.06.2023
PT22.06.2023
Former [2023/50]AT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
PL22.02.2023
RO22.02.2023
RS22.02.2023
SE22.02.2023
SK22.02.2023
SM22.02.2023
NO22.05.2023
GR23.05.2023
IS22.06.2023
PT22.06.2023
Former [2023/49]AT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
PL22.02.2023
RO22.02.2023
RS22.02.2023
SE22.02.2023
SM22.02.2023
NO22.05.2023
GR23.05.2023
IS22.06.2023
PT22.06.2023
Former [2023/48]AT22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
PL22.02.2023
RS22.02.2023
SE22.02.2023
SM22.02.2023
NO22.05.2023
GR23.05.2023
IS22.06.2023
PT22.06.2023
Former [2023/46]AT22.02.2023
DK22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
PL22.02.2023
RS22.02.2023
SE22.02.2023
SM22.02.2023
NO22.05.2023
GR23.05.2023
IS22.06.2023
PT22.06.2023
Former [2023/39]AT22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
PL22.02.2023
RS22.02.2023
SE22.02.2023
NO22.05.2023
GR23.05.2023
IS22.06.2023
PT22.06.2023
Former [2023/38]AT22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
PL22.02.2023
RS22.02.2023
SE22.02.2023
NO22.05.2023
GR23.05.2023
PT22.06.2023
Former [2023/37]AT22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
RS22.02.2023
SE22.02.2023
NO22.05.2023
GR23.05.2023
PT22.06.2023
Former [2023/36]AT22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
RS22.02.2023
SE22.02.2023
NO22.05.2023
PT22.06.2023
Former [2023/35]AT22.02.2023
ES22.02.2023
HR22.02.2023
LT22.02.2023
RS22.02.2023
NO22.05.2023
PT22.06.2023
Former [2023/34]ES22.02.2023
LT22.02.2023
RS22.02.2023
PT22.06.2023
Former [2023/33]ES22.02.2023
LT22.02.2023
Documents cited:Search[XI]US2010314711  (FAROOQ MUKTA G [US], et al) [X] 1-3,7-11,15 * paragraph [0012] - paragraph [0036]; figures 1-12 * [I] 4-6,12-14;
 [XI]US2013021060  (OR-BACH ZVI [US]) [X] 1,2,4-15 * paragraph [0019] - paragraph [0045] * * paragraph [0198] - paragraph [0231]; figures 8,16,18,19 * * paragraph [0393] - paragraph [0405]; figure 83 * * paragraph [0450] * * paragraph [0530] *[I] 3
International search[Y]US2005218521  (LEE SANG-YUN [US]) [Y] 15 * See abstract, paragraph [0052] and figure 2. *;
 [XYA]US2009224364  (OH CHOONSIK [KR], et al) [X] 10-11 * See abstract, paragraphs [0041]-[0093], claim 19 and figures 1-12. * [Y] 15 [A] 1-8, 12-14, 16-19;
 [A]US2010081232  (FURMAN BRUCE K [US], et al) [A] 1-8, 10-19 * See abstract, paragraphs [0028]-[0033], claim 1 and figure 2. *;
 [A]US2013168674  (FRANZON PAUL D [US], et al) [A] 1-8, 10-19 * See abstract, paragraphs [0013]-[0014] and figure 1. *;
 [A]US2014117470  (BASKARAN RAJASHREE [US], et al) [A] 1-8, 10-19* See abstract, paragraphs [0019]-[0043] and claim 31. *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.