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Extract from the Register of European Patents

EP About this file: EP2953160

EP2953160 - METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE [Right-click to bookmark this link]
Former [2015/50]SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
[2019/16]
StatusNo opposition filed within time limit
Status updated on  17.07.2020
Database last updated on 28.03.2026
FormerThe patent has been granted
Status updated on  09.08.2019
FormerGrant of patent is intended
Status updated on  15.07.2019
FormerExamination is in progress
Status updated on  21.06.2019
FormerGrant of patent is intended
Status updated on  31.03.2019
FormerExamination is in progress
Status updated on  28.04.2017
Most recent event   Tooltip08.07.2022Lapse of the patent in a contracting state
New state(s): MK		published on 10.08.2022  [2022/32]
Applicant(s)For all designated states
NXP USA, Inc.
6501 William Cannon Drive West
Austin TX 78735 / US
[2019/37]
Former [2016/50]For all designated states
NXP USA, Inc.
6501 William Cannon Drive
Austin TX 78735 / US
Former [2015/50]For all designated states
Freescale Semiconductor, Inc.
6501 William Cannon Drive West
Austin, TX 78735 / US
Inventor(s)01 / DANIELS, Dwight L
2732 East Amberwood Drive
Phoenix, AZ 85048 / US
02 / HOOPER, Stephen R
8729 East Lakeview Avenue
Mesa, AZ 85209 / US
03 / MAGNUS, Alan J
1312 North Jackson Street
Gilbert, AZ 85233 / US
04 / POARCH, Justin E
16525 East Fairview Street
Gilbert, AZ 85295 / US
 [2015/50]
Representative(s)Hardingham, Christopher Mark
NXP Semiconductors
Intellectual Property Group The Cattle Barn
Upper Ashfield Farm, Hoe Lane
Romsey, Hampshire SO51 9NJ / GB
[N/P]
Former [2019/37]Pomper, Till
NXP Semiconductors
Intellectual Property Group
134 avenue Eisenhower
BP 72329
31023 Toulouse Cedex 1 / FR
Former [2015/50]Optimus Patents Ltd
Grove House, Lutyens Close
Chineham Court
Basingstoke Hampshire RG24 8AG / GB
Application number, filing date15172276.621.06.2013
[2015/50]
Priority number, dateUS20121353739229.06.2012         Original published format: US201213537392
[2015/50]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP2953160
Date:09.12.2015
Language:EN
[2015/50]
Type: A3 Search report 
No.:EP2953160
Date:02.03.2016
Language:EN
[2016/09]
Type: B1 Patent specification 
No.:EP2953160
Date:11.09.2019
Language:EN
[2019/37]
Search report(s)(Supplementary) European search report - dispatched on:EP28.01.2016
ClassificationIPC:H01L23/495, H01L21/56, H01L21/48, H01L23/31
[2016/09]
CPC:
H10W72/0198 (EP,CN,US); H10W70/421 (EP,CN,US); H10W70/442 (US);
H10W70/048 (US); H10W70/424 (EP,CN,US); H10W70/435 (US);
H10W70/458 (US); H10W74/129 (US); H10W74/00 (EP,US);
H10W74/111 (EP,CN,US); Y10T29/49121 (EP,US) (-)
Former IPC [2015/50]H01L21/48, H01L23/495, H01L23/31
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2016/41]
Former [2015/50]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:VERFAHREN ZUR HERSTELLUNG EINER HALBLEITERVORRICHTUNGSVERPACKUNG[2019/16]
English:METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE[2019/16]
French:PROCÉDÉ DE FABRICATION D'UN EMBALLAGE DE DISPOSITIF DE SEMI-CONDUCTEURS[2019/16]
Former [2015/50]HALBLEITERVORRICHTUNGSVERPACKUNG UND VERFAHREN ZUR HERSTELLUNG
Former [2015/50]SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
Former [2015/50]EMBALLAGE DE DISPOSITIF DE SEMI-CONDUCTEURS ET SON PROCÉDÉ DE FABRICATION
Examination procedure02.09.2016Amendment by applicant (claims and/or description)
02.09.2016Examination requested  [2016/41]
26.04.2017Despatch of a communication from the examining division (Time limit: M04)
28.07.2017Reply to a communication from the examining division
01.04.2019Communication of intention to grant the patent
17.06.2019Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
16.07.2019Communication of intention to grant the patent
24.07.2019Fee for grant paid
24.07.2019Fee for publishing/printing paid
24.07.2019Receipt of the translation of the claim(s)
Parent application(s)   TooltipEP13173268.7  / EP2680307
Opposition(s)15.06.2020No opposition filed within time limit [2020/34]
Fees paidRenewal fee
27.07.2015Renewal fee patent year 03
30.06.2016Renewal fee patent year 04
30.06.2017Renewal fee patent year 05
02.07.2018Renewal fee patent year 06
01.07.2019Renewal fee patent year 07
Opt-out from the exclusive  Tooltip
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU21.06.2013
AL11.09.2019
AT11.09.2019
CY11.09.2019
CZ11.09.2019
DK11.09.2019
EE11.09.2019
ES11.09.2019
FI11.09.2019
HR11.09.2019
IT11.09.2019
LT11.09.2019
LV11.09.2019
MC11.09.2019
MK11.09.2019
MT11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
SI11.09.2019
SK11.09.2019
SM11.09.2019
TR11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
IS12.01.2020
PT13.01.2020
[2022/32]
Former [2022/27]HU21.06.2013
AL11.09.2019
AT11.09.2019
CY11.09.2019
CZ11.09.2019
DK11.09.2019
EE11.09.2019
ES11.09.2019
FI11.09.2019
HR11.09.2019
IT11.09.2019
LT11.09.2019
LV11.09.2019
MC11.09.2019
MT11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
SI11.09.2019
SK11.09.2019
SM11.09.2019
TR11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
IS12.01.2020
PT13.01.2020
Former [2021/12]AL11.09.2019
AT11.09.2019
CZ11.09.2019
DK11.09.2019
EE11.09.2019
ES11.09.2019
FI11.09.2019
HR11.09.2019
IT11.09.2019
LT11.09.2019
LV11.09.2019
MC11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
SI11.09.2019
SK11.09.2019
SM11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
IS12.01.2020
PT13.01.2020
Former [2020/37]AL11.09.2019
AT11.09.2019
CZ11.09.2019
DK11.09.2019
EE11.09.2019
ES11.09.2019
FI11.09.2019
HR11.09.2019
IT11.09.2019
LT11.09.2019
LV11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
SI11.09.2019
SK11.09.2019
SM11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
IS12.01.2020
PT13.01.2020
Former [2020/36]AL11.09.2019
AT11.09.2019
CZ11.09.2019
DK11.09.2019
EE11.09.2019
ES11.09.2019
FI11.09.2019
HR11.09.2019
IT11.09.2019
LT11.09.2019
LV11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
SK11.09.2019
SM11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
IS12.01.2020
PT13.01.2020
Former [2020/27]AL11.09.2019
AT11.09.2019
CZ11.09.2019
EE11.09.2019
ES11.09.2019
FI11.09.2019
HR11.09.2019
IT11.09.2019
LT11.09.2019
LV11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
SK11.09.2019
SM11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
PT13.01.2020
IS24.02.2020
Former [2020/25]AL11.09.2019
AT11.09.2019
CZ11.09.2019
EE11.09.2019
ES11.09.2019
FI11.09.2019
HR11.09.2019
IT11.09.2019
LT11.09.2019
LV11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
SK11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
PT13.01.2020
IS24.02.2020
Former [2020/24]AL11.09.2019
AT11.09.2019
EE11.09.2019
ES11.09.2019
FI11.09.2019
HR11.09.2019
IT11.09.2019
LT11.09.2019
LV11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
PT13.01.2020
IS24.02.2020
Former [2020/23]AL11.09.2019
AT11.09.2019
EE11.09.2019
ES11.09.2019
FI11.09.2019
HR11.09.2019
IT11.09.2019
LT11.09.2019
LV11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
PT13.01.2020
Former [2020/22]AL11.09.2019
EE11.09.2019
ES11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
NL11.09.2019
RS11.09.2019
SE11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
PT13.01.2020
Former [2020/20]AL11.09.2019
ES11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
NL11.09.2019
RS11.09.2019
SE11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
Former [2020/15]AL11.09.2019
ES11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
RS11.09.2019
SE11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
Former [2020/11]ES11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
RS11.09.2019
SE11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
Former [2020/10]FI11.09.2019
LT11.09.2019
SE11.09.2019
BG11.12.2019
NO11.12.2019
Former [2020/09]FI11.09.2019
LT11.09.2019
NO11.12.2019
Former [2020/08]LT11.09.2019
NO11.12.2019
Documents cited:Search[XY] US8017447  (OLSEN EDWARD WILLIAM et al.) [X] 1,2,6,7,10,11,15 * column 3, line 49 - column 4, line 5; figures 3,6; claim 1 * * column 5, lines 46-54 *[Y] 4
 [XY] US6872599  (LI FELIX C et al.) [X] 10,15 * column 1, lines 34-51; figures 2B,2C *[Y] 13
 [YA] JP2000223643  (OITA NIPPON DENKI KK et al.) [Y] 4,13 * abstract *[A] 1,10
 [A] US2010013069  (KASUYA YASUMASA et al.) [A] 1,10 * paragraphs [0057] - [0064]; figures 3A-3E *
 [A] US2010133693  (ARSHAD MOHAMAD ASHRAF MOHD et al.) [A] 1,10 * paragraphs [0026] - [0038]; figures 4,6 *
ExaminationJP2008112961
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.