| EP3114706 - SUBSTRATE WITH CONDUCTIVE VIAS AND CORRESPONDING METHOD [Right-click to bookmark this link] | |||
| Former [2017/02] | SUBSTRATE WITH CONDUCTIVE VIAS | ||
| [2020/46] | Status | The application is deemed to be withdrawn Status updated on 27.08.2021 Database last updated on 11.04.2026 | |
| Former | Grant of patent is intended Status updated on 08.12.2020 | ||
| Former | Request for examination was made Status updated on 09.12.2016 | Most recent event Tooltip | 27.08.2021 | Application deemed to be withdrawn | published on 29.09.2021 [2021/39] | Applicant(s) | For all designated states Qualcomm Incorporated 5775 Morehouse Drive San Diego, CA 92121-1714 / US | [2017/02] | Inventor(s) | 01 /
WE, Hong Bok 5775 Morehouse Drive San Diego, California 92121 / US | 02 /
KIM, Dong Wook 5775 Morehouse Drive San Diego, California 92121 / US | 03 /
LEE, Jae Sik 5775 Morehouse Drive San Diego, California 92121 / US | 04 /
GU, Shiqun 5775 Morehouse Drive San Diego, California 92121 / US | [2017/02] | Representative(s) | Dunlop, Hugh Christopher, et al Maucher Jenkins Seventh Floor Offices Artillery House 11-19 Artillery Row London SW1P 1RT / GB | [N/P] |
| Former [2017/02] | Dunlop, Hugh Christopher, et al Maucher Jenkins 26 Caxton Street London SW1H 0RJ / GB | Application number, filing date | 15708673.7 | 26.02.2015 | [2017/02] | WO2015US17802 | Priority number, date | US201414196481 | 04.03.2014 Original published format: US201414196481 | [2017/02] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2015134279 | Date: | 11.09.2015 | Language: | EN | [2015/36] | Type: | A1 Application with search report | No.: | EP3114706 | Date: | 11.01.2017 | Language: | EN | The application published by WIPO in one of the EPO official languages on 11.09.2015 takes the place of the publication of the European patent application. | [2017/02] | Search report(s) | International search report - published on: | EP | 11.09.2015 | Classification | IPC: | H01L21/768, H01L23/48, H01L23/498, H01L21/48 | [2017/02] | CPC: |
H10W20/023 (EP,CN,US);
H10W20/20 (EP,CN,US);
H05K3/426 (US);
H05K1/0306 (US);
H05K1/0313 (US);
H05K1/111 (US);
H05K1/115 (US);
H05K3/0094 (US);
H10W20/0265 (EP);
H10W20/2128 (EP);
H10W70/095 (EP,US);
H10W70/635 (EP,US);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2017/02] | Title | German: | SUBSTRAT MIT LEITENDEN VIAS UND ZUGEHÖRIGE METHODE | [2020/46] | English: | SUBSTRATE WITH CONDUCTIVE VIAS AND CORRESPONDING METHOD | [2020/46] | French: | SUBSTRAT AVEC INTERCONNEXIONS VERTICALES TRAVERSANTES ET PROCÉDÉ CORRESPONDANT | [2020/46] |
| Former [2017/02] | SUBSTRAT MIT LEITENDEN DURCHGÄNGEN | ||
| Former [2017/02] | SUBSTRATE WITH CONDUCTIVE VIAS | ||
| Former [2017/02] | SUBSTRAT À TROUS MÉTALLISÉS CONDUCTEURS | Entry into regional phase | 29.07.2016 | National basic fee paid | 29.07.2016 | Designation fee(s) paid | 29.07.2016 | Examination fee paid | Examination procedure | 04.01.2016 | Request for preliminary examination filed International Preliminary Examining Authority: EP | 29.07.2016 | Examination requested [2017/02] | 29.07.2016 | Date on which the examining division has become responsible | 20.04.2017 | Amendment by applicant (claims and/or description) | 09.12.2020 | Communication of intention to grant the patent | 20.04.2021 | Application deemed to be withdrawn, date of legal effect [2021/39] | 12.05.2021 | Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time [2021/39] | Fees paid | Renewal fee | 16.12.2016 | Renewal fee patent year 03 | 07.02.2018 | Renewal fee patent year 04 | 08.02.2019 | Renewal fee patent year 05 | 10.02.2020 | Renewal fee patent year 06 | 09.02.2021 | Renewal fee patent year 07 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [XYI] US2013026645 (MOHAMMED ILYAS et al.) [X] 1-4,7-11,14-17,20-22,24,26,28,29 * paragraphs [0049] - [0088]; figures 1A-1F; table 1 *[Y] 5,13,19,23 [I] 12,25 | [XYI] US2012193811 (YANG MING-KUN et al.) [X] 1,2,4,6-10,14,15,17,18,20,26,27,29,30 * figures 1A-1H *[Y] 5,13,19,23 [I] 12 | [XYI] JP2005332936 (CANON KK et al.) [X] 1-4,6-10,14,15,17,18,20-22,24,26-30 * paragraphs [0026] - [0038]; figures 1, 3 *[Y] 5,13,19,23 [I] 12 | [Y] US2008122031 (DENATALE JEFFREY F et al.) [Y] 5,13,19,23 * paragraphs [0053] - [0055]; figures 11-13 * | [Y] EP1775761 (TOKYO ELECTRON LTD et al.) [Y] 5,13,19,23 * paragraphs [0027] - [0032]; figures 1A-1D * | [A] JP2005026405 (SHARP KK et al.) [A] 1-30 * paragraphs [0058] - [0073] - [0 81] - [0091]; figures 3, 4, 6-10 * | [A] EP1465246 (INTERUNIVERSITAIRE MICROELECTR et al.) [A] 1-30 * paragraphs [0044] , [0 55] - [0058]; figures 1, 4, 5 * |