Extract from the Register of European Patents

EP About this file: EP3114706

EP3114706 - SUBSTRATE WITH CONDUCTIVE VIAS AND CORRESPONDING METHOD [Right-click to bookmark this link]
Former [2017/02]SUBSTRATE WITH CONDUCTIVE VIAS
[2020/46]
StatusThe application is deemed to be withdrawn
Status updated on  27.08.2021
Database last updated on 11.04.2026
FormerGrant of patent is intended
Status updated on  08.12.2020
FormerRequest for examination was made
Status updated on  09.12.2016
Most recent event   Tooltip27.08.2021Application deemed to be withdrawnpublished on 29.09.2021  [2021/39]
Applicant(s)For all designated states
Qualcomm Incorporated
5775 Morehouse Drive
San Diego, CA 92121-1714 / US
[2017/02]
Inventor(s)01 / WE, Hong Bok
5775 Morehouse Drive
San Diego, California 92121 / US
02 / KIM, Dong Wook
5775 Morehouse Drive
San Diego, California 92121 / US
03 / LEE, Jae Sik
5775 Morehouse Drive
San Diego, California 92121 / US
04 / GU, Shiqun
5775 Morehouse Drive
San Diego, California 92121 / US
 [2017/02]
Representative(s)Dunlop, Hugh Christopher, et al
Maucher Jenkins
Seventh Floor Offices
Artillery House
11-19 Artillery Row
London SW1P 1RT / GB
[N/P]
Former [2017/02]Dunlop, Hugh Christopher, et al
Maucher Jenkins
26 Caxton Street
London SW1H 0RJ / GB
Application number, filing date15708673.726.02.2015
[2017/02]
WO2015US17802
Priority number, dateUS20141419648104.03.2014         Original published format: US201414196481
[2017/02]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2015134279
Date:11.09.2015
Language:EN
[2015/36]
Type: A1 Application with search report 
No.:EP3114706
Date:11.01.2017
Language:EN
The application published by WIPO in one of the EPO official languages on 11.09.2015 takes the place of the publication of the European patent application.
[2017/02]
Search report(s)International search report - published on:EP11.09.2015
ClassificationIPC:H01L21/768, H01L23/48, H01L23/498, H01L21/48
[2017/02]
CPC:
H10W20/023 (EP,CN,US); H10W20/20 (EP,CN,US); H05K3/426 (US);
H05K1/0306 (US); H05K1/0313 (US); H05K1/111 (US);
H05K1/115 (US); H05K3/0094 (US); H10W20/0265 (EP);
H10W20/2128 (EP); H10W70/095 (EP,US); H10W70/635 (EP,US);
H10W70/687 (EP); H10W70/60 (EP,CN,US); H10W70/692 (EP) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2017/02]
TitleGerman:SUBSTRAT MIT LEITENDEN VIAS UND ZUGEHÖRIGE METHODE[2020/46]
English:SUBSTRATE WITH CONDUCTIVE VIAS AND CORRESPONDING METHOD[2020/46]
French:SUBSTRAT AVEC INTERCONNEXIONS VERTICALES TRAVERSANTES ET PROCÉDÉ CORRESPONDANT[2020/46]
Former [2017/02]SUBSTRAT MIT LEITENDEN DURCHGÄNGEN
Former [2017/02]SUBSTRATE WITH CONDUCTIVE VIAS
Former [2017/02]SUBSTRAT À TROUS MÉTALLISÉS CONDUCTEURS
Entry into regional phase29.07.2016National basic fee paid 
29.07.2016Designation fee(s) paid 
29.07.2016Examination fee paid 
Examination procedure04.01.2016Request for preliminary examination filed
International Preliminary Examining Authority: EP
29.07.2016Examination requested  [2017/02]
29.07.2016Date on which the examining division has become responsible
20.04.2017Amendment by applicant (claims and/or description)
09.12.2020Communication of intention to grant the patent
20.04.2021Application deemed to be withdrawn, date of legal effect  [2021/39]
12.05.2021Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time  [2021/39]
Fees paidRenewal fee
16.12.2016Renewal fee patent year 03
07.02.2018Renewal fee patent year 04
08.02.2019Renewal fee patent year 05
10.02.2020Renewal fee patent year 06
09.02.2021Renewal fee patent year 07
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Cited inInternational search[XYI] US2013026645  (MOHAMMED ILYAS et al.) [X] 1-4,7-11,14-17,20-22,24,26,28,29 * paragraphs [0049] - [0088]; figures 1A-1F; table 1 *[Y] 5,13,19,23 [I] 12,25
 [XYI] US2012193811  (YANG MING-KUN et al.) [X] 1,2,4,6-10,14,15,17,18,20,26,27,29,30 * figures 1A-1H *[Y] 5,13,19,23 [I] 12
 [XYI] JP2005332936  (CANON KK et al.) [X] 1-4,6-10,14,15,17,18,20-22,24,26-30 * paragraphs [0026] - [0038]; figures 1, 3 *[Y] 5,13,19,23 [I] 12
 [Y] US2008122031  (DENATALE JEFFREY F et al.) [Y] 5,13,19,23 * paragraphs [0053] - [0055]; figures 11-13 *
 [Y] EP1775761  (TOKYO ELECTRON LTD et al.) [Y] 5,13,19,23 * paragraphs [0027] - [0032]; figures 1A-1D *
 [A] JP2005026405  (SHARP KK et al.) [A] 1-30 * paragraphs [0058] - [0073] - [0 81] - [0091]; figures 3, 4, 6-10 *
 [A] EP1465246  (INTERUNIVERSITAIRE MICROELECTR et al.) [A] 1-30 * paragraphs [0044] , [0 55] - [0058]; figures 1, 4, 5 *
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