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Extract from the Register of European Patents

EP About this file: EP3169450

EP3169450 - METHOD FOR MANUFACTURING A CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER [Right-click to bookmark this link]
Former [2017/21]MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
[2023/09]
StatusThe patent has been granted
Status updated on  04.08.2023
Database last updated on 15.06.2024
FormerGrant of patent is intended
Status updated on  16.02.2023
FormerExamination is in progress
Status updated on  03.06.2021
FormerRequest for examination was made
Status updated on  21.04.2017
FormerThe international publication has been made
Status updated on  03.02.2017
Most recent event   Tooltip17.05.2024Lapse of the patent in a contracting state
New state(s): PL		published on 19.06.2024 [2024/25]
Applicant(s)For all designated states
BFLY Operations, Inc.
1600 District Ave.
Burlington, MA 01803 / US
[2023/21]
Former [2017/21]For all designated states
Butterfly Network Inc.
530 Old Whitfield Street
Guilford, CT 06437 / US
Inventor(s)01 / ROTHBERG, Jonathan M.
215 Uncas Point Road
Guilford, CT 06437 / US
02 / ALIE, Susan A.
21 Duncklee Avenue
Stoneham, MA 02180 / US
03 / FIFE, Keith G.
635 Matadero Avenue
Palo Alto, CA 94306 / US
04 / SANCHEZ, Nevada J.
1280 Little Meadow Road
Guilford, CT 06437 / US
05 / RALSTON, Tyler S.
56 Beach Park Road
Clinton, CT 06413 / US
 [2017/21]
Representative(s)Osha BWB
2, rue de la Paix
75002 Paris / FR
[N/P]
Former [2023/36]Osha Liang
2, rue de la Paix
75002 Paris / FR
Former [2017/21]Hoffmann Eitle
Patent- und Rechtsanwälte PartmbB
Arabellastraße 30
81925 München / DE
Application number, filing date15744805.114.07.2015
[2017/21]
WO2015US40342
Priority number, dateUS201462024179P14.07.2014         Original published format: US 201462024179 P
US20151463519702.03.2015         Original published format: US201514635197
US20151471615219.05.2015         Original published format: US201514716152
[2017/21]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2016011000
Date:21.01.2016
Language:EN
[2016/03]
Type: A1 Application with search report 
No.:EP3169450
Date:24.05.2017
Language:EN
The application published by WIPO in one of the EPO official languages on 21.01.2016 takes the place of the publication of the European patent application.
[2017/21]
Type: B1 Patent specification 
No.:EP3169450
Date:06.09.2023
Language:EN
[2023/36]
Search report(s)International search report - published on:EP21.01.2016
ClassificationIPC:B06B1/02, B81C1/00
[2023/09]
CPC:
B06B1/0292 (EP,CN,KR,US); G01N29/2406 (KR,US); A61B8/4483 (KR,US);
B81B7/007 (KR,US); B81C1/00238 (EP,CN,KR,US); B81C1/00301 (KR,US);
B81B2201/0271 (KR,US); B81C2201/019 (KR,US); B81C2203/036 (KR,US);
B81C2203/0792 (KR,US); H01L2224/4813 (EP,KR,US); H01L2924/0002 (US);
H01L2924/146 (US); H01L2924/1461 (US) (-)
Former IPC [2017/21]B06B1/02
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2017/21]  
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
TitleGerman:VERFAHREN ZUM HERSTELLEN VON EINEM KAPAZITIVEN MIKROGEFERTIGTEN ULTRASCHALLWANDLER[2023/09]
English:METHOD FOR MANUFACTURING A CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER[2023/09]
French:PROCÉDÉ POUR LA MANUFACTURE D'UN TRANSDUCTEUR CAPACITIF D'ULTRASONS MICRO-FABRIQUÉ[2023/09]
Former [2017/21]MIKROGEFERTIGTE ULTRASCHALLWANDLER UND ZUGEHÖRIGE VORRICHTUNG UND VERFAHREN
Former [2017/21]MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
Former [2017/21]TRANSDUCTEURS D'ULTRASONS MICRO-FABRIQUÉS ET APPAREIL ET PROCÉDÉS ASSOCIÉS
Entry into regional phase03.02.2017National basic fee paid 
03.02.2017Designation fee(s) paid 
03.02.2017Examination fee paid 
Examination procedure03.02.2017Examination requested  [2017/21]
03.02.2017Date on which the examining division has become responsible
21.08.2017Amendment by applicant (claims and/or description)
02.06.2021Despatch of a communication from the examining division (Time limit: M04)
12.10.2021Reply to a communication from the examining division
17.02.2023Communication of intention to grant the patent
16.06.2023Fee for grant paid
16.06.2023Fee for publishing/printing paid
16.06.2023Receipt of the translation of the claim(s)
Fees paidRenewal fee
27.07.2017Renewal fee patent year 03
27.07.2018Renewal fee patent year 04
29.07.2019Renewal fee patent year 05
27.07.2020Renewal fee patent year 06
27.07.2021Renewal fee patent year 07
27.07.2022Renewal fee patent year 08
27.07.2023Renewal fee patent year 09
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipCZ06.09.2023
ES06.09.2023
HR06.09.2023
PL06.09.2023
RO06.09.2023
RS06.09.2023
SK06.09.2023
SM06.09.2023
NO06.12.2023
GR07.12.2023
IS06.01.2024
[2024/25]
Former [2024/23]CZ06.09.2023
ES06.09.2023
HR06.09.2023
RO06.09.2023
RS06.09.2023
SK06.09.2023
SM06.09.2023
NO06.12.2023
GR07.12.2023
IS06.01.2024
Former [2024/20]HR06.09.2023
RS06.09.2023
SM06.09.2023
NO06.12.2023
GR07.12.2023
IS06.01.2024
Former [2024/11]HR06.09.2023
RS06.09.2023
NO06.12.2023
GR07.12.2023
Former [2024/08]NO06.12.2023
GR07.12.2023
Cited inInternational search[I]US2011115333  (EZAKI TAKAHIRO [JP]) [I] 1-24 * paragraphs [0028] - [0036]; figures 2A-2N *;
 [I]US2013169110  (JEONG BYUNG-GIL [KR], et al) [I] 1-24 * paragraphs [0054] - [0060]; figures 3A-3F *;
 [A]  - ZHUANG ET AL, "Integration of trench-isolated through-wafer interconnects with 2d capacitive micromachined ultrasonic transducer arrays", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, (20070703), vol. 138, no. 1, doi:10.1016/J.SNA.2007.04.008, ISSN 0924-4247, pages 221 - 229, XP022138384 [A] 1-24 * the whole document *

DOI:   http://dx.doi.org/10.1016/j.sna.2007.04.008
 [A]  - XUEFENG ZHUANG ET AL, "Wafer-bonded 2-D CMUT arrays incorporating through-wafer trench-isolated interconnects with a supporting frame", IEEE TRANSACTIONS ON ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, IEEE, US, (20090101), vol. 56, no. 1, doi:10.1109/TUFFC.2009.1018, ISSN 0885-3010, pages 182 - 192, XP011267416 [A] 1-24 * the whole document *

DOI:   http://dx.doi.org/10.1109/TUFFC.2009.1018
 [A]  - ALBERTO OCTAVIO MANZANARES ET AL, "Air-coupled MUMPs capacitive micromachined ultrasonic transducers with resonant cavities", ULTRASONICS., GB, (20120401), vol. 52, no. 4, doi:10.1016/j.ultras.2011.10.011, ISSN 0041-624X, pages 482 - 489, XP055222474 [A] 20 * the whole document *

DOI:   http://dx.doi.org/10.1016/j.ultras.2011.10.011
 [A]  - BU-SANG CHA ET AL, "Influences of perforation ratio in characteristics of capacitive micromachined ultrasonic transducers in air", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 171, no. 2, doi:10.1016/J.SNA.2011.08.021, ISSN 0924-4247, (20110826), pages 191 - 198, (20110903), XP028327831 [A] 20 * the whole document *

DOI:   http://dx.doi.org/10.1016/j.sna.2011.08.021
ExaminationUS2006075818
 US2008089181
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.