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Extract from the Register of European Patents

EP About this file: EP3262684

EP3262684 - THREE-DIMENSIONAL MEMORY DEVICE WITH STRESS COMPENSATION LAYER WITHIN A WORD LINE STACK [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  18.11.2022
Database last updated on 14.06.2024
FormerThe patent has been granted
Status updated on  10.12.2021
FormerGrant of patent is intended
Status updated on  22.09.2021
FormerExamination is in progress
Status updated on  31.08.2019
FormerRequest for examination was made
Status updated on  01.12.2017
FormerThe international publication has been made
Status updated on  07.06.2017
Most recent event   Tooltip31.05.2024Lapse of the patent in a contracting state
New state(s): MK		published on 03.07.2024 [2024/27]
Applicant(s)For all designated states
SanDisk Technologies LLC
Two Legacy Town Center
6900 North Dallas Parkway
Plano, Texas 75024 / US
[2018/01]
Inventor(s)01 / XU, Jiyin
c/o SanDisk Corporation
951 SanDisk Drive
Milpitas, California 95035 / US
 [2018/01]
Representative(s)Dehns
St. Bride's House
10 Salisbury Square
London EC4Y 8JD / GB
[2022/02]
Former [2018/01]Tothill, John Paul
Dehns
St Bride's House
10 Salisbury Square
London
EC4Y 8JD / GB
Application number, filing date15808838.525.11.2015
[2018/01]
WO2015US62775
Priority number, dateUS20151462874123.02.2015         Original published format: US201514628741
[2018/01]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2016137551
Date:01.09.2016
Language:EN
[2016/35]
Type: A1 Application with search report 
No.:EP3262684
Date:03.01.2018
Language:EN
The application published by WIPO in one of the EPO official languages on 01.09.2016 takes the place of the publication of the European patent application.
[2018/01]
Type: B1 Patent specification 
No.:EP3262684
Date:12.01.2022
Language:EN
[2022/02]
Search report(s)International search report - published on:EP01.09.2016
ClassificationIPC:H01L27/115
[2018/01]
CPC:
H10B41/41 (EP,US); H01L21/76877 (US); H01L21/02238 (US);
H01L21/76202 (US); H10B41/27 (EP,US); H10B41/35 (US);
H10B43/27 (EP,US); H10B43/35 (EP,US) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2018/01]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:DREIDIMENSIONALE SPEICHERVORRICHTUNG MIT SPANNUNGSAUSGLEICHSSCHICHT IN EINEM WORTZEILENSTAPEL[2018/01]
English:THREE-DIMENSIONAL MEMORY DEVICE WITH STRESS COMPENSATION LAYER WITHIN A WORD LINE STACK[2018/01]
French:DISPOSITIF DE MÉMOIRE EN TROIS DIMENSIONS DOTÉ D'UNE COUCHE DE COMPENSATION DE CONTRAINTE DANS UN EMPILEMENT DE LIGNES DE MOTS[2018/01]
Entry into regional phase07.06.2017National basic fee paid 
07.06.2017Designation fee(s) paid 
07.06.2017Examination fee paid 
Examination procedure07.06.2017Examination requested  [2018/01]
07.06.2017Date on which the examining division has become responsible
09.04.2018Amendment by applicant (claims and/or description)
04.09.2019Despatch of a communication from the examining division (Time limit: M04)
14.01.2020Reply to a communication from the examining division
23.09.2021Communication of intention to grant the patent
02.12.2021Fee for grant paid
02.12.2021Fee for publishing/printing paid
02.12.2021Receipt of the translation of the claim(s)
Divisional application(s)EP20155903.6  / EP3678178
Opposition(s)13.10.2022No opposition filed within time limit [2022/51]
Fees paidRenewal fee
13.11.2017Renewal fee patent year 03
14.11.2018Renewal fee patent year 04
30.09.2019Renewal fee patent year 05
13.11.2020Renewal fee patent year 06
10.11.2021Renewal fee patent year 07
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU25.11.2015
AL12.01.2022
AT12.01.2022
CY12.01.2022
CZ12.01.2022
DK12.01.2022
EE12.01.2022
ES12.01.2022
FI12.01.2022
HR12.01.2022
IT12.01.2022
LT12.01.2022
LV12.01.2022
MC12.01.2022
MK12.01.2022
NL12.01.2022
PL12.01.2022
RO12.01.2022
RS12.01.2022
SE12.01.2022
SI12.01.2022
SK12.01.2022
SM12.01.2022
BG12.04.2022
NO12.04.2022
GR13.04.2022
IS12.05.2022
PT12.05.2022
[2024/27]
Former [2024/21]HU25.11.2015
AL12.01.2022
AT12.01.2022
CY12.01.2022
CZ12.01.2022
DK12.01.2022
EE12.01.2022
ES12.01.2022
FI12.01.2022
HR12.01.2022
IT12.01.2022
LT12.01.2022
LV12.01.2022
MC12.01.2022
NL12.01.2022
PL12.01.2022
RO12.01.2022
RS12.01.2022
SE12.01.2022
SI12.01.2022
SK12.01.2022
SM12.01.2022
BG12.04.2022
NO12.04.2022
GR13.04.2022
IS12.05.2022
PT12.05.2022
Former [2024/18]HU25.11.2015
AL12.01.2022
AT12.01.2022
CZ12.01.2022
DK12.01.2022
EE12.01.2022
ES12.01.2022
FI12.01.2022
HR12.01.2022
IT12.01.2022
LT12.01.2022
LV12.01.2022
MC12.01.2022
NL12.01.2022
PL12.01.2022
RO12.01.2022
RS12.01.2022
SE12.01.2022
SI12.01.2022
SK12.01.2022
SM12.01.2022
BG12.04.2022
NO12.04.2022
GR13.04.2022
IS12.05.2022
PT12.05.2022
Former [2023/35]AL12.01.2022
AT12.01.2022
CZ12.01.2022
DK12.01.2022
EE12.01.2022
ES12.01.2022
FI12.01.2022
HR12.01.2022
IT12.01.2022
LT12.01.2022
LV12.01.2022
MC12.01.2022
NL12.01.2022
PL12.01.2022
RO12.01.2022
RS12.01.2022
SE12.01.2022
SI12.01.2022
SK12.01.2022
SM12.01.2022
BG12.04.2022
NO12.04.2022
GR13.04.2022
IS12.05.2022
PT12.05.2022
Former [2023/30]AL12.01.2022
AT12.01.2022
CZ12.01.2022
DK12.01.2022
EE12.01.2022
ES12.01.2022
FI12.01.2022
HR12.01.2022
LT12.01.2022
LV12.01.2022
MC12.01.2022
NL12.01.2022
PL12.01.2022
RO12.01.2022
RS12.01.2022
SE12.01.2022
SI12.01.2022
SK12.01.2022
SM12.01.2022
BG12.04.2022
NO12.04.2022
GR13.04.2022
IS12.05.2022
PT12.05.2022
Former [2023/10]AL12.01.2022
AT12.01.2022
CZ12.01.2022
DK12.01.2022
EE12.01.2022
ES12.01.2022
FI12.01.2022
HR12.01.2022
LT12.01.2022
LV12.01.2022
NL12.01.2022
PL12.01.2022
RO12.01.2022
RS12.01.2022
SE12.01.2022
SI12.01.2022
SK12.01.2022
SM12.01.2022
BG12.04.2022
NO12.04.2022
GR13.04.2022
IS12.05.2022
PT12.05.2022
Former [2023/01]AL12.01.2022
AT12.01.2022
CZ12.01.2022
DK12.01.2022
EE12.01.2022
ES12.01.2022
FI12.01.2022
HR12.01.2022
LT12.01.2022
LV12.01.2022
NL12.01.2022
PL12.01.2022
RO12.01.2022
RS12.01.2022
SE12.01.2022
SK12.01.2022
SM12.01.2022
BG12.04.2022
NO12.04.2022
GR13.04.2022
IS12.05.2022
PT12.05.2022
Former [2022/49]AT12.01.2022
CZ12.01.2022
DK12.01.2022
EE12.01.2022
ES12.01.2022
FI12.01.2022
HR12.01.2022
LT12.01.2022
LV12.01.2022
NL12.01.2022
PL12.01.2022
RO12.01.2022
RS12.01.2022
SE12.01.2022
SK12.01.2022
SM12.01.2022
BG12.04.2022
NO12.04.2022
GR13.04.2022
IS12.05.2022
PT12.05.2022
Former [2022/48]AT12.01.2022
CZ12.01.2022
DK12.01.2022
EE12.01.2022
ES12.01.2022
FI12.01.2022
HR12.01.2022
LT12.01.2022
LV12.01.2022
NL12.01.2022
PL12.01.2022
RO12.01.2022
RS12.01.2022
SE12.01.2022
SM12.01.2022
BG12.04.2022
NO12.04.2022
GR13.04.2022
IS12.05.2022
PT12.05.2022
Former [2022/47]AT12.01.2022
DK12.01.2022
ES12.01.2022
FI12.01.2022
HR12.01.2022
LT12.01.2022
LV12.01.2022
NL12.01.2022
PL12.01.2022
RO12.01.2022
RS12.01.2022
SE12.01.2022
SM12.01.2022
BG12.04.2022
NO12.04.2022
GR13.04.2022
IS12.05.2022
PT12.05.2022
Former [2022/46]AT12.01.2022
DK12.01.2022
ES12.01.2022
FI12.01.2022
HR12.01.2022
LT12.01.2022
LV12.01.2022
NL12.01.2022
PL12.01.2022
RS12.01.2022
SE12.01.2022
BG12.04.2022
NO12.04.2022
GR13.04.2022
IS12.05.2022
PT12.05.2022
Former [2022/42]AT12.01.2022
ES12.01.2022
FI12.01.2022
HR12.01.2022
LT12.01.2022
LV12.01.2022
NL12.01.2022
PL12.01.2022
RS12.01.2022
SE12.01.2022
BG12.04.2022
NO12.04.2022
GR13.04.2022
IS12.05.2022
PT12.05.2022
Former [2022/39]AT12.01.2022
ES12.01.2022
FI12.01.2022
HR12.01.2022
LT12.01.2022
LV12.01.2022
NL12.01.2022
PL12.01.2022
RS12.01.2022
SE12.01.2022
BG12.04.2022
NO12.04.2022
GR13.04.2022
PT12.05.2022
Former [2022/36]AT12.01.2022
ES12.01.2022
HR12.01.2022
LT12.01.2022
LV12.01.2022
NL12.01.2022
PL12.01.2022
RS12.01.2022
SE12.01.2022
BG12.04.2022
NO12.04.2022
GR13.04.2022
PT12.05.2022
Former [2022/35]ES12.01.2022
HR12.01.2022
LT12.01.2022
NL12.01.2022
RS12.01.2022
SE12.01.2022
BG12.04.2022
NO12.04.2022
PT12.05.2022
Former [2022/34]ES12.01.2022
LT12.01.2022
NL12.01.2022
NO12.04.2022
PT12.05.2022
Former [2022/33]LT12.01.2022
NL12.01.2022
NO12.04.2022
Former [2022/30]NL12.01.2022
Cited inInternational search[Y]US2004124452  (WELLHAUSEN UWE [JP], et al) [Y] 1-17 * paragraphs [0011] - [0023]; figure 3 *;
 [Y]US2012208347  (HWANG SUNG-MIN [KR], et al) [Y] 11,25,26* paragraphs [0162] - [0166]; figures 45,46 *;
 [XY]US2013017629  (PYO MYUNGJUNG [KR], et al) [X] 18-24,27-31 * paragraphs [0055] - [0175]; figures 20A-20F,21A-21D * [Y] 1-17,25,26
by applicantUS5915167
    - T. ENDOH, "Novel Ultra High Density Memory With A Stacked-Surrounding Gate Transistor (S-SGT) Structured Cell", IEDM PROC., (2001), pages 33 - 36
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.