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Extract from the Register of European Patents

EP About this file: EP3163608

EP3163608 - SEMICONDUCTOR MODULE AND PRODUCTION METHOD FOR THE SEMICONDUCTOR MODULE [Right-click to bookmark this link]
Former [2017/18]SEMICONDUCTOR MODULE AND PRODUCTION METHOD FOR SEMICONDUCTOR MODULE
[2021/51]
StatusThe application is deemed to be withdrawn
Status updated on  10.03.2023
Database last updated on 15.06.2024
FormerGrant of patent is intended
Status updated on  22.06.2022
FormerExamination is in progress
Status updated on  22.04.2022
FormerGrant of patent is intended
Status updated on  09.12.2021
FormerExamination is in progress
Status updated on  20.12.2019
FormerRequest for examination was made
Status updated on  31.03.2017
FormerThe international publication has been made
Status updated on  04.11.2016
Most recent event   Tooltip10.03.2023Application deemed to be withdrawnpublished on 12.04.2023  [2023/15]
Applicant(s)For all designated states
Shindengen Electric Manufacturing Co., Ltd.
2-1 Ohtemachi 2-chome Chiyoda-ku
Tokyo 100-0004 / JP
[2017/18]
Inventor(s)01 / IKEDA, Kosuke
c/o SHINDENGEN ELECTRIC MANUFACTURING CO. LTD.
Factory
10-13 Minami-cho
Hanno-shi Saitama 357-8585 / JP
 [2017/18]
Representative(s)Liesegang, Eva
Boehmert & Boehmert
Anwaltspartnerschaft mbB
Pettenkoferstrasse 22
80336 München / DE
[N/P]
Former [2017/18]Liesegang, Eva
Boehmert & Boehmert
Anwaltspartnerschaft mbB
Patentanwälte Rechtsanwälte
Pettenkoferstrasse 20-22
80336 München / DE
Application number, filing date15860021.328.04.2015
[2017/18]
WO2015JP02284
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2016174697
Date:03.11.2016
Language:JA
[2016/44]
Type: A1 Application with search report 
No.:EP3163608
Date:03.05.2017
Language:EN
[2017/18]
Search report(s)International search report - published on:JP03.11.2016
(Supplementary) European search report - dispatched on:EP04.10.2017
ClassificationIPC:H01L23/29, H01L23/00, H01L23/28, H01L25/07, H01L25/18, H01L23/24
[2017/44]
CPC:
H01L23/24 (EP,US); H01L23/3675 (US); H01L21/4871 (US);
H01L21/563 (US); H01L23/00 (EP,US); H01L23/28 (EP,US);
H01L23/29 (EP,US); H01L23/3121 (US); H01L24/33 (US);
H01L25/07 (EP,US); H01L25/071 (US); H01L25/18 (EP,US);
H01L25/50 (US); H01L2224/37599 (EP,US); H01L2224/40 (EP,US);
H01L2924/00014 (EP,US) (-)
C-Set:
H01L2224/37599, H01L2924/00014 (US,EP);
H01L2924/00014, H01L2224/37099 (EP,US)
Former IPC [2017/18]H01L23/29, H01L23/00, H01L23/28, H01L25/07, H01L25/18
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2017/18]
TitleGerman:HALBLEITERMODUL UND HERSTELLUNGSVERFAHREN FÜR DAS HALBLEITERMODUL[2021/51]
English:SEMICONDUCTOR MODULE AND PRODUCTION METHOD FOR THE SEMICONDUCTOR MODULE[2021/51]
French:MODULE SEMI-CONDUCTEUR ET PROCÉDÉ DE PRODUCTION DU MODULE SEMI-CONDUCTEUR[2021/51]
Former [2017/18]HALBLEITERMODUL UND HERSTELLUNGSVERFAHREN FÜR HALBLEITERMODUL
Former [2017/18]SEMICONDUCTOR MODULE AND PRODUCTION METHOD FOR SEMICONDUCTOR MODULE
Former [2017/18]MODULE SEMI-CONDUCTEUR ET SON PROCÉDÉ DE PRODUCTION
Entry into regional phase24.05.2016Translation filed 
24.05.2016National basic fee paid 
24.05.2016Search fee paid 
23.01.2017Designation fee(s) paid 
23.01.2017Examination fee paid 
Examination procedure06.08.2015Request for preliminary examination filed
International Preliminary Examining Authority: JP
24.05.2016Date on which the examining division has become responsible
23.01.2017Examination requested  [2017/18]
11.04.2018Amendment by applicant (claims and/or description)
03.01.2020Despatch of a communication from the examining division (Time limit: M04)
21.04.2020Reply to a communication from the examining division
10.12.2021Communication of intention to grant the patent
19.04.2022Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
23.06.2022Communication of intention to grant the patent
04.11.2022Application deemed to be withdrawn, date of legal effect  [2023/15]
24.11.2022Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time  [2023/15]
Fees paidRenewal fee
22.03.2017Renewal fee patent year 03
11.04.2018Renewal fee patent year 04
15.04.2019Renewal fee patent year 05
31.03.2020Renewal fee patent year 06
15.04.2021Renewal fee patent year 07
21.03.2022Renewal fee patent year 08
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Documents cited:Search[Y]US2006054901  (SHOJI HIROYUKI [JP], et al) [Y] 2,3,8 * paragraphs [0109] , [ 248] - [0251] - [ 313] , [ 315] , [ 316]; figures 12, 23B, 25 *;
 [A]US2012228757  (KITAMI AKIO [JP], et al) [A] 1-8 * paragraphs [0089] - [0095]; figure 8 *;
 [A]US2013241043  (KATO CHIKAGE [JP], et al) [A] 1-8* paragraphs [0039] - [0054]; figure 2 *;
 [Y]US2014124936  (YANAGAWA KATSUHIKO [JP], et al) [Y] 2,3,8 * paragraph [0013]; figure 1 *;
 [A]US2014319669  (KIMIJIMA DAISUKE [JP], et al) [A] 1-8 * paragraphs [0018] - [0020]; figure 1 *;
 [XY]WO2014184846  (SHINDENGEN ELECTRIC MFG [JP]) [X] 1,4-7 * paragraphs [0025] - [0063]; figures 1, 2 * [Y] 2,3,8;
 US2016181175  [ ] (IKEDA KOSUKE [JP]) [ ] * paragraphs [0060] , [0 69] - [0072] - [0 74] , [0 76] , [0 86] , [0 90]; figures 1, 2 *
International search[XYA]JPH08139223  (MITSUBISHI ELECTRIC CORP) [X] 1-2, 10 * , paragraphs [0022] to [0023]; fig. 1 (Family: none) * [Y] 7-9 [A] 3-6, 11;
 [A]JP2004327555  (MATSUSHITA ELECTRIC WORKS LTD, et al) [A] 1-11 * , paragraphs [0017] to [0031]; fig. 1 to 4 & US 2004/0212970 A1 & TW 200423349 A *;
 [Y]JP2009538534  (International Rectifier Corp.) [Y] 7-9 * , paragraphs [0035] to [0045]; fig. 15 to 17 & JP 5290963 B & US 2007/0273009 A1 & WO 2007/139852 A2 & DE 112007001249 T *;
 [A]JP2013171852  (FUJI ELECTRIC CO LTD) [A] 6, 11* , paragraphs [0019] to [0020]; fig. 1 (Family: none) *;
 [Y]JP2014045157  (HITACHI AUTOMOTIVE SYSTEMS LTD) [Y] 7-9 * , paragraph [0022]; fig. 1 to 2 (Family: none) *;
 [A]JP2015076488  (DENSO CORP) [A] 1-11 * , paragraphs [0014] to [0067]; fig. 17 & WO 2015/052880 A1 *
by applicantJP2011114176
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.