EP3093885 - SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 13.12.2019 Database last updated on 03.09.2024 | |
Former | The patent has been granted Status updated on 04.01.2019 | ||
Former | Grant of patent is intended Status updated on 03.09.2018 | Most recent event Tooltip | 08.07.2022 | Lapse of the patent in a contracting state New state(s): MK | published on 10.08.2022 [2022/32] | Applicant(s) | For all designated states MITSUBISHI ELECTRIC CORPORATION 7-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100-8310 / JP | [2016/46] | Inventor(s) | 01 /
KIKUGAWA, Satoru c/o Mitsubishi Electric Engineering Company Limited 13-5 Kudankita 1-chome Chiyoda-ku Tokyo 102-0073 / JP | [2016/47] |
Former [2016/46] | 01 /
KIKUGAWA, Satoru c/o Mitsubishi Electric Engineering Company Limited 13-5, Kudankita 1-chome Chiyoda-ku Tokyo 1020073 / JP | Representative(s) | Pfenning, Meinig & Partner mbB Patent- und Rechtsanwälte Theresienhöhe 11a 80339 München / DE | [2016/46] | Application number, filing date | 15862153.2 | 08.04.2015 | [2016/46] | WO2015JP61041 | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2016162991 | Date: | 13.10.2016 | Language: | JA | [2016/41] | Type: | A1 Application with search report | No.: | EP3093885 | Date: | 16.11.2016 | Language: | EN | [2016/46] | Type: | B1 Patent specification | No.: | EP3093885 | Date: | 06.02.2019 | Language: | EN | [2019/06] | Search report(s) | International search report - published on: | JP | 13.10.2016 | (Supplementary) European search report - dispatched on: | EP | 06.12.2016 | Classification | IPC: | H01L23/40, H01L23/367, H01L21/48 | [2018/35] | CPC: |
H01L23/4006 (EP,US);
H01L23/3677 (CN);
H01L21/4882 (US);
H01L21/50 (CN);
H01L23/367 (EP,US);
H01L23/498 (CN);
|
Former IPC [2017/01] | H01L23/40, H01L23/367 | ||
Former IPC [2016/46] | H01L23/40 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2016/46] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | MA | Not yet paid | Title | German: | HALBLEITERBAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERBAUELEMENTS | [2016/46] | English: | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | [2016/46] | French: | DISPOSITIF SEMI-CONDUCTEUR ET SON PROCÉDÉ DE FABRICATION | [2016/46] | Entry into regional phase | 02.06.2016 | Translation filed | 02.06.2016 | National basic fee paid | 02.06.2016 | Search fee paid | 02.06.2016 | Designation fee(s) paid | 02.06.2016 | Examination fee paid | Examination procedure | 02.06.2016 | Examination requested [2016/46] | 20.06.2017 | Amendment by applicant (claims and/or description) | 04.09.2018 | Communication of intention to grant the patent | 18.12.2018 | Fee for grant paid | 18.12.2018 | Fee for publishing/printing paid | 18.12.2018 | Receipt of the translation of the claim(s) | Opposition(s) | 07.11.2019 | No opposition filed within time limit [2020/03] | Fees paid | Renewal fee | 29.07.2016 | Renewal fee patent year 03 | 11.04.2018 | Renewal fee patent year 04 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 08.04.2015 | AL | 06.02.2019 | AT | 06.02.2019 | CY | 06.02.2019 | CZ | 06.02.2019 | DK | 06.02.2019 | EE | 06.02.2019 | ES | 06.02.2019 | FI | 06.02.2019 | HR | 06.02.2019 | IT | 06.02.2019 | LT | 06.02.2019 | LV | 06.02.2019 | MC | 06.02.2019 | MK | 06.02.2019 | MT | 06.02.2019 | NL | 06.02.2019 | PL | 06.02.2019 | RO | 06.02.2019 | RS | 06.02.2019 | SE | 06.02.2019 | SI | 06.02.2019 | SK | 06.02.2019 | SM | 06.02.2019 | TR | 06.02.2019 | IE | 08.04.2019 | LU | 08.04.2019 | BE | 30.04.2019 | CH | 30.04.2019 | FR | 30.04.2019 | LI | 30.04.2019 | BG | 06.05.2019 | NO | 06.05.2019 | GR | 07.05.2019 | IS | 06.06.2019 | PT | 06.06.2019 | [2022/32] |
Former [2021/34] | HU | 08.04.2015 | |
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CY | 06.02.2019 | ||
CZ | 06.02.2019 | ||
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EE | 06.02.2019 | ||
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SM | 06.02.2019 | ||
TR | 06.02.2019 | ||
IE | 08.04.2019 | ||
LU | 08.04.2019 | ||
BE | 30.04.2019 | ||
CH | 30.04.2019 | ||
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LI | 30.04.2019 | ||
BG | 06.05.2019 | ||
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PT | 06.06.2019 | ||
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TR | 06.02.2019 | ||
IE | 08.04.2019 | ||
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BE | 30.04.2019 | ||
CH | 30.04.2019 | ||
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BG | 06.05.2019 | ||
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SM | 06.02.2019 | ||
TR | 06.02.2019 | ||
IE | 08.04.2019 | ||
LU | 08.04.2019 | ||
BE | 30.04.2019 | ||
CH | 30.04.2019 | ||
FR | 30.04.2019 | ||
LI | 30.04.2019 | ||
BG | 06.05.2019 | ||
NO | 06.05.2019 | ||
GR | 07.05.2019 | ||
IS | 06.06.2019 | ||
PT | 06.06.2019 | ||
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TR | 06.02.2019 | ||
IE | 08.04.2019 | ||
LU | 08.04.2019 | ||
BE | 30.04.2019 | ||
CH | 30.04.2019 | ||
FR | 30.04.2019 | ||
LI | 30.04.2019 | ||
BG | 06.05.2019 | ||
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SM | 06.02.2019 | ||
TR | 06.02.2019 | ||
LU | 08.04.2019 | ||
BE | 30.04.2019 | ||
CH | 30.04.2019 | ||
FR | 30.04.2019 | ||
LI | 30.04.2019 | ||
BG | 06.05.2019 | ||
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LU | 08.04.2019 | ||
BE | 30.04.2019 | ||
CH | 30.04.2019 | ||
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BG | 06.05.2019 | ||
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SM | 06.02.2019 | ||
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BG | 06.05.2019 | ||
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GR | 07.05.2019 | ||
IS | 06.06.2019 | ||
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SM | 06.02.2019 | ||
BG | 06.05.2019 | ||
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IS | 06.06.2019 | ||
PT | 06.06.2019 | ||
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SM | 06.02.2019 | ||
BG | 06.05.2019 | ||
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GR | 07.05.2019 | ||
IS | 06.06.2019 | ||
PT | 06.06.2019 | ||
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SM | 06.02.2019 | ||
BG | 06.05.2019 | ||
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GR | 07.05.2019 | ||
IS | 06.06.2019 | ||
PT | 06.06.2019 | ||
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GR | 07.05.2019 | ||
IS | 06.06.2019 | ||
PT | 06.06.2019 | ||
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PT | 06.06.2019 | ||
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GR | 07.05.2019 | ||
PT | 06.06.2019 | ||
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PT | 06.06.2019 | ||
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Former [2019/33] | FI | 06.02.2019 | |
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PT | 06.06.2019 | Documents cited: | Search | [Y]JP2000114674 (SONY CORP) [Y] 1-12 * abstract *; | [Y]JP2004022591 (MITSUBISHI ELECTRIC CORP) [Y] 1-5,10-12 * abstract *; | [YD]JP2004095697 (MITSUBISHI ELECTRIC CORP) [YD] 1,3,4,6-10,12 * abstract *; | [Y]JP2006135169 (DENSO CORP) [Y] 1,3,4,10,12 * abstract *; | [XY]JP2008098556 (FUJITSU LTD) [X] 1,10 * abstract * [Y] 1-12; | [A]US2010315787 (LI MING [US], et al) [A] 1-12* abstract * | International search | [Y]JPS59177955U (Ricoh Co., Ltd.) [Y] 1-12 * , page 3, line 8 to page 9, line 11; fig. 3, 7, 8 (Family: none) *; | [Y]JP2004022591 (MITSUBISHI ELECTRIC CORP) [Y] 1-12 * , paragraphs [0024] to [0033]; fig. 1 to 3 (Family: none) *; | [YA]JP2006135169 (DENSO CORP) [Y] 6-9 * , fig. 2 to 6 (Family: none) *[A] 1-5, 10-12 | by applicant | JP2004095697 | JP2011199044 |