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EP3364449
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EP About this file: EP3364449
| EP3364449 - SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 10.07.2020 Database last updated on 29.07.2024 | |
| Former | Request for examination was made Status updated on 20.07.2018 | ||
| Former | The international publication has been made Status updated on 21.04.2017 | Most recent event Tooltip | 10.07.2020 | Application deemed to be withdrawn | published on 12.08.2020 [2020/33] | Applicant(s) | For all designated states Renesas Electronics Corporation 2-24, Toyosu 3-chome Koutou-ku Tokyo 135-0061 / JP | [2018/34] | Inventor(s) | 01 /
NAKAGAWA, Kazuyuki c/o Renesas Electronics Corporation 2-24 Toyosu 3-chome Koutou-ku Tokyo 135-0061 / JP | 02 /
TSUCHIYA, Keita c/o Renesas Electronics Corporation 2-24 Toyosu 3-chome Koutou-ku Tokyo 135-0061 / JP | 03 /
SATO, Yoshiaki c/o Renesas Electronics Corporation 2-24 Toyosu 3-chome Koutou-ku Tokyo 135-0061 / JP | 04 /
BABA, Shinji c/o Renesas Electronics Corporation 2-24 Toyosu 3-chome Koutou-ku Tokyo 135-0061 / JP | [2018/34] | Representative(s) | Betten & Resch Patent- und Rechtsanwälte PartGmbB Maximiliansplatz 14 80333 München / DE | [2018/34] | Application number, filing date | 15906255.3 | 15.10.2015 | [2018/34] | WO2015JP79179 | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2017064791 | Date: | 20.04.2017 | Language: | JA | [2017/16] | Type: | A1 Application with search report | No.: | EP3364449 | Date: | 22.08.2018 | Language: | EN | [2018/34] | Search report(s) | International search report - published on: | JP | 20.04.2017 | (Supplementary) European search report - dispatched on: | EP | 07.06.2019 | Classification | IPC: | H01L23/12, H01G2/06, H01L25/00, H05K3/46, H01L23/495, H05K1/02, H05K1/18, H01G4/38, H01G4/40 | [2019/28] | CPC: |
H01L23/49822 (EP,US);
H01L25/0655 (KR);
H01L23/642 (KR,US);
H01G2/065 (KR);
H01G4/38 (EP,US);
H01G4/40 (EP,US);
H01L21/4853 (US);
H01L21/4857 (US);
H01L21/4871 (US);
H01L22/12 (US);
H01L23/12 (EP,KR,US);
H01L23/16 (US);
H01L23/36 (EP,US);
H01L23/3675 (US);
H01L23/49838 (US);
H01L23/50 (EP,US);
H01L24/16 (US);
H01L25/00 (EP,US);
H05K1/0231 (US);
H05K1/185 (US);
H05K3/46 (KR,US);
G01R31/2836 (US);
H01G2/06 (EP,US);
H01L2224/16227 (EP,US);
H01L2224/32225 (EP);
H01L2224/73204 (EP,US);
H01L2224/73253 (EP,US);
H01L2924/15311 (EP,US);
H01L2924/16195 (EP,US);
H01L2924/19041 (EP,US);
| C-Set: |
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (EP)
|
| Former IPC [2018/34] | H01L23/12, H01G2/06, H01L25/00, H05K3/46 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2018/34] | Title | German: | HALBLEITERBAUELEMENT | [2018/34] | English: | SEMICONDUCTOR DEVICE | [2018/34] | French: | DISPOSITIF À SEMI-CONDUCTEUR | [2018/34] | Entry into regional phase | 10.04.2018 | Translation filed | 15.05.2018 | National basic fee paid | 15.05.2018 | Search fee paid | 15.05.2018 | Designation fee(s) paid | 15.05.2018 | Examination fee paid | Examination procedure | 10.04.2018 | Date on which the examining division has become responsible | 15.05.2018 | Examination requested [2018/34] | 08.01.2020 | Application deemed to be withdrawn, date of legal effect [2020/33] | 28.01.2020 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2020/33] | Fees paid | Renewal fee | 15.05.2018 | Renewal fee patent year 03 | 31.10.2018 | Renewal fee patent year 04 | 31.10.2019 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XI]US2010124035 (BANDHOLZ JUSTIN P [US], et al) [X] 12 * paragraphs [0012] - [0017]; figures 1A-1D * [I] 13; | [Y]US2011011634 (MOLDAUER PETER [US], et al) [Y] 1-6 * paragraphs [0011] - [0019]; figures 2,3 *; | [Y]US2012080222 (KIM YONG-HOON [KR], et al) [Y] 1-6 * paragraphs [0035] - [0042]; figures 1,2 * * paragraphs [0050] - [0054]; figure 5 *; | [A]US2014146499 (JANG WONJEA [KR], et al) [A] 1-14* paragraphs [0003] , [0005] , [0007] , [0012] , [0036] - [0039]; figure 4 * | International search | [Y]JP2002009225 (MURATA MANUFACTURING CO) [Y] 11 * , paragraphs [0045] to [0047]; fig. 1 & US 2002/0049042 A1 fig. 1 & GB 2365629 A & DE 10129032 A & FR 2810495 A *; | [Y]JP2002100874 (IBIDEN CO LTD) [Y] 1-14 * , paragraphs [0032] to [0042], [0084]; fig. 6, 7, 11 & US 6876554 B1 fig. 48 to 52, 56 & WO 2001/019149 A1 & EP 1137332 A1 & CN 1321410 A & KR 10-2007-0101408 A *; | [A]JP2003142628 (NGK SPARK PLUG CO) [A] 1-14 * , paragraph [0018]; fig. 1 (Family: none) *; | [A]WO2005114729 (NEC CORP [JP], et al) [A] 1-14* , paragraphs [0045] to [0047], [0055]; fig. 7, 9 & US 2008/0237890 A1 fig. 7, 9 & CN 1957465 A *; | [A]JP2008227177 (NEC CORP) [A] 1-14 * , paragraphs [0108] to [0113]; fig. 11 (Family: none) *; | [Y]JP2009038111 (TOSHIBA CORP) [Y] 1-14 * , paragraphs [0009] to [0017]; fig. 1 to 4 & US 2009/0032922 A1 fig. 1 to 4 *; | [Y]JP2014187127 (TAIYO YUDEN KK) [Y] 4, 6-14 * , paragraph [0022]; fig. 1 & US 2014/0285213 A1 fig. 1 * |