blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News flashes

New version of the European Patent Register - SPC information for Unitary Patents.

2024-03-06

More...
blank Related links

Release notes
European Patent Register Assistant
European Patent Register Resource Book
European Patent Register – pocket guide
FAQ - European Patent Register
FAQ - Register Alert
Federated Register (Flyer)
Global Dossier (Flyer)
Register events
Deep link coverage
Federated Register content
The Patent Information Tour
Fair use charter

Extract from the Register of European Patents

EP About this file: EP3248226

EP3248226 - MICRO-LED TRANSFERRING METHOD AND MANUFACTURING METHOD OF MICRO-LED DEVICE [Right-click to bookmark this link]
Former [2017/48]TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF MICRO-LED
[2019/41]
StatusNo opposition filed within time limit
Status updated on  01.01.2021
Database last updated on 15.06.2024
FormerThe patent has been granted
Status updated on  24.01.2020
FormerGrant of patent is intended
Status updated on  07.10.2019
FormerExamination is in progress
Status updated on  02.02.2018
FormerRequest for examination was made
Status updated on  27.10.2017
FormerThe international publication has been made
Status updated on  13.05.2017
Most recent event   Tooltip08.07.2022Lapse of the patent in a contracting state
New state(s): AL, MK		published on 10.08.2022  [2022/32]
Applicant(s)For all designated states
Goertek Inc.
No. 268 Dongfang Road Hi-Tech Industry District
Weifang, Shandong 261031 / CN
[2017/48]
Inventor(s)01 / ZOU, Quanbo
268 Dongfang Road
Hi-Tech Industry District
Weifang Shandong 261031 / CN
02 / LU, Manen
268 Dongfang Road
Hi-Tech Industry District
Weifang Shandong 261031 / CN
03 / WANG, Zhe
268 Dongfang Road
Hi-Tech Industry District
Weifang Shandong 261031 / CN
 [2017/48]
Representative(s)Hübner, Gerd, et al
Rau, Schneck & Hübner
Patentanwälte Rechtsanwälte PartGmbB
Königstraße 2
90402 Nürnberg / DE
[2020/09]
Former [2017/48]Rau, Schneck & Hübner Patentanwälte Rechtsanwälte PartGmbB
Königstraße 2
90402 Nürnberg / DE
Application number, filing date15907618.104.11.2015
[2017/48]
WO2015CN93787
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2017075776
Date:11.05.2017
Language:EN
[2017/19]
Type: A1 Application with search report 
No.:EP3248226
Date:29.11.2017
Language:EN
The application published by WIPO in one of the EPO official languages on 11.05.2017 takes the place of the publication of the European patent application.
[2017/48]
Type: B1 Patent specification 
No.:EP3248226
Date:26.02.2020
Language:EN
[2020/09]
Search report(s)International search report - published on:CN11.05.2017
(Supplementary) European search report - dispatched on:EP09.01.2018
ClassificationIPC:H01L33/00, // H01L33/20
[2018/06]
CPC:
H01L33/0095 (EP,US); H01L33/0093 (CN,US); H01L21/68 (US);
H01L21/786 (US); H01L25/0753 (CN,US); H01L27/15 (US);
H01L33/20 (EP,US); H01L2224/81815 (EP); H01L2224/83851 (EP);
H01L2224/95 (EP); H01L2224/95001 (EP); H01L2224/95133 (EP);
H01L2224/95136 (EP); H01L2224/95144 (EP); H01L2224/95145 (EP);
H01L2224/95146 (EP); H01L24/95 (EP) (-)
C-Set:
H01L2224/81815, H01L2924/00014 (EP);
H01L2224/83851, H01L2924/00014 (EP);
H01L2224/95133, H01L2924/00014 (EP);
H01L2224/95144, H01L2924/00014 (EP);
H01L2224/95145, H01L2924/00014 (EP);
H01L2224/95, H01L2224/81 (EP);
H01L2224/95, H01L2224/83 (EP)
(-)
Former IPC [2017/48]H01L33/00
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2017/48]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:MIKRO-LED-ÜBERTRAGUNGSVERFAHREN UND HERSTELLUNGSVERFAHREN EINER MICRO-LED-VORRICHTUNG[2019/42]
English:MICRO-LED TRANSFERRING METHOD AND MANUFACTURING METHOD OF MICRO-LED DEVICE[2019/42]
French:PROCÉDÉ DE TRANSFERT DE MICRO-DELS ET PROCÉDÉ DE FABRICATION D'UN DISPOSITIF À MICRO-DELS[2019/42]
Former [2017/48]ÜBERTRAGUNGSVERFAHREN, HERSTELLUNGSVERFAHREN, VORRICHTUNG UND ELEKTRONISCHE VORRICHTUNG EINER MIKRO-LED
Former [2017/48]TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF MICRO-LED
Former [2017/48]PROCÉDÉ DE TRANSFERT, PROCÉDÉ DE FABRICATION, DISPOSITIF ET APPAREIL ÉLECTRONIQUE DE MICRO-DEL
Entry into regional phase22.08.2017National basic fee paid 
22.08.2017Search fee paid 
22.08.2017Designation fee(s) paid 
22.08.2017Examination fee paid 
Examination procedure22.08.2017Examination requested  [2017/48]
22.08.2017Date on which the examining division has become responsible
02.02.2018Despatch of a communication from the examining division (Time limit: M04)
12.06.2018Reply to a communication from the examining division
16.04.2019Despatch of a communication from the examining division (Time limit: M04)
26.08.2019Reply to a communication from the examining division
08.10.2019Communication of intention to grant the patent
16.01.2020Fee for grant paid
16.01.2020Fee for publishing/printing paid
16.01.2020Receipt of the translation of the claim(s)
Opposition(s)27.11.2020No opposition filed within time limit [2021/05]
Fees paidRenewal fee
24.10.2017Renewal fee patent year 03
30.11.2018Renewal fee patent year 04
25.10.2019Renewal fee patent year 05
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU04.11.2015
AL26.02.2020
AT26.02.2020
CY26.02.2020
CZ26.02.2020
DK26.02.2020
EE26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
IT26.02.2020
LT26.02.2020
LV26.02.2020
MC26.02.2020
MK26.02.2020
MT26.02.2020
NL26.02.2020
PL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SI26.02.2020
SK26.02.2020
SM26.02.2020
TR26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
IE04.11.2020
LU04.11.2020
[2022/31]
Former [2022/27]HU04.11.2015
AT26.02.2020
CY26.02.2020
CZ26.02.2020
DK26.02.2020
EE26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
IT26.02.2020
LT26.02.2020
LV26.02.2020
MC26.02.2020
MT26.02.2020
NL26.02.2020
PL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SI26.02.2020
SK26.02.2020
SM26.02.2020
TR26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
IE04.11.2020
LU04.11.2020
Former [2021/46]AT26.02.2020
CZ26.02.2020
DK26.02.2020
EE26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
IT26.02.2020
LT26.02.2020
LV26.02.2020
MC26.02.2020
NL26.02.2020
PL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SI26.02.2020
SK26.02.2020
SM26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
IE04.11.2020
LU04.11.2020
Former [2021/33]AT26.02.2020
CZ26.02.2020
DK26.02.2020
EE26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
IT26.02.2020
LT26.02.2020
LV26.02.2020
MC26.02.2020
NL26.02.2020
PL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SI26.02.2020
SK26.02.2020
SM26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
LU04.11.2020
Former [2021/31]AT26.02.2020
CZ26.02.2020
DK26.02.2020
EE26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
IT26.02.2020
LT26.02.2020
LV26.02.2020
MC26.02.2020
NL26.02.2020
PL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SI26.02.2020
SK26.02.2020
SM26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
Former [2021/10]AT26.02.2020
CZ26.02.2020
DK26.02.2020
EE26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
IT26.02.2020
LT26.02.2020
LV26.02.2020
NL26.02.2020
PL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SI26.02.2020
SK26.02.2020
SM26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
Former [2020/50]CZ26.02.2020
DK26.02.2020
EE26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
LT26.02.2020
LV26.02.2020
NL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SK26.02.2020
SM26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
Former [2020/49]CZ26.02.2020
DK26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
LT26.02.2020
LV26.02.2020
NL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SK26.02.2020
SM26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
Former [2020/48]DK26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
LT26.02.2020
LV26.02.2020
NL26.02.2020
RO26.02.2020
RS26.02.2020
SE26.02.2020
SM26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
PT19.07.2020
Former [2020/47]DK26.02.2020
ES26.02.2020
FI26.02.2020
HR26.02.2020
LT26.02.2020
LV26.02.2020
NL26.02.2020
RS26.02.2020
SE26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
Former [2020/45]FI26.02.2020
HR26.02.2020
LV26.02.2020
NL26.02.2020
RS26.02.2020
SE26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
Former [2020/40]FI26.02.2020
HR26.02.2020
LV26.02.2020
RS26.02.2020
SE26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
IS26.06.2020
Former [2020/39]FI26.02.2020
HR26.02.2020
LV26.02.2020
RS26.02.2020
SE26.02.2020
BG26.05.2020
NO26.05.2020
GR27.05.2020
Former [2020/38]FI26.02.2020
HR26.02.2020
LV26.02.2020
RS26.02.2020
SE26.02.2020
NO26.05.2020
GR27.05.2020
Former [2020/37]FI26.02.2020
HR26.02.2020
LV26.02.2020
RS26.02.2020
SE26.02.2020
NO26.05.2020
Former [2020/35]FI26.02.2020
NO26.05.2020
Documents cited:Search[Y]US2011133216  (SUGAWARA YASUHARU [JP]) [Y] 1-10* paragraphs [0001] - [0058] - [ 0074] - [0077]; figures 1-3, 8 *;
 [XYI]US2011151602  (SPEIER INGO [CA]) [X] 11 * paragraphs [0001] - [0013] - [ 0060] - [0074] - [ 0096] , [ 0097] - [0101]; figures 2, 3, 8, 10 * [Y] 1-10 [I] 12
International search[A]CN1364246  (HITACHI LTD [JP]) [A] 1-12* the whole document *;
 [A]CN102509731  (XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD) [A] 1-12 * the whole document *;
 [A]CN102800778  (DONGGUAN FORTUNE ELECTRONIC MATERIAL CO LTD) [A] 1-12 * the whole document *;
 [X]CN103647012  (INST SEMICONDUCTORS CAS) [X] 1-12 * description paragraphs [0022]-[0026] figure 2 *;
 [A]US2014355168  (BIBL ANDREAS [US], et al) [A] 1-12 * the whole document *
ExaminationUS2011151377
 WO2015107290
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.