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EP3387162

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Extract from the Register of European Patents

EP About this file: EP3387162

EP3387162 - SYSTEM CONFIGURED FOR SPUTTER DEPOSITION ON A SUBSTRATE, SHIELDING DEVICE FOR A SPUTTER DEPOSITION CHAMBER, AND METHOD FOR PROVIDING AN ELECTRICAL SHIELDING IN A SPUTTER DEPOSITION CHAMBER [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 03.07.2020 Database last updated on 05.10.2024
Former	Request for examination was made Status updated on 14.09.2018
Former	The international publication has been made Status updated on 16.06.2017
Most recent event Tooltip	03.07.2020	Application deemed to be withdrawn	published on 05.08.2020 [2020/32]
Applicant(s)	For all designated states Applied Materials, Inc. 3050 Bowers Avenue Santa Clara, CA 95054 / US
	[2018/42]
Inventor(s)	01 / ZILBAUER, Thomas Werner Rosenstrasse 13 82131 Gauting / DE
	02 / HENKEL, Uwe Barbarossastrasse 2 63128 Dietzenbach/Steinberg / DE
	03 / THIEL, Johannes Steinweg 19D 63533 Mainhausen / DE
	04 / EL ZAAR, Kamal Wachenbuchenerstrasse 53 63454 Mittelbuchen/Hanau / DE
	05 / KELLER, Stefan Gabelsbergerstrasse 26 63814 Mainaschaff / DE
	[2018/42]
Representative(s)	Zimmermann & Partner Patentanwälte mbB Postfach 330 920 80069 München / DE
	[2018/42]
Application number, filing date	15910151.8	09.12.2015
	[2018/42]
	WO2015IB02317
Filing language	EN
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	WO2017098292
	Date:	15.06.2017
	Language:	EN
	[2017/24]
	Type:	A1 Application with search report
	No.:	EP3387162
	Date:	17.10.2018
	Language:	EN
	The application published by WIPO in one of the EPO official languages on 15.06.2017 takes the place of the publication of the European patent application.
	[2018/42]
Search report(s)	International search report - published on:	KR	15.06.2017
	(Supplementary) European search report - dispatched on:	EP	26.06.2019
Classification	IPC:	C23C14/34, C23C14/54, H01J37/34, H01J37/32	[2019/30]
	CPC:	C23C14/3471 (EP,KR,US); H01J37/3441 (US); C23C14/564 (KR); H01J37/32477 (EP,KR,US); H01J37/32605 (EP,KR,US); H01J37/32651 (EP,KR,US); (+) H01J37/3288 (EP,US); H01J37/3438 (EP,US) (-)
	Former IPC [2018/42]	C23C14/34, C23C14/54
Designated contracting states	AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2018/42]
Title	German:	SYSTEM MIT KONFIGURATION ZUR SPUTTERABSCHEIDUNG AUF EINEM SUBSTRAT, ABSCHIRMVORRICHTUNG FÜR EINE SPUTTERABSCHEIDUNGSKAMMER UND VERFAHREN ZUR HERSTELLUNG EINER ELEKTRISCHEN ABSCHIRMUNG IN EINER SPUTTERABSCHEIDUNGSKAMMER	[2018/42]
	English:	SYSTEM CONFIGURED FOR SPUTTER DEPOSITION ON A SUBSTRATE, SHIELDING DEVICE FOR A SPUTTER DEPOSITION CHAMBER, AND METHOD FOR PROVIDING AN ELECTRICAL SHIELDING IN A SPUTTER DEPOSITION CHAMBER	[2018/42]
	French:	SYSTÈME CONFIGURÉ POUR LE DÉPÔT PAR PULVÉRISATION SUR UN SUBSTRAT, DISPOSITIF DE BLINDAGE POUR UNE CHAMBRE DE DÉPÔT PAR PULVÉRISATION ET PROCÉDÉ POUR RÉALISER UN BLINDAGE ÉLECTRIQUE DANS UNE CHAMBRE DE DÉPÔT PAR PULVÉRISATION	[2018/42]
Entry into regional phase	18.04.2018	National basic fee paid
	18.04.2018	Search fee paid
	18.04.2018	Designation fee(s) paid
	18.04.2018	Examination fee paid
Examination procedure	18.04.2018	Amendment by applicant (claims and/or description)
	18.04.2018	Examination requested [2018/42]
	18.04.2018	Date on which the examining division has become responsible
	23.01.2020	Application deemed to be withdrawn, date of legal effect [2020/32]
	03.03.2020	Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2020/32]
Fees paid	Renewal fee
	18.04.2018	Renewal fee patent year 03
	20.12.2018	Renewal fee patent year 04
	Penalty fee
	Additional fee for renewal fee
	31.12.2019	05 M06 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[A]EP0320016 (TOSHIBA KK [JP]) [A] 1,8 * abstract * * column 1, lines 2-6 ** column 3, line 49 - column 5, line 37 *;
		[XAI]US2005039679 (KLESHOCK MARK [US], et al) [X] 1-4,7,8,10,13-15 * abstract * * paragraphs [0002] , [0029] - [0038] - [0070] , [0071] * [A] 9,11,12 [I] 5,6;
		[A]US2012024449 (RICCI ANTHONY [US], et al) [A] 1,8,14,15 * abstract * * paragraphs [0001] , [0002] , [0011] - [0026] *;
		[XA]US2013319855 (LI JINLEI [CN]) [X] 8-11,13,14 * abstract * * paragraphs [0001] , [0047] - [0051] - [0054] - [0060] - [0069] * [A] 1-7
	International search	[A]US2011126763 (PEI SHAO-KAI [TW]) [A] 1-4, 8-10, 15 * See abstract, paragraphs [0010]-[0021], and figures 1-3. *;
		[A]US2011139246 (DRAYTON JENNIFER A [US]) [A] 1-4, 8-10, 15 * See abstract, paragraphs [0030]-[0043], and figures 1-4. *;
		[A]US2013186338 (TSAI MING-CHIN [TW], et al) [A] 1-4, 8-10, 15 * See abstract, paragraphs [0014]-[0016], and figures 1A-1C. *;
		[A]US2013316079 (ELLRICH JENS [DE], et al) [A] 1-4, 8-10, 15* See abstract, paragraphs [0022]-[0025], and figures la, 1b. *;
		[X]US2013319855 (LI JINLEI [CN]) [X] 1-4, 8-10, 15 * See abstract, paragraphs [0047]-[0050], [0054]-[0059], and figures 2, 5. *

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