EP3311483 - BIAS CIRCUITRY FOR DEPLETION MODE AMPLIFIERS [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 05.01.2024 Database last updated on 15.06.2024 | |
Former | The patent has been granted Status updated on 27.01.2023 | ||
Former | Grant of patent is intended Status updated on 06.09.2022 | ||
Former | Examination is in progress Status updated on 11.02.2021 | ||
Former | Request for examination was made Status updated on 23.03.2018 | ||
Former | The international publication has been made Status updated on 23.12.2016 | Most recent event Tooltip | 10.05.2024 | Lapse of the patent in a contracting state New state(s): BE, CH | published on 12.06.2024 [2024/24] | Applicant(s) | For all designated states Raytheon Company 870 Winter Street Waltham, MA 02451-1449 / US | [2018/17] | Inventor(s) | 01 /
BETTENCOURT, John P. 7 Wadsworth Street Danvers, Massachusetts 01923 / US | 02 /
BIELUNIS, Alan J. 23 Meadowbrook Road Derry, NH 03038 / US | 03 /
RODRIGUEZ, Istvan 160 Commandants Way Chelsea, Massachusetts 02150 / US | 04 /
WANG, Zhaoyang C. 78 Daniels Lane Carlisle, Massachusetts 01741-1055 / US | [2018/17] | Representative(s) | Carpmaels & Ransford LLP One Southampton Row London WC1B 5HA / GB | [2018/17] | Application number, filing date | 16733245.1 | 09.06.2016 | [2018/17] | WO2016US36546 | Priority number, date | US201562181713P | 18.06.2015 Original published format: US 201562181713 P | US201615175610 | 07.06.2016 Original published format: US201615175610 | [2018/17] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2016205049 | Date: | 22.12.2016 | Language: | EN | [2016/51] | Type: | A1 Application with search report | No.: | EP3311483 | Date: | 25.04.2018 | Language: | EN | The application published by WIPO in one of the EPO official languages on 22.12.2016 takes the place of the publication of the European patent application. | [2018/17] | Type: | B1 Patent specification | No.: | EP3311483 | Date: | 01.03.2023 | Language: | EN | [2023/09] | Search report(s) | International search report - published on: | EP | 22.12.2016 | Classification | IPC: | H03F1/30, H03F3/19, H03F3/193, H03F3/195, H03F3/72 | [2018/17] | CPC: |
H03F3/195 (EP,CN,US);
H03F1/303 (EP,CN,US);
H03F3/193 (EP,CN,US);
H03F3/213 (US);
H03F3/72 (EP,CN,US);
H03F1/301 (US);
H03F2200/18 (EP,CN,US);
H03F2200/258 (EP,US);
H03F2200/27 (EP,CN,US);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2018/17] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | MA | Not yet paid | MD | Not yet paid | Title | German: | VORSPANNUNGSSCHALTUNG FÜR VERSTÄRKER VOM VERARMUNGSTYP | [2018/17] | English: | BIAS CIRCUITRY FOR DEPLETION MODE AMPLIFIERS | [2018/17] | French: | CIRCUITS DE POLARISATION POUR AMPLIFICATEURS EN MODE D'APPAUVRISSEMENT | [2018/17] | Entry into regional phase | 10.01.2018 | National basic fee paid | 10.01.2018 | Designation fee(s) paid | 10.01.2018 | Examination fee paid | Examination procedure | 10.01.2018 | Examination requested [2018/17] | 10.01.2018 | Date on which the examining division has become responsible | 31.07.2018 | Amendment by applicant (claims and/or description) | 10.02.2021 | Despatch of a communication from the examining division (Time limit: M04) | 22.04.2021 | Reply to a communication from the examining division | 18.02.2022 | Despatch of a communication from the examining division (Time limit: M04) | 21.04.2022 | Reply to a communication from the examining division | 07.09.2022 | Communication of intention to grant the patent | 13.01.2023 | Fee for grant paid | 13.01.2023 | Fee for publishing/printing paid | 13.01.2023 | Receipt of the translation of the claim(s) | Divisional application(s) | EP22213788.7 / EP4170902 | Opposition(s) | 04.12.2023 | No opposition filed within time limit [2024/06] | Fees paid | Renewal fee | 11.06.2018 | Renewal fee patent year 03 | 13.06.2019 | Renewal fee patent year 04 | 31.03.2020 | Renewal fee patent year 05 | 14.06.2021 | Renewal fee patent year 06 | 21.06.2022 | Renewal fee patent year 07 |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 01.03.2023 | CZ | 01.03.2023 | DK | 01.03.2023 | EE | 01.03.2023 | ES | 01.03.2023 | FI | 01.03.2023 | HR | 01.03.2023 | LT | 01.03.2023 | LV | 01.03.2023 | MC | 01.03.2023 | NL | 01.03.2023 | PL | 01.03.2023 | RO | 01.03.2023 | RS | 01.03.2023 | SE | 01.03.2023 | SI | 01.03.2023 | SK | 01.03.2023 | SM | 01.03.2023 | NO | 01.06.2023 | GR | 02.06.2023 | IE | 09.06.2023 | LU | 09.06.2023 | BE | 30.06.2023 | CH | 30.06.2023 | IS | 01.07.2023 | PT | 03.07.2023 | [2024/24] |
Former [2024/21] | AT | 01.03.2023 | |
CZ | 01.03.2023 | ||
DK | 01.03.2023 | ||
EE | 01.03.2023 | ||
ES | 01.03.2023 | ||
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
MC | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RO | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SI | 01.03.2023 | ||
SK | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
IE | 09.06.2023 | ||
LU | 09.06.2023 | ||
IS | 01.07.2023 | ||
PT | 03.07.2023 | ||
Former [2024/15] | AT | 01.03.2023 | |
CZ | 01.03.2023 | ||
DK | 01.03.2023 | ||
EE | 01.03.2023 | ||
ES | 01.03.2023 | ||
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
MC | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RO | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SI | 01.03.2023 | ||
SK | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
LU | 09.06.2023 | ||
IS | 01.07.2023 | ||
PT | 03.07.2023 | ||
Former [2024/10] | AT | 01.03.2023 | |
CZ | 01.03.2023 | ||
DK | 01.03.2023 | ||
EE | 01.03.2023 | ||
ES | 01.03.2023 | ||
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
MC | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RO | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SI | 01.03.2023 | ||
SK | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
IS | 01.07.2023 | ||
PT | 03.07.2023 | ||
Former [2024/09] | AT | 01.03.2023 | |
CZ | 01.03.2023 | ||
DK | 01.03.2023 | ||
EE | 01.03.2023 | ||
ES | 01.03.2023 | ||
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
MC | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RO | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SK | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
IS | 01.07.2023 | ||
PT | 03.07.2023 | ||
Former [2023/50] | AT | 01.03.2023 | |
CZ | 01.03.2023 | ||
EE | 01.03.2023 | ||
ES | 01.03.2023 | ||
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RO | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SK | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
IS | 01.07.2023 | ||
PT | 03.07.2023 | ||
Former [2023/49] | AT | 01.03.2023 | |
CZ | 01.03.2023 | ||
EE | 01.03.2023 | ||
ES | 01.03.2023 | ||
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RO | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
PT | 03.07.2023 | ||
Former [2023/48] | AT | 01.03.2023 | |
EE | 01.03.2023 | ||
ES | 01.03.2023 | ||
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
PT | 03.07.2023 | ||
Former [2023/46] | ES | 01.03.2023 | |
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
PT | 03.07.2023 | ||
Former [2023/38] | ES | 01.03.2023 | |
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
Former [2023/37] | ES | 01.03.2023 | |
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
Former [2023/36] | ES | 01.03.2023 | |
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
NO | 01.06.2023 | ||
Former [2023/35] | ES | 01.03.2023 | |
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
RS | 01.03.2023 | ||
NO | 01.06.2023 | ||
Former [2023/34] | ES | 01.03.2023 | |
LT | 01.03.2023 | ||
RS | 01.03.2023 | ||
Former [2023/33] | ES | 01.03.2023 | |
LT | 01.03.2023 | Cited in | International search | [XI]WO9723037 (ANADIGICS INC [US]) [X] 1-3,5 * page 6, line 5 - page 33, line 4; figures 14-20 * [I] 4,6,7; | [XI]US2010039168 (BETTENCOURT JOHN P [US]) [X] 1,3,5,7 * paragraphs [0011] - [0027]; figures 1,2; claim 10 * [I] 2,4,6; | [A]EP2816729 (INT RECTIFIER CORP [US]) [A] 1-7 * paragraphs [0002] - [0042]; figures 1-5 *; | [A] - BONN F, "BIAS SCHEMES FOR ENHANCEMENT AND DEPLETION MODE GAASFETS IN SOURCE-FOLLOWER CONFIGURATION", MOTOROLA TECHNICAL DEVELOPMENTS, MOTOROLA INC. SCHAUMBURG, ILLINOIS, US, (19930301), vol. 18, ISSN 0887-5286, pages 88 - 90, XP000349571 [A] 1-7 * page 88, column L, line 2 - column R, line 3; figure 2 * | Examination | WO9838733 | by applicant | US6600301 | US8854140 | - KAZIOR, T.E.; CHELAKARA, R.; HOKE, W.; BETTENCOURT, J.; PALACIOS, T.; LEE, H.S, "High Performance Mixed Signal and RF Circuits Enabled by the Direct Monolithic Heterogeneous Integration of GaN HEMTs and Si CMOS on a Silicon Substrate", COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT SYMPOSIUM (CSICS, (2011), doi:doi:10.1109/CSICS.2011.6062443, pages 1 - 4, XP032067999 DOI: http://dx.doi.org/10.1109/CSICS.2011.6062443 |