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Extract from the Register of European Patents

EP About this file: EP3255658

EP3255658 - METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND UNDERFILL FILM [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  24.07.2020
Database last updated on 14.06.2024
FormerThe patent has been granted
Status updated on  16.08.2019
FormerGrant of patent is intended
Status updated on  15.04.2019
FormerRequest for examination was made
Status updated on  10.11.2017
FormerThe international publication has been made
Status updated on  16.06.2017
Most recent event   Tooltip08.07.2022Lapse of the patent in a contracting state
New state(s): MK		published on 10.08.2022  [2022/32]
Applicant(s)For all designated states
Dexerials Corporation
Gate City Osaki East Tower 8F
1-11-2, Osaki
Shinagawa-ku
Tokyo 141-0032 / JP
[2017/50]
Inventor(s)01 / KUBOTA, Kenji
c/o DEXERIALS CORPORATION
Gate City Osaki
East Tower 8F
1-11-2 Osaki, Shinagawa-ku
Tokyo 141-0032 / JP
02 / SAITO, Takayuki
c/o DEXERIALS CORPORATION
Gate City Osaki
East Tower 8F
1-11-2 Osaki, Shinagawa-ku
Tokyo 141-0032 / JP
 [2017/50]
Representative(s)Müller-Boré & Partner Patentanwälte PartG mbB
Friedenheimer Brücke 21
80639 München / DE
[2017/50]
Application number, filing date16746712.505.02.2016
[2017/50]
WO2016JP53462
Priority number, dateJP2015002267206.02.2015         Original published format: JP 2015022672
[2017/50]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2016125881
Date:11.08.2016
Language:JA
[2016/32]
Type: A1 Application with search report 
No.:EP3255658
Date:13.12.2017
Language:EN
[2017/50]
Type: B1 Patent specification 
No.:EP3255658
Date:18.09.2019
Language:EN
[2019/38]
Search report(s)International search report - published on:JP11.08.2016
(Supplementary) European search report - dispatched on:EP14.08.2018
ClassificationIPC:H01L21/60, C09J7/00, C09J133/04, C09J163/08, H01L23/00, H01L21/56, H01L23/29, C08G59/42, // H01L25/065
[2019/17]
CPC:
C09J7/10 (EP,US); C09J7/00 (KR); C08G59/42 (EP,KR,US);
C09J133/04 (EP,US); C09J133/16 (KR,US); C09J163/00 (EP,KR,US);
C09J163/08 (KR,US); H01L21/563 (KR,US); H01L23/293 (KR,US);
H01L23/3157 (KR,US); H01L24/13 (EP,KR,US); H01L24/16 (EP,KR,US);
H01L24/29 (EP,KR,US); H01L24/32 (EP,KR,US); H01L24/75 (EP,KR,US);
H01L24/80 (KR); H01L24/81 (EP,US); H01L24/83 (EP,US);
H01L24/92 (EP,US); H01L24/97 (EP,KR,US); H01L25/0657 (EP,KR,US);
H01L25/50 (EP,KR,US); C09J2203/326 (KR,US); C09J2433/00 (KR,US);
C09J2463/00 (KR,US); H01L2224/13082 (EP,US); H01L2224/131 (EP);
H01L2224/13111 (EP,US); H01L2224/13144 (EP,US); H01L2224/13147 (EP,US);
H01L2224/13155 (EP,US); H01L2224/16148 (EP,US); H01L2224/16238 (EP,US);
H01L2224/2919 (EP,US); H01L2224/32145 (EP,US); H01L2224/32225 (EP,US);
H01L2224/73104 (EP,US); H01L2224/73204 (EP,US); H01L2224/75252 (EP,US);
H01L2224/7598 (EP,US); H01L2224/75981 (EP,US); H01L2224/81005 (EP,US);
H01L2224/81193 (EP,US); H01L2224/81203 (EP,US); H01L2224/81815 (EP,US);
H01L2224/81907 (EP,US); H01L2224/83191 (EP,US); H01L2224/83192 (EP,US);
H01L2224/83203 (EP,US); H01L2224/83862 (EP,US); H01L2224/83907 (EP,US);
H01L2224/92 (EP,US); H01L2224/9211 (EP,US); H01L2224/94 (EP,US);
H01L2224/97 (EP,US); H01L2225/06513 (EP,US); H01L2225/06568 (EP,US);
H01L2924/0665 (US); H01L2924/18161 (US); H01L2924/364 (US);
H01L2924/384 (EP,US) (-)
C-Set:
C09J163/00, C08K5/18, C08L33/08 (US,EP);
H01L2224/13111, H01L2924/01047 (US,EP);
H01L2224/13111, H01L2924/01047, H01L2924/01029 (EP,US);
H01L2224/13111, H01L2924/01051 (US,EP);
H01L2224/13111, H01L2924/01082 (US,EP);
H01L2224/13111, H01L2924/01083 (US,EP);
H01L2224/13144, H01L2924/00014 (US,EP);
H01L2224/13147, H01L2924/00014 (US,EP);
H01L2224/13155, H01L2924/00014 (US,EP);
H01L2224/131, H01L2924/014 (EP);
H01L2224/2919, H01L2924/0635 (US,EP);
H01L2224/2919, H01L2924/0665 (US,EP);
H01L2224/2919, H01L2924/095, H01L2924/0635, H01L2924/0665 (US,EP);
H01L2224/73204, H01L2224/16145, H01L2224/32145, H01L2924/00 (EP);
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (EP);
H01L2224/75252, H01L2924/00014 (US,EP);
H01L2224/75981, H01L2924/00014 (US,EP);
H01L2224/81203, H01L2924/00012 (US,EP);
H01L2224/81815, H01L2924/00014 (EP,US);
H01L2224/83203, H01L2924/00012 (EP,US);
H01L2224/83862, H01L2924/00014 (EP,US);
H01L2224/9211, H01L2224/81, H01L2224/83 (EP,US);
H01L2224/92, H01L2224/11, H01L2224/27, H01L21/78, H01L2224/81 (US,EP);
H01L2224/92, H01L2224/11, H01L2224/27, H01L21/78, H01L2224/83 (US,EP);
H01L2224/94, H01L2224/11 (US,EP);
H01L2224/94, H01L2224/27 (EP,US);
H01L2224/97, H01L2224/81 (US,EP);
H01L2224/97, H01L2224/83 (US,EP)
(-)
Former IPC [2018/37]H01L21/60, C09J7/00, C09J133/04, C09J163/08, H01L23/00, H01L21/56, H01L23/29, // H01L25/065
Former IPC [2017/50]H01L21/60, C09J7/00, C09J133/04, C09J163/08
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2017/50]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERBAUELEMENTS SOWIE UNTERFÜLLUNGSFILM[2017/50]
English:METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND UNDERFILL FILM[2017/50]
French:PROCÉDÉ DE FABRICATION DE DISPOSITIF À SEMI-CONDUCTEUR, ET FILM DE REMPLISSAGE SOUS-JACENT[2017/50]
Entry into regional phase09.06.2017Translation filed 
14.06.2017National basic fee paid 
14.06.2017Search fee paid 
14.06.2017Designation fee(s) paid 
14.06.2017Examination fee paid 
Examination procedure09.06.2017Date on which the examining division has become responsible
14.06.2017Examination requested  [2017/50]
27.02.2019Amendment by applicant (claims and/or description)
16.04.2019Communication of intention to grant the patent
05.08.2019Receipt of the translation of the claim(s)
08.08.2019Fee for grant paid
08.08.2019Fee for publishing/printing paid
Opposition(s)19.06.2020No opposition filed within time limit [2020/35]
Fees paidRenewal fee
26.02.2018Renewal fee patent year 03
26.02.2019Renewal fee patent year 04
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU05.02.2016
AL18.09.2019
AT18.09.2019
CY18.09.2019
CZ18.09.2019
DK18.09.2019
EE18.09.2019
ES18.09.2019
FI18.09.2019
HR18.09.2019
IT18.09.2019
LT18.09.2019
LV18.09.2019
MC18.09.2019
MK18.09.2019
MT18.09.2019
NL18.09.2019
PL18.09.2019
RO18.09.2019
RS18.09.2019
SE18.09.2019
SI18.09.2019
SK18.09.2019
SM18.09.2019
TR18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
IS19.01.2020
PT20.01.2020
GB05.02.2020
IE05.02.2020
LU05.02.2020
CH29.02.2020
FR29.02.2020
LI29.02.2020
[2022/32]
Former [2022/27]HU05.02.2016
AL18.09.2019
AT18.09.2019
CY18.09.2019
CZ18.09.2019
DK18.09.2019
EE18.09.2019
ES18.09.2019
FI18.09.2019
HR18.09.2019
IT18.09.2019
LT18.09.2019
LV18.09.2019
MC18.09.2019
MT18.09.2019
NL18.09.2019
PL18.09.2019
RO18.09.2019
RS18.09.2019
SE18.09.2019
SI18.09.2019
SK18.09.2019
SM18.09.2019
TR18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
IS19.01.2020
PT20.01.2020
GB05.02.2020
IE05.02.2020
LU05.02.2020
CH29.02.2020
FR29.02.2020
LI29.02.2020
Former [2021/08]AL18.09.2019
AT18.09.2019
CZ18.09.2019
DK18.09.2019
EE18.09.2019
ES18.09.2019
FI18.09.2019
HR18.09.2019
IT18.09.2019
LT18.09.2019
LV18.09.2019
MC18.09.2019
NL18.09.2019
PL18.09.2019
RO18.09.2019
RS18.09.2019
SE18.09.2019
SI18.09.2019
SK18.09.2019
SM18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
IS19.01.2020
PT20.01.2020
GB05.02.2020
IE05.02.2020
LU05.02.2020
CH29.02.2020
FR29.02.2020
LI29.02.2020
Former [2021/07]AL18.09.2019
AT18.09.2019
CZ18.09.2019
DK18.09.2019
EE18.09.2019
ES18.09.2019
FI18.09.2019
HR18.09.2019
IT18.09.2019
LT18.09.2019
LV18.09.2019
MC18.09.2019
NL18.09.2019
PL18.09.2019
RO18.09.2019
RS18.09.2019
SE18.09.2019
SI18.09.2019
SK18.09.2019
SM18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
IS19.01.2020
PT20.01.2020
IE05.02.2020
LU05.02.2020
CH29.02.2020
FR29.02.2020
LI29.02.2020
Former [2020/52]AL18.09.2019
AT18.09.2019
CZ18.09.2019
DK18.09.2019
EE18.09.2019
ES18.09.2019
FI18.09.2019
HR18.09.2019
IT18.09.2019
LT18.09.2019
LV18.09.2019
MC18.09.2019
NL18.09.2019
PL18.09.2019
RO18.09.2019
RS18.09.2019
SE18.09.2019
SI18.09.2019
SK18.09.2019
SM18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
IS19.01.2020
PT20.01.2020
LU05.02.2020
CH29.02.2020
LI29.02.2020
Former [2020/50]AL18.09.2019
AT18.09.2019
CZ18.09.2019
DK18.09.2019
EE18.09.2019
ES18.09.2019
FI18.09.2019
HR18.09.2019
IT18.09.2019
LT18.09.2019
LV18.09.2019
MC18.09.2019
NL18.09.2019
PL18.09.2019
RO18.09.2019
RS18.09.2019
SE18.09.2019
SI18.09.2019
SK18.09.2019
SM18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
IS19.01.2020
PT20.01.2020
LU05.02.2020
Former [2020/48]AL18.09.2019
AT18.09.2019
CZ18.09.2019
DK18.09.2019
EE18.09.2019
ES18.09.2019
FI18.09.2019
HR18.09.2019
IT18.09.2019
LT18.09.2019
LV18.09.2019
NL18.09.2019
PL18.09.2019
RO18.09.2019
RS18.09.2019
SE18.09.2019
SI18.09.2019
SK18.09.2019
SM18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
IS19.01.2020
PT20.01.2020
LU05.02.2020
Former [2020/37]AL18.09.2019
AT18.09.2019
CZ18.09.2019
DK18.09.2019
EE18.09.2019
ES18.09.2019
FI18.09.2019
HR18.09.2019
IT18.09.2019
LT18.09.2019
LV18.09.2019
NL18.09.2019
PL18.09.2019
RO18.09.2019
RS18.09.2019
SE18.09.2019
SI18.09.2019
SK18.09.2019
SM18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
IS19.01.2020
PT20.01.2020
Former [2020/36]AL18.09.2019
AT18.09.2019
CZ18.09.2019
DK18.09.2019
EE18.09.2019
ES18.09.2019
FI18.09.2019
HR18.09.2019
IT18.09.2019
LT18.09.2019
LV18.09.2019
NL18.09.2019
PL18.09.2019
RO18.09.2019
RS18.09.2019
SE18.09.2019
SK18.09.2019
SM18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
IS19.01.2020
PT20.01.2020
Former [2020/27]AL18.09.2019
AT18.09.2019
CZ18.09.2019
EE18.09.2019
ES18.09.2019
FI18.09.2019
HR18.09.2019
IT18.09.2019
LT18.09.2019
LV18.09.2019
NL18.09.2019
PL18.09.2019
RO18.09.2019
RS18.09.2019
SE18.09.2019
SK18.09.2019
SM18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
PT20.01.2020
IS24.02.2020
Former [2020/25]AL18.09.2019
AT18.09.2019
CZ18.09.2019
EE18.09.2019
ES18.09.2019
FI18.09.2019
HR18.09.2019
IT18.09.2019
LT18.09.2019
LV18.09.2019
NL18.09.2019
PL18.09.2019
RO18.09.2019
RS18.09.2019
SE18.09.2019
SK18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
PT20.01.2020
IS24.02.2020
Former [2020/24]AL18.09.2019
AT18.09.2019
EE18.09.2019
ES18.09.2019
FI18.09.2019
HR18.09.2019
IT18.09.2019
LT18.09.2019
LV18.09.2019
NL18.09.2019
PL18.09.2019
RO18.09.2019
RS18.09.2019
SE18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
PT20.01.2020
IS24.02.2020
Former [2020/23]AL18.09.2019
AT18.09.2019
EE18.09.2019
ES18.09.2019
FI18.09.2019
HR18.09.2019
IT18.09.2019
LT18.09.2019
LV18.09.2019
NL18.09.2019
PL18.09.2019
RO18.09.2019
RS18.09.2019
SE18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
PT20.01.2020
Former [2020/22]AL18.09.2019
EE18.09.2019
FI18.09.2019
HR18.09.2019
LT18.09.2019
LV18.09.2019
NL18.09.2019
RS18.09.2019
SE18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
PT20.01.2020
Former [2020/20]AL18.09.2019
FI18.09.2019
HR18.09.2019
LT18.09.2019
LV18.09.2019
NL18.09.2019
RS18.09.2019
SE18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
Former [2020/15]AL18.09.2019
FI18.09.2019
HR18.09.2019
LT18.09.2019
LV18.09.2019
RS18.09.2019
SE18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
Former [2020/12]FI18.09.2019
HR18.09.2019
LT18.09.2019
LV18.09.2019
RS18.09.2019
SE18.09.2019
BG18.12.2019
NO18.12.2019
GR19.12.2019
Former [2020/10]FI18.09.2019
LT18.09.2019
SE18.09.2019
BG18.12.2019
NO18.12.2019
Former [2020/09]FI18.09.2019
LT18.09.2019
NO18.12.2019
Former [2020/08]LT18.09.2019
NO18.12.2019
Documents cited:Search[A]JP2008074928  (HITACHI CHEMICAL CO LTD) [A] 1-10* the whole document *;
 [A]JP2012234804  (SUMITOMO ELECTRIC INDUSTRIES) [A] 1-10 * paragraphs [0029] - [0036]; figure 3 *;
 [A]EP2833394  (DEXERIALS CORP [JP]) [A] 1-10 * paragraphs [0035] - [0044]; figures 1-3 *
International search[A]JP2002252254  (SONY CHEMICALS) [A] 1-10* , paragraphs [0031] to [0061] & US 2004/0079464 A1 paragraphs [0062] to [0097] & WO 2002/071469 A1 & TW 523885 B & CN 1505835 A & HK 1064804 A & KR 10-0790671 B1 *;
 [A]WO2013080708  (TORAY INDUSTRIES [JP]) [A] 1-10 * , paragraphs [0109] to [0114] & US 2014/0291870 A1 paragraph [0146] & EP 2787039 A1 & CN 103958602 A & KR 10-2014-0103943 A & TW 201333098 A *;
 [A]JP2013211352  (DEXERIALS CORP) [A] 1-10 * , paragraphs [0049] to [0154] & US 2015/0140738 A1 paragraphs [0057] to [0158] & WO 2013/146141 A1 & EP 2833394 A1 & TW 201351588 A & KR 10-2015-0001769 A *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.