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Extract from the Register of European Patents

EP About this file: EP3265534

EP3265534 - POLISHING COMPOSITION CONTAINING CERIA ABRASIVE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  18.02.2022
Database last updated on 13.09.2024
FormerThe patent has been granted
Status updated on  12.03.2021
FormerGrant of patent is intended
Status updated on  25.10.2020
FormerRequest for examination was made
Status updated on  08.12.2017
FormerThe international publication has been made
Status updated on  27.09.2017
Most recent event   Tooltip13.09.2024Lapse of the patent in a contracting state
New state(s): MT		published on 16.10.2024 [2024/42]
Applicant(s)For all designated states
CMC Materials, Inc.
870 North Commons Drive
Aurora, IL 60504 / US
[2021/21]
Former [2018/02]For all designated states
Cabot Microelectronics Corporation
870 North Commons Drive
Aurora, Illinois 60504 / US
Inventor(s)01 / REISS, Brian
870 North Commons Drive
Aurora, Illinois 60504 / US
02 / SAUTER VAN NESS, Dana
870 North Commons Drive
Aurora, Illinois 60504 / US
03 / LAM, Viet
870 North Commons Drive
Aurora, Illinois 60504 / US
04 / HAINS, Alexander
870 North Commons Drive
Aurora, Illinois 60504 / US
05 / KRAFT, Steven
870 North Commons Drive
Aurora, Illinois 60504 / US
06 / JIA, Renhe
870 North Commons Drive
Aurora, Illinois 60504 / US
 [2018/02]
Representative(s)Barker Brettell LLP
100 Hagley Road
Edgbaston
Birmingham B16 8QQ / GB
[2021/15]
Former [2018/02]Trueman, Lucy Petra
Barker Brettell LLP
100 Hagley Road
Edgbaston
Birmingham B16 8QQ / GB
Application number, filing date16759356.501.03.2016
[2018/02]
WO2016US20261
Priority number, dateUS20151463956405.03.2015         Original published format: US201514639564
[2018/02]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2016140968
Date:09.09.2016
Language:EN
[2016/36]
Type: A1 Application with search report 
No.:EP3265534
Date:10.01.2018
Language:EN
The application published by WIPO in one of the EPO official languages on 09.09.2016 takes the place of the publication of the European patent application.
[2018/02]
Type: B1 Patent specification 
No.:EP3265534
Date:14.04.2021
Language:EN
[2021/15]
Search report(s)International search report - published on:KR09.09.2016
(Supplementary) European search report - dispatched on:EP07.11.2018
ClassificationIPC:C09K3/14, H01L21/3105, B24B37/04
[2020/41]
CPC:
B24B37/044 (EP,CN,KR,US); C09G1/02 (KR,US); B24B1/00 (CN,US);
B24B37/20 (US); C09G1/00 (US); C09G1/04 (KR,US);
C09G1/06 (US); C09K13/06 (US); C09K3/1409 (EP,US);
C09K3/1454 (KR,US); C09K3/1463 (EP,KR,US); H01L21/30625 (KR,US);
H01L21/31053 (EP,US); H01L21/3212 (KR,US) (-)
Former IPC [2018/49]C09K3/14, H01L21/304, H01L21/306, B24B37/04
Former IPC [2018/02]C09K3/14, H01L21/304, H01L21/306
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2018/02]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:POLIERZUSAMMENSETZUNG MIT CEROXIDSCHLEIFMITTEL[2018/02]
English:POLISHING COMPOSITION CONTAINING CERIA ABRASIVE[2018/02]
French:COMPOSITION DE POLISSAGE CONTENANT UN ABRASIF À BASE D'OXYDE DE CÉRIUM[2018/02]
Entry into regional phase27.09.2017National basic fee paid 
27.09.2017Search fee paid 
27.09.2017Designation fee(s) paid 
27.09.2017Examination fee paid 
Examination procedure27.09.2017Examination requested  [2018/02]
27.09.2017Date on which the examining division has become responsible
30.05.2019Amendment by applicant (claims and/or description)
26.10.2020Communication of intention to grant the patent
04.03.2021Fee for grant paid
04.03.2021Fee for publishing/printing paid
04.03.2021Receipt of the translation of the claim(s)
Opposition(s)17.01.2022No opposition filed within time limit [2022/12]
Fees paidRenewal fee
08.03.2018Renewal fee patent year 03
08.03.2019Renewal fee patent year 04
10.03.2020Renewal fee patent year 05
09.03.2021Renewal fee patent year 06
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU01.03.2016
AL14.04.2021
AT14.04.2021
CY14.04.2021
CZ14.04.2021
DK14.04.2021
EE14.04.2021
ES14.04.2021
FI14.04.2021
HR14.04.2021
IT14.04.2021
LT14.04.2021
LV14.04.2021
MC14.04.2021
MK14.04.2021
MT14.04.2021
NL14.04.2021
PL14.04.2021
RO14.04.2021
RS14.04.2021
SE14.04.2021
SI14.04.2021
SK14.04.2021
SM14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
IS14.08.2021
PT16.08.2021
[2024/42]
Former [2024/22]HU01.03.2016
AL14.04.2021
AT14.04.2021
CY14.04.2021
CZ14.04.2021
DK14.04.2021
EE14.04.2021
ES14.04.2021
FI14.04.2021
HR14.04.2021
IT14.04.2021
LT14.04.2021
LV14.04.2021
MC14.04.2021
MK14.04.2021
NL14.04.2021
PL14.04.2021
RO14.04.2021
RS14.04.2021
SE14.04.2021
SI14.04.2021
SK14.04.2021
SM14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
IS14.08.2021
PT16.08.2021
Former [2024/20]HU01.03.2016
AL14.04.2021
AT14.04.2021
CY14.04.2021
CZ14.04.2021
DK14.04.2021
EE14.04.2021
ES14.04.2021
FI14.04.2021
HR14.04.2021
IT14.04.2021
LT14.04.2021
LV14.04.2021
MC14.04.2021
NL14.04.2021
PL14.04.2021
RO14.04.2021
RS14.04.2021
SE14.04.2021
SI14.04.2021
SK14.04.2021
SM14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
IS14.08.2021
PT16.08.2021
Former [2024/18]HU01.03.2016
AL14.04.2021
AT14.04.2021
CZ14.04.2021
DK14.04.2021
EE14.04.2021
ES14.04.2021
FI14.04.2021
HR14.04.2021
IT14.04.2021
LT14.04.2021
LV14.04.2021
MC14.04.2021
NL14.04.2021
PL14.04.2021
RO14.04.2021
RS14.04.2021
SE14.04.2021
SI14.04.2021
SK14.04.2021
SM14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
IS14.08.2021
PT16.08.2021
Former [2022/47]AL14.04.2021
AT14.04.2021
CZ14.04.2021
DK14.04.2021
EE14.04.2021
ES14.04.2021
FI14.04.2021
HR14.04.2021
IT14.04.2021
LT14.04.2021
LV14.04.2021
MC14.04.2021
NL14.04.2021
PL14.04.2021
RO14.04.2021
RS14.04.2021
SE14.04.2021
SI14.04.2021
SK14.04.2021
SM14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
IS14.08.2021
PT16.08.2021
Former [2022/36]AL14.04.2021
AT14.04.2021
CZ14.04.2021
DK14.04.2021
EE14.04.2021
ES14.04.2021
FI14.04.2021
HR14.04.2021
IT14.04.2021
LT14.04.2021
LV14.04.2021
NL14.04.2021
PL14.04.2021
RO14.04.2021
RS14.04.2021
SE14.04.2021
SI14.04.2021
SK14.04.2021
SM14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
IS14.08.2021
PT16.08.2021
Former [2022/29]AL14.04.2021
AT14.04.2021
CZ14.04.2021
DK14.04.2021
EE14.04.2021
ES14.04.2021
FI14.04.2021
HR14.04.2021
LT14.04.2021
LV14.04.2021
NL14.04.2021
PL14.04.2021
RO14.04.2021
RS14.04.2021
SE14.04.2021
SI14.04.2021
SK14.04.2021
SM14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
IS14.08.2021
PT16.08.2021
Former [2022/26]AL14.04.2021
AT14.04.2021
CZ14.04.2021
DK14.04.2021
EE14.04.2021
ES14.04.2021
FI14.04.2021
HR14.04.2021
LT14.04.2021
LV14.04.2021
NL14.04.2021
PL14.04.2021
RO14.04.2021
RS14.04.2021
SE14.04.2021
SK14.04.2021
SM14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
IS14.08.2021
PT16.08.2021
Former [2022/23]AT14.04.2021
CZ14.04.2021
DK14.04.2021
EE14.04.2021
ES14.04.2021
FI14.04.2021
HR14.04.2021
LT14.04.2021
LV14.04.2021
NL14.04.2021
PL14.04.2021
RO14.04.2021
RS14.04.2021
SE14.04.2021
SK14.04.2021
SM14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
IS14.08.2021
PT16.08.2021
Former [2022/10]AT14.04.2021
CZ14.04.2021
DK14.04.2021
EE14.04.2021
ES14.04.2021
FI14.04.2021
HR14.04.2021
LT14.04.2021
LV14.04.2021
NL14.04.2021
PL14.04.2021
RO14.04.2021
RS14.04.2021
SE14.04.2021
SK14.04.2021
SM14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
PT16.08.2021
IS22.12.2021
Former [2022/09]AT14.04.2021
CZ14.04.2021
DK14.04.2021
ES14.04.2021
FI14.04.2021
HR14.04.2021
LT14.04.2021
LV14.04.2021
NL14.04.2021
PL14.04.2021
RO14.04.2021
RS14.04.2021
SE14.04.2021
SK14.04.2021
SM14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
IS14.08.2021
PT16.08.2021
Former [2022/08]AT14.04.2021
CZ14.04.2021
DK14.04.2021
ES14.04.2021
FI14.04.2021
HR14.04.2021
LT14.04.2021
LV14.04.2021
NL14.04.2021
PL14.04.2021
RS14.04.2021
SE14.04.2021
SM14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
IS14.08.2021
PT16.08.2021
Former [2022/07]AT14.04.2021
FI14.04.2021
HR14.04.2021
LT14.04.2021
LV14.04.2021
NL14.04.2021
PL14.04.2021
RS14.04.2021
SE14.04.2021
SM14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
IS14.08.2021
PT16.08.2021
Former [2021/52]AT14.04.2021
FI14.04.2021
HR14.04.2021
LT14.04.2021
LV14.04.2021
NL14.04.2021
PL14.04.2021
RS14.04.2021
SE14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
IS14.08.2021
PT16.08.2021
Former [2021/51]AT14.04.2021
FI14.04.2021
HR14.04.2021
LT14.04.2021
LV14.04.2021
NL14.04.2021
RS14.04.2021
SE14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
IS14.08.2021
PT16.08.2021
Former [2021/50]AT14.04.2021
FI14.04.2021
HR14.04.2021
LT14.04.2021
LV14.04.2021
NL14.04.2021
SE14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
PT16.08.2021
Former [2021/49]AT14.04.2021
FI14.04.2021
HR14.04.2021
LT14.04.2021
LV14.04.2021
NL14.04.2021
SE14.04.2021
BG14.07.2021
NO14.07.2021
GR15.07.2021
Former [2021/47]AT14.04.2021
FI14.04.2021
LT14.04.2021
NL14.04.2021
BG14.07.2021
Former [2021/46]AT14.04.2021
FI14.04.2021
LT14.04.2021
Documents cited:Search[A]US2006175295  (CHU JIA-NI [DE], et al) [A] 1-15 * the whole document *;
 [A]WO2008023858  (HANWHA CHEMICAL CORP [KR], et al) [A] 1-15* the whole document *;
 [A]US2013244433  (REISS BRIAN [US], et al) [A] 1-15 * the whole document *
International search[A]KR20110057876  (LG CHEMICAL LTD [KR]) [A] 1-31 * See claims 1, 3 and 5. *;
 [A]WO2013020351  (ANJI MICROELECTRONICS SHANGHAI [CN], et al) [A] 1-31 * See claims 1-2 and 4-5. *;
 [A]KR101405334B  (UBMATERIALS LNC [KR]) [A] 1-31* See paragraphs [0002] and [0034]; and claims 19, 23 and 26. *;
 [A]US2015024595  (DINEGA DIMITRY [US], et al) [A] 1-31 * See paragraphs [0007], [0019] and [0030]; and claims 1, 7 and 11. *;
 [A]  - LUO, JIANFENG et al., "Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification", IEEE Transaction on Semiconductor Manufacturing, (20030000), vol. 16, no. 3, doi:doi:10.1109/TSM.2003.815199, pages 469 - 476, XP001046757 [A] 1-31 * See section IV (Discussions on standard deviations of abrasive size distribution); and Figure 10. *

DOI:   http://dx.doi.org/10.1109/TSM.2003.815199
by applicantUS5196353
 US5433651
 US5609511
 US5643046
 US5658183
 US5730642
 US5838447
 US5872633
 US5893796
 US5949927
 US5964643
 US2013244433
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.