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Extract from the Register of European Patents

EP About this file: EP3358606

EP3358606 - THERMAL BONDING SHEET, AND THERMAL BONDING SHEET WITH DICING TAPE [Right-click to bookmark this link]
StatusExamination is in progress
Status updated on  21.05.2021
Database last updated on 15.06.2024
FormerRequest for examination was made
Status updated on  06.07.2018
FormerThe international publication has been made
Status updated on  08.04.2017
Most recent event   Tooltip26.09.2023New entry: Renewal fee paid 
Applicant(s)For all designated states
Nitto Denko Corporation
1-1-2 Shimohozumi
Ibaraki-shi, Osaka 567-8680 / JP
[2018/32]
Inventor(s)01 / SUGO, Yuki
c/o NITTO DENKO CORPORATION
1-1-2 Shimohozumi
Ibaraki-shi Osaka 567-8680 / JP
02 / KAMAKURA, Nao
c/o NITTO DENKO CORPORATION
1-1-2 Shimohozumi
Ibaraki-shi Osaka 567-8680 / JP
 [2018/32]
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstraße 4
80802 München / DE
[2018/32]
Application number, filing date16851304.221.09.2016
[2018/32]
WO2016JP77838
Priority number, dateJP2015019424330.09.2015         Original published format: JP 2015194243
[2018/32]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2017057130
Date:06.04.2017
Language:JA
[2017/14]
Type: A1 Application with search report 
No.:EP3358606
Date:08.08.2018
Language:EN
[2018/32]
Search report(s)International search report - published on:JP06.04.2017
(Supplementary) European search report - dispatched on:EP28.08.2018
ClassificationIPC:H01L21/52, C09J11/04, C09J201/00, H01L21/301
[2018/39]
CPC:
H01L24/29 (EP,US); B32B5/16 (US); B32B7/12 (US);
C09J11/04 (EP,US); C09J201/00 (EP,US); C09J7/10 (EP,US);
C09J7/35 (US); C09J9/00 (EP,US); H01L21/52 (US);
H01L21/6836 (EP,US); H01L21/78 (US); H01L24/27 (EP,US);
H01L24/83 (EP,US); H01L24/85 (EP,US); H01L24/92 (EP,US);
B22F1/054 (EP,US); B22F1/102 (EP,US); B22F1/107 (EP,US);
B22F2301/255 (US); B22F7/00 (US); B32B2264/105 (US);
B32B2405/00 (US); B32B2457/14 (US); C08K2003/0806 (EP,US);
C08K2003/085 (EP,US); C08K2003/2248 (EP,US); C08K2003/2286 (EP,US);
C09J2203/326 (EP,US); C09J2301/304 (EP,US); C09J2301/408 (EP,US);
C09J2400/12 (US); C09J2400/16 (US); H01L2221/68327 (EP,US);
H01L2224/04026 (EP,US); H01L2224/05073 (EP,US); H01L2224/05166 (EP,US);
H01L2224/05639 (EP,US); H01L2224/27003 (EP,US); H01L2224/271 (EP,US);
H01L2224/27436 (EP,US); H01L2224/29294 (EP,US); H01L2224/29339 (EP,US);
H01L2224/29344 (EP,US); H01L2224/29347 (EP,US); H01L2224/29387 (EP,US);
H01L2224/2939 (EP,US); H01L2224/29499 (EP,US); H01L2224/29739 (US);
H01L2224/29747 (US); H01L2224/29787 (US); H01L2224/32225 (EP,US);
H01L2224/32245 (EP,US); H01L2224/45124 (EP,US); H01L2224/45144 (EP,US);
H01L2224/45147 (EP,US); H01L2224/48091 (EP,US); H01L2224/48227 (EP,US);
H01L2224/73265 (EP,US); H01L2224/83203 (EP,US); H01L2224/83444 (EP,US);
H01L2224/83447 (EP,US); H01L2224/8346 (EP,US); H01L2224/8384 (EP,US);
H01L2224/85203 (EP,US); H01L2224/85207 (EP,US); H01L2224/92 (EP,US);
H01L2224/92247 (EP,US); H01L2224/94 (EP,US); H01L24/05 (EP,US);
H01L24/32 (EP,US); H01L24/45 (EP,US); H01L24/48 (EP,US);
H01L24/94 (EP,US); H01L2924/13055 (EP,US); H01L2924/13091 (EP,US);
H01L2924/15311 (EP,US); H01L2924/15747 (EP,US); H01L2924/1576 (EP,US);
H01L2924/181 (EP,US) (-)
C-Set:
H01L2224/05073, H01L2224/05639, H01L2224/05166 (US,EP);
H01L2224/05166, H01L2924/00014 (EP,US);
H01L2224/05639, H01L2924/00014 (US,EP);
H01L2224/29294, H01L2924/00012 (US,EP);
H01L2224/29339, H01L2924/00014 (US,EP);
H01L2224/29344, H01L2924/00014 (US,EP);
H01L2224/29347, H01L2924/00014 (US,EP);
H01L2224/29387, H01L2924/0541, H01L2924/01029 (US,EP);
H01L2224/29387, H01L2924/0541, H01L2924/01047 (US,EP);
H01L2224/45124, H01L2924/00014 (EP,US);
H01L2224/45144, H01L2924/00014 (US,EP);
H01L2224/45147, H01L2924/00014 (EP,US);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (US,EP);
H01L2224/83203, H01L2924/00012 (US,EP);
H01L2224/83444, H01L2924/00014 (US,EP);
H01L2224/92247, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (EP);
H01L2224/92, H01L2224/27003, H01L2224/27436, H01L21/78, H01L2221/68381, H01L2224/83 (EP,US);
H01L2224/94, H01L2224/27 (US,EP);
H01L2924/13055, H01L2924/00 (US,EP);
H01L2924/13091, H01L2924/00 (US,EP);
H01L2924/15311, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (US,EP);
H01L2924/15747, H01L2924/00014 (EP,US);
H01L2924/1576, H01L2924/01028 (EP,US);
H01L2924/181, H01L2924/00012 (US,EP)
(-)
Former IPC [2018/32]H01L21/52, C09J7/02, C09J11/04, C09J201/00, H01L21/301
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2018/32]
TitleGerman:THERMISCHE VERBINDUNGSFOLIE UND THERMISCHE VERBINDUNGSFOLIE MIT SÄGEFOLIE[2018/32]
English:THERMAL BONDING SHEET, AND THERMAL BONDING SHEET WITH DICING TAPE[2018/32]
French:FEUILLE DE LIAISON THERMIQUE, ET FEUILLE DE LIAISON THERMIQUE DOTÉ DE RUBAN DE DÉCOUPAGE EN DÉS[2018/32]
Entry into regional phase26.04.2018Translation filed 
26.04.2018National basic fee paid 
26.04.2018Search fee paid 
26.04.2018Designation fee(s) paid 
26.04.2018Examination fee paid 
Examination procedure26.04.2018Examination requested  [2018/32]
26.04.2018Date on which the examining division has become responsible
18.03.2019Amendment by applicant (claims and/or description)
25.05.2021Despatch of a communication from the examining division (Time limit: M06)
27.10.2021Reply to a communication from the examining division
Fees paidRenewal fee
26.04.2018Renewal fee patent year 03
25.09.2019Renewal fee patent year 04
25.09.2020Renewal fee patent year 05
28.09.2021Renewal fee patent year 06
05.09.2022Renewal fee patent year 07
26.09.2023Renewal fee patent year 08
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[IA]US2014131898  (SHEARER CATHERINE [US], et al) [I] 1,2,4-6 * paragraph [0016] * * paragraph [0057] - paragraph [0062] * * paragraph [0053] * * paragraph [0077] * * paragraph [0092] * * paragraph [0103] - paragraph [0105] *[A] 3;
 [XAI]JP2015079650  (DOWA ELECTRONICS MATERIALS CO) [X] 2,4,5 * the whole document * [A] 6 [I] 1,3;
 [P]EP3059740  (DOWA ELECTRONICS MATERIALS CO [JP]) [P] * paragraph [0005] - paragraph [0011] * * paragraph [0024] - paragraph [0027] * * paragraph [0035] * * figure 9 *;
 [XA]  - JULIAN KAHLER ET AL, "Pick-and-Place Silver Sintering Die Attach of Small-Area Chips", IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, IEEE, USA, (201202), vol. 2, no. 2, doi:10.1109/TCPMT.2011.2170571, ISSN 2156-3950, pages 199 - 207, XP011402107 [X] 1,2,5 * the whole document * [A] 3,4,6

DOI:   http://dx.doi.org/10.1109/TCPMT.2011.2170571
International search[Y]JPH11232417  (SEKISUI CHEMICAL CO LTD) [Y] 1, 4, 5 * , paragraphs [0034] to [0035], [0056] to [0066] (Family: none) *;
 [Y]JP2010254763  (HITACHI CHEMICAL CO LTD) [Y] 2, 5, 6 * , paragraphs [0046], [0184] to [0189] (Family: none) *;
 [YA]JP2015079650  (DOWA ELECTRONICS MATERIALS CO) [Y] 1, 2, 4-6 * , paragraphs [0018] to [0034] & US 2016/0254243 A1 paragraphs [0032] to [0049] & WO 2015/056589 A1 & EP 3059740 A1 & CN 105637595 A & KR 10-2016-0073980 A * [A] 3;
 [A]WO2015060346  (HITACHI CHEMICAL CO LTD [JP]) [A] 1-6* , paragraphs [0019] to [0086] & TW 201535536 A *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.