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Extract from the Register of European Patents

EP About this file: EP3290460

EP3290460 - HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  08.01.2021
Database last updated on 20.07.2024
FormerThe patent has been granted
Status updated on  31.01.2020
FormerGrant of patent is intended
Status updated on  22.01.2020
FormerExamination is in progress
Status updated on  03.01.2020
FormerGrant of patent is intended
Status updated on  01.09.2019
FormerExamination is in progress
Status updated on  05.10.2018
FormerRequest for examination was made
Status updated on  14.09.2018
FormerThe application has been published
Status updated on  02.02.2018
Most recent event   Tooltip15.07.2022Lapse of the patent in a contracting state
New state(s): AL, MK		published on 17.08.2022  [2022/33]
Applicant(s)For all designated states
Shin-Etsu Chemical Co., Ltd.
6-1, Ohtemachi 2-chome
Chiyoda-ku
Tokyo 100-0004 / JP
[2018/10]
Inventor(s)01 / SUMITA, Kazuaki
c/o Silicone-Electronics Materials Research Center
Shin-Etsu Chemical Co., Ltd.
1-10, Hitomi, Matsuida-machi
Annaka-shi, Gunma 379-0224 / JP
02 / NAKAMURA, Tomoaki
c/o Silicone-Electronics Materials Research Center
Shin-Etsu Chemical Co., Ltd.
1-10, Hitomi, Matsuida-machi
Annaka-shi, Gunma 379-0224 / JP
03 / KUSHIHARA, Naoyuki
c/o Silicone-Electronics Materials Research Center
Shin-Etsu Chemical Co., Ltd.
1-10, Hitomi, Matsuida-machi
Annaka-shi, Gunma 379-0224 / JP
 [2018/10]
Representative(s)Zacco GmbH
Bayerstrasse 83
80335 München / DE
[2018/10]
Application number, filing date17187236.922.08.2017
[2018/10]
Priority number, dateJP2016017068801.09.2016         Original published format: JP 2016170688
[2018/10]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP3290460
Date:07.03.2018
Language:EN
[2018/10]
Type: B1 Patent specification 
No.:EP3290460
Date:04.03.2020
Language:EN
[2020/10]
Search report(s)(Supplementary) European search report - dispatched on:EP26.01.2018
ClassificationIPC:C08G73/06, C08K9/06, H01L23/29
[2018/10]
CPC:
C08G73/0655 (EP,US); C08G18/8067 (KR); C08K9/06 (CN,KR,US);
C08L61/06 (US); C08G18/79 (KR); C08K3/013 (KR);
C08K3/36 (US); C08K5/17 (CN); C08K5/175 (US);
C08K5/544 (KR); C08K5/5465 (KR); C08K7/18 (CN);
H01L21/565 (US); H01L23/293 (EP,US); H01L23/295 (EP,CN,KR,US);
H01L23/296 (US); H01L33/56 (KR); C08G14/12 (US);
C08K2201/003 (CN,US); C08K2201/005 (KR); C08L2201/08 (CN);
C08L2203/206 (CN); H01L2224/32225 (EP,US); H01L2224/32245 (EP,US);
H01L2924/3511 (EP,US) (-)
C-Set:
C08K5/17, C08L79/04 (CN);
C08K7/18, C08L79/04 (CN);
C08K9/06, C08L79/04 (CN);
C08K9/06, C08L79/04, C08L61/06, C08K5/103 (US,EP);
C08L61/06, C08L61/12, C08K9/06, C08K5/175 (US)
(-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2018/42]
Former [2018/10]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:WÄRMEHÄRTBARE HARZZUSAMMENSETZUNG FÜR HALBLEITEREINKAPSELUNG[2018/10]
English:HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION[2018/10]
French:COMPOSITION DE RÉSINE THERMODURCISSABLE POUR L'ENCAPSULATION DE SEMI-CONDUCTEURS[2018/10]
Examination procedure22.08.2017Date on which the examining division has become responsible
07.09.2018Amendment by applicant (claims and/or description)
07.09.2018Examination requested  [2018/42]
05.10.2018Despatch of a communication from the examining division (Time limit: M04)
05.02.2019Reply to a communication from the examining division
02.09.2019Communication of intention to grant the patent
23.12.2019Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
23.12.2019Fee for grant paid
23.12.2019Fee for publishing/printing paid
22.01.2020Information about intention to grant a patent
22.01.2020Receipt of the translation of the claim(s)
Opposition(s)07.12.2020No opposition filed within time limit [2021/06]
Fees paidRenewal fee
15.08.2019Renewal fee patent year 03
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU22.08.2017
AL04.03.2020
AT04.03.2020
CY04.03.2020
CZ04.03.2020
DK04.03.2020
EE04.03.2020
ES04.03.2020
FI04.03.2020
HR04.03.2020
LT04.03.2020
LV04.03.2020
MC04.03.2020
MK04.03.2020
MT04.03.2020
NL04.03.2020
PL04.03.2020
RO04.03.2020
RS04.03.2020
SE04.03.2020
SI04.03.2020
SK04.03.2020
SM04.03.2020
TR04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
IS04.07.2020
PT29.07.2020
IE22.08.2020
LU22.08.2020
BE31.08.2020
CH31.08.2020
LI31.08.2020
[2022/31]
Former [2022/27]HU22.08.2017
AT04.03.2020
CY04.03.2020
CZ04.03.2020
DK04.03.2020
EE04.03.2020
ES04.03.2020
FI04.03.2020
HR04.03.2020
LT04.03.2020
LV04.03.2020
MC04.03.2020
MT04.03.2020
NL04.03.2020
PL04.03.2020
RO04.03.2020
RS04.03.2020
SE04.03.2020
SI04.03.2020
SK04.03.2020
SM04.03.2020
TR04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
IS04.07.2020
PT29.07.2020
IE22.08.2020
LU22.08.2020
BE31.08.2020
CH31.08.2020
LI31.08.2020
Former [2021/37]AT04.03.2020
CZ04.03.2020
DK04.03.2020
EE04.03.2020
ES04.03.2020
FI04.03.2020
HR04.03.2020
LT04.03.2020
LV04.03.2020
MC04.03.2020
NL04.03.2020
PL04.03.2020
RO04.03.2020
RS04.03.2020
SE04.03.2020
SI04.03.2020
SK04.03.2020
SM04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
IS04.07.2020
PT29.07.2020
IE22.08.2020
LU22.08.2020
BE31.08.2020
CH31.08.2020
LI31.08.2020
Former [2021/36]AT04.03.2020
CZ04.03.2020
DK04.03.2020
EE04.03.2020
ES04.03.2020
FI04.03.2020
HR04.03.2020
LT04.03.2020
LV04.03.2020
MC04.03.2020
NL04.03.2020
PL04.03.2020
RO04.03.2020
RS04.03.2020
SE04.03.2020
SI04.03.2020
SK04.03.2020
SM04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
IS04.07.2020
PT29.07.2020
LU22.08.2020
BE31.08.2020
CH31.08.2020
LI31.08.2020
Former [2021/20]AT04.03.2020
CZ04.03.2020
DK04.03.2020
EE04.03.2020
ES04.03.2020
FI04.03.2020
HR04.03.2020
LT04.03.2020
LV04.03.2020
MC04.03.2020
NL04.03.2020
PL04.03.2020
RO04.03.2020
RS04.03.2020
SE04.03.2020
SI04.03.2020
SK04.03.2020
SM04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
IS04.07.2020
PT29.07.2020
LU22.08.2020
CH31.08.2020
LI31.08.2020
Former [2021/18]AT04.03.2020
CZ04.03.2020
DK04.03.2020
EE04.03.2020
ES04.03.2020
FI04.03.2020
HR04.03.2020
LT04.03.2020
LV04.03.2020
MC04.03.2020
NL04.03.2020
PL04.03.2020
RO04.03.2020
RS04.03.2020
SE04.03.2020
SI04.03.2020
SK04.03.2020
SM04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
IS04.07.2020
PT29.07.2020
Former [2021/11]AT04.03.2020
CZ04.03.2020
DK04.03.2020
EE04.03.2020
ES04.03.2020
FI04.03.2020
HR04.03.2020
LT04.03.2020
LV04.03.2020
NL04.03.2020
PL04.03.2020
RO04.03.2020
RS04.03.2020
SE04.03.2020
SI04.03.2020
SK04.03.2020
SM04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
IS04.07.2020
PT29.07.2020
Former [2021/08]CZ04.03.2020
DK04.03.2020
EE04.03.2020
ES04.03.2020
FI04.03.2020
HR04.03.2020
LT04.03.2020
LV04.03.2020
NL04.03.2020
RO04.03.2020
RS04.03.2020
SE04.03.2020
SK04.03.2020
SM04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
IS04.07.2020
PT29.07.2020
Former [2020/50]CZ04.03.2020
EE04.03.2020
ES04.03.2020
FI04.03.2020
HR04.03.2020
LT04.03.2020
LV04.03.2020
NL04.03.2020
RO04.03.2020
RS04.03.2020
SE04.03.2020
SK04.03.2020
SM04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
IS04.07.2020
PT29.07.2020
Former [2020/49]CZ04.03.2020
ES04.03.2020
FI04.03.2020
HR04.03.2020
LT04.03.2020
LV04.03.2020
NL04.03.2020
RO04.03.2020
RS04.03.2020
SE04.03.2020
SK04.03.2020
SM04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
IS04.07.2020
PT29.07.2020
Former [2020/48]ES04.03.2020
FI04.03.2020
HR04.03.2020
LT04.03.2020
LV04.03.2020
NL04.03.2020
RO04.03.2020
RS04.03.2020
SE04.03.2020
SM04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
IS04.07.2020
PT29.07.2020
Former [2020/47]ES04.03.2020
FI04.03.2020
HR04.03.2020
LT04.03.2020
LV04.03.2020
NL04.03.2020
RS04.03.2020
SE04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
IS04.07.2020
Former [2020/46]FI04.03.2020
HR04.03.2020
LV04.03.2020
NL04.03.2020
RS04.03.2020
SE04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
IS04.07.2020
Former [2020/45]FI04.03.2020
HR04.03.2020
LV04.03.2020
NL04.03.2020
RS04.03.2020
SE04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
Former [2020/39]FI04.03.2020
HR04.03.2020
LV04.03.2020
RS04.03.2020
SE04.03.2020
BG04.06.2020
NO04.06.2020
GR05.06.2020
Former [2020/38]FI04.03.2020
HR04.03.2020
LV04.03.2020
RS04.03.2020
SE04.03.2020
NO04.06.2020
GR05.06.2020
Former [2020/37]FI04.03.2020
HR04.03.2020
LV04.03.2020
RS04.03.2020
SE04.03.2020
NO04.06.2020
Former [2020/35]FI04.03.2020
NO04.06.2020
Documents cited:Search[A]JP2015044939  (SHINETSU CHEMICAL CO) [A] 1-6 * page 14; example 1; table 1 *;
 [A]JP2015048472  (HITACHI CHEMICAL CO LTD) [A] 1-6 * page 17; example 1; table 1 *;
 [A]US2016186024  (SUMITA KAZUAKI [JP], et al) [A] 1-6 * page 7; example 1; table 2 ** claim 1 *
by applicantJPH11289034
 JP2012209453
 JP2014229771
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.